Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

Abstract: The invention is directed to an arrangement for dissipating heat of an electronic component mounted on a circuit board. The arrangement includes a heat sink for dissipating heat of an electronic component. In order for bottom heat of the electronic component to be dissipated, at least one heat-dissipating heat conducting section is configured on the circuit board, wherein the heat sink is connected in a heat transmitting manner to the heat conducting section of the circuit board. The heat sink by way of a foot section bears directly on the heat conducting section of the circuit board. A recess is configured in the base body of the heat sink, wherein the electronic component lies at least partially in the recess.

Abstract: A heat dissipating module includes a heat dissipating substrate, a first structural plate, and a first heat conductive plate. The heat dissipating substrate has an inlet, an outlet, and a first container formed on a top surface of the heat dissipating substrate. The inlet and the outlet are communicated with the first container respectively. The first structural plate has a first channel member and is contained in the first container. The first channel member is communicated with the inlet and the outlet respectively. Heat dissipating liquid flows through the first channel member via the inlet, and flows out of the heat dissipating module via the outlet. The first heat conductive plate covers the first structural plate. The first heat conductive plate is in contact with a heat generating member for conducting heat energy generated by the heat generating member to the heat dissipating liquid.

Abstract: The invention relates to a module (1) in which voltages greater than 1,000 V and currents greater than 100 A are applied via supply lines, with an electrically insulating carrier (2), with a connection means (3) which has a material thickness greater than 0.3 mm and is connected to the carrier (2) via a metallization area (4) which is delimited by a first end (23) and a second end (24), with electronic components (19, 20) which are connected to the connection means (3) as required, and with cooling means (14). In order that the power is supplied from the outside via the connection means (3) directly to the module and thus the bonding processes that are customary in the prior art are omitted and parasitic inductances on the power supply are avoided, the invention proposes that the connection means (3) protrudes beyond one end (23, 24) of the metallization area (4) at least at one point, is not fixed to the carrier (2) in this area (9) and has contact means (22).

Abstract: A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

Abstract: The present disclosure provides an electrical connection apparatus which includes a receptacle and a plug. The receptacle includes a cage, a heat sink, a thermal interface material layer, and an elastic sheathing member. The heat sink is provided to the cage and has a base portion. The base portion has a lower surface, a first side edge close to the port, and a second side edge spaced apart from the first side edge. The heat sink further has two first convex portions positioned on the lower surface and adjacent to the first side edge and a first concave portion positioned on the lower surface and adjacent to the second side edge. The thermal interface material layer is provided to the lower surface of the base portion. The elastic sheathing member sheathes the heat sink and the cage. The plug includes a second convex portion positioned on an upper surface.

Abstract: Provided is a power converter which enables improved performance, and allows each of a semiconductor module and a capacitor module to be more reliably cooled. In a power converter, a capacitor module includes a capacitor module main body facing a cooling surface of a cooler, while being apart from the cooling surface, and a heat conductive member provided in the capacitor module main body. The capacitor module main body is connected to a semiconductor module via an N-side bus bar and a P-side bus bar. A heat radiation portion of the heat conductive member is thermally connected to the cooling surface at a position more distant from the semiconductor module than an end portion of the capacitor module main body which is closer to the semiconductor module.

Abstract: A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.

Abstract: A cooling apparatus for cooling a to-be-cooled device is described. The cooling apparatus includes a cabinet body configured to contain a cooling medium for at least partially immersing the to-be-cooled device, a volumeter for detecting a volume of the cooling medium in the cabinet body, and a storage tank storing the cooling medium. The storage tank and the cabinet body are communicatively connected to each other. Further, when the volumeter detects that the volume of the cooling medium in the cabinet body is lower than a preset volume, the storage tank and the cabinet body come into mutual communication so that the cooling medium in the storage tank is transferred into the cabinet body.

Abstract: A heat dissipating system and a power cabinet are provided. The heat dissipating system includes a cabinet, a first circulating fan and a heat exchanger. The cabinet has an outer circulating air duct and a sealed inner circulating air duct. The air inlet and the air outlet connected to the outside are arranged in the outer circulating air duct, and the heat exchanger is arranged in the cabinet and configured to exchange heat between the inner circulating air duct and the outer circulating duct. The first circulating fan is arranged outside the air inlet of the outer circulating air duct or arranged inside the outer circulating air duct, and configured to supply air to the outer circulating air duct. The heat dissipation efficiency of the inner circulating air duct is improved.

Abstract: An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a cold fluid intake and a warm fluid return, wherein each computing module of the plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of one or more of the bays of the plurality of bays; and a fluid circulation system positioned within the tray and coupled to the cold fluid intake and the warm fluid return of each of the bays, the fluid circulation system introducing, for each bay that a respective computing module is engaged with, fluid within the computing module via the cold fluid intake of each bay and returning warm fluid via the warm fluid return of each bay to transfer heat from the computing modules.

Abstract: In some implementations, a network device includes a housing and a set of switch cards within the housing and including a first set of connectors. A set of line cards within the housing includes a second set of connectors. The set of line cards are oriented orthogonally to the set of switch cards. A first set of power supplies and a second set of power supplies are in the housing. A midplane includes a plurality of circuit board assemblies arranged within the housing between the set of line cards and the first and second sets of power supplies to allow air to flow through the set of line cards to the set of switch cards, first set of power supplies, and second set of power supplies.

Abstract: A computing cooling system includes a chassis having chassis air inlet(s) and outlet(s). Heat dissipation device(s) thermally coupled to heat producing component(s) are located in the chassis adjacent the chassis air outlet(s). A first fan device located in the chassis adjacent the chassis air inlet(s) pulls first air from outside the chassis into the first fan device via the chassis air inlet(s), and pushes the first air though the heat dissipation device(s) and out of the chassis via the chassis air outlet(s). A second fan device located in the chassis adjacent the chassis air inlet(s) pulls second air from outside the chassis into the second fan device via the chassis air inlet(s), pushes a first portion of the second air past the heat dissipation device(s) and out of the chassis via the chassis air outlet(s), and pushes a second portion of the second air into the chassis.

Abstract: Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

Abstract: In one aspect, a device may include a housing, at least one processor within the housing, storage accessible to the at least one processor and within the housing, and plural heat absorbers within the housing that may be spherical. Each heat absorber may include an outer shell and inner material. The outer shell may include a shape-memory material. The inner material may include phase-change material different from the shape-memory material. The melting point of the phase-change material may be lower than the melting point of the shape-memory material. The heat absorbers may be juxtaposed with one or more other components of the device to absorb heat from the one or more other components.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.

Abstract: A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.

Abstract: A leakage prevention system including a cold plate is proposed in the current application. In one embodiment, a cold plate comprises an inlet port to receive cooling fluid from an external cooling source; an outlet port to return the cooling fluid back to the external cooling source; a sealing notch integrated with a sealing pad included in an outside layer of the cold plate; a nanoparticle channel disposed inside the outside layer; the nanoparticle channel is filled with a plurality of nanoparticles; a cooling area disposed inside the nanoparticle channel; the cooling area is to receive the cooling fluid from the inlet port, to exchange heat generated by an electronic device attached to the cold plate and carried by the fluid, and to return the cooling fluid via the outlet port; the plurality of nanoparticles in cooling fluid is used to detect a leakage of the cooling fluid.