Abstract: The present disclosure provides a heat dissipation module, a display device and an assembling method of the display device. In order to avoid the second windowing area from forming a sealed space during the defoaming treatment, an exhaust passage is formed between the second windowing area B and an edge of a heat dissipation film, and hot air formed in the second windowing area in a defoaming technology can be effectively released to the outside of the heat dissipation module through the exhaust passage, so that defects of the second windowing area can be effectively overcome, and increasing the attachment yield is facilitated.

Abstract: Methods and systems are provided for a power module. In one example, the power module may have a half-bridge configuration with electrical terminals arranged at opposite side of the power module, semiconductor chips arranged in a printed circuit board (PCB), a capacitor electrically coupled to the electrical terminals and arranged above and in contact with a top plate of the power module, and one or more connectors coupled to the PCB to couple the power module to external circuits. The power module may be directly cooled by flowing a coolant over the semiconductor chips.

Abstract: A control cabinet for at least one electrical drive controller includes a control cabinet housing a first cabinet compartment formed in the control cabinet housing and having at least one inlet opening for fresh air, at least one first transfer opening and a fresh air duct flow-connecting the inlet opening to the first transfer opening. A second cabinet compartment is formed in the control cabinet housing and has at least one outlet opening for exhaust air, at least one second transfer opening, and an exhaust air duct flow-connecting the outlet opening to the second transfer opening. A third cabinet compartment is formed in the control cabinet housing and is sealed off in terms of flow from the first cabinet compartment, the second cabinet compartment, and the environment outside the control cabinet.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.

Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Abstract: A receptacle assembly includes a heat sink assembly for a receptacle cage for dissipating heat from a pluggable module plugged into the receptacle cage. The heat sink assembly includes fin plates and spacer plates arranged in a plate stack independently movable for engaging and conforming to the pluggable module. Each spacer plate includes a thermal interface at a bottom of the spacer plate engaging the pluggable module. Each fin plate includes a thermal interface at a bottom of the fin plate engaging the pluggable module. The fin plates include branched fin plates and unbranched fin plates. Each of the unbranched fin plates are planar between the bottom and the distal end thereof. Each of the branched fin plates are non-planar and include at least one bend between the bottom and the distal end thereof.

Abstract: A power electronics unit may include a circuit board and a cooling device. The circuit board may include at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the circuit board. The cooling device may include at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet. The cooling device may further include at least one nozzle plate having at least one flow nozzle. The at least one nozzle plate may be arranged in and divide the at least one impingement jet chamber into an inlet chamber and an outlet chamber, which may be fluidically connected to one another via the at least one flow nozzle. The at least one flow nozzle may accelerate and conduct the cooling fluid towards the heat transfer region of the at least one electronic component.

Abstract: A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler, wherein the main cooler comprises a bearing surface which is configured to receive power modules, wherein the traction inverter comprises at least one molded power module, and wherein the main cooler forms a cooling connection which is configured to receive the molded power module on the main cooler.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: A display device includes a display panel, and a heat-dissipating member disposed on the display panel and including a conductive metal. The display device further includes a sound generator disposed on the heat-dissipating member and generating sound by vibrating the display panel and the heat-dissipating member. The display device additionally includes a display circuit board disposed on the heat-dissipating member. The heat-dissipating member includes openings and a first line formed in the openings, and the first line electrically connects the sound generator with the display circuit board.

Abstract: A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.

Abstract: The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.

Abstract: A thermal interface for discrete semiconductor devices (such as IGBT's) having a thermally conductive structure, a PCB populated with discrete electronic components, and each of the discrete semiconductor devices having a housing extending beyond the edge of the PCB and in a direction substantially parallel to a plane of the PCB, and a clamp bar secured to the thermally conductive structure adapted to compressively secure each housing to the thermally conductive structure and adapted to maintain thermal contact between a surface of each housing and the surface of the thermally conductive structure. A thermally conductive and electrically insulative pad is positioned between the semiconductor device housing and the thermally conductive structure. A casing enclosing the interface and PCB includes the thermally conductive structure formed on a backwall of the casing.

Abstract: An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

Abstract: The invention is directed to an arrangement for dissipating heat of an electronic component mounted on a circuit board. The arrangement includes a heat sink for dissipating heat of an electronic component. In order for bottom heat of the electronic component to be dissipated, at least one heat-dissipating heat conducting section is configured on the circuit board, wherein the heat sink is connected in a heat transmitting manner to the heat conducting section of the circuit board. The heat sink by way of a foot section bears directly on the heat conducting section of the circuit board. A recess is configured in the base body of the heat sink, wherein the electronic component lies at least partially in the recess.