Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.

Abstract: A device includes a first transistor, a second transistor, and a dielectric structure. The first transistor is over a substrate and has a first gate structure. The second transistor is over the substrate and has a second gate structure. The dielectric structure is between the first gate structure and the second gate structure. The dielectric structure has a width increasing from a bottom position of the dielectric structure to a first position higher than the bottom position of the dielectric structure. A width of the first gate structure is less than the width of the dielectric structure at the first position.

Abstract: A touch function setting method is provided. The method comprising: receiving a sequence parameter which includes multiple clicks, each of the clicks is corresponding to one of areas of a touch panel or screen; receiving a function parameter corresponding to the sequence parameter, the function parameter is corresponding to activate a function; and storing a group of touch function parameters, which includes the sequence parameter and the function parameter.

Abstract: A gaming system and an operation method of a gaming server thereof are provided. The gaming system includes multiple player devices and the gaming server. The gaming server establishes a network connection with the player devices. In response to one of the player devices initiating a game, the gaming server sends a game notification to the player devices according to a player list. The gaming server determines a common throughput between the player devices based on a response of each of the player devices to the game notification.

Abstract: A physiological signal measurement device is disclosed. In some implementations, the physiological signal measurement device includes a fixing element, a rack, a first sensor, and a second sensor. The fixing element is configured to be fixed on a limb of a user. The rack is configured to engage the fixing element and includes a first end and a second end distal to the first end. The first sensor is disposed on the first end of the rack. The sensor is disposed on the second end of the rack. The first end of the rack has a first stiffness, the second end of the rack has a second stiffness, and the first stiffness is higher than the second stiffness.

Abstract: An electronic device, a carrying buckle, and a carrying frame of a carrying buckle are provided. The carrying frame is integrally formed as a single one-piece structure and is insertable into a retaining case along an insertion direction for being fixed in the retaining case. The carrying frame includes a body segment, two buckling arms respectively extending from two opposite sides of the body segment, and an elastic structure that extends from the body segment. The elastic structure is elastically deformable when being pressed along the insertion direction, such that an abutting end of each of the two buckling arms has a displacement that allows the abutting end to be abutted against the retaining case.

Abstract: A light path folding element includes a first surface, a second surface, a first reflecting surface and a second reflecting surface. A light travels from the first surface into the light path folding element. The second surface is disposed relative to the first surface along a first direction and is parallel to the first surface, and the first direction is perpendicular to the first surface. The first reflecting surface connects the first surface and the second surface, an acute angle is formed between the first reflecting surface and the first surface, and the light forms an internal reflection via the first reflecting surface. The light forms another internal reflection via the second reflecting surface. The light path folding element further includes a light blocking structure, which extends from at least one of the first surface and the second surface into the light path folding element.

Abstract: A control method is in use of an interleaved power converter with first and second power stages for generating an output power source. A compensation is generated in response to a feedback signal and a reference voltage, and the feedback signal represents the output power source. The output power of the first power stage is controlled to supply to the output power source in response to the compensation signal. The operation status of the second power stage is switched in response to the compensation signal and the feedback signal, and is prevented from being switched when the feedback signal is beyond a stable range covering the reference voltage.

Abstract: An apparatus for estimating a fair value of a SPP includes a sunshine simulation system for generating a peak sun hour; a photovoltaic (PV) yield system for measuring a total power loss rate and generating an estimated energy-production-hours database; and a financial pricing system for generating a series of cash flows and discount factors. The financial pricing system computes a series of present values which are the product of the cash flows and the discount factors, and sums up all the present values to obtain an estimated value of the SPP. Since the apparatus for estimating SPP value takes the real power generation condition of the SPP and the real market economic condition into consideration, so that the apparatus can generate a pricing result even closer to the real market.

Abstract: An imaging lens assembly module includes an imaging lens element set, a lens carrier and a light blocking structure. The imaging lens element set has an optical axis. At least one lens element of the lens elements is disposed in the lens carrier. The light blocking structure includes a light blocking opening. The optical axis passes through the light blocking opening, and the light blocking opening includes at least two arc portions and a shrinking portion. Each of the arc portions has a first curvature radius for defining a maximum diameter of the light blocking opening. The shrinking portion is connected to the arc portions for forming the light blocking opening into a non-circular shape. The shrinking portion includes at least one protruding arc which extends and shrinks gradually from the shrinking portion to the optical axis, and the protruding arc has a second curvature radius.

Abstract: The present invention provides a display panel, including a backplane having flexibility, a first fixing member, a front frame having flexibility, and a display module provided between the backplane and the front frame. The backplane has a base plate with a first side. The first fixing member extends corresponding to the first side and has a first predetermined curvature. The first fixing member at least has a first wall body standing upright relative to the base plate, and the first fixing member is relatively fixed to the backplane, so that the curvature of the backplane can be adjusted corresponding to the first fixing member. The front frame is provided in a manner that extends correspondingly to the periphery of the backplane, and is relatively fixed to the backplane, so that the curvature of the front frame is relatively adapted to that of the backplane.

Abstract: An air-actuated power generating system includes a housing assembly mounted on an air storage device. An air compressor is disposed within the housing assembly and communicates with the air storage device to compress air into pressurized air and to transmit the pressurized air to the air storage device. A vane assembly is disposed on the housing assembly and is connected to the air compressor so as to be rotated by wind to drive operation of the air compressor. An air-actuated motor is connected to the air storage device. A power generator is connected to the air-actuated motor. The air-actuated motor is operable by the pressurized air discharged from the air storage device, thereby driving the power generator to generate electricity.

Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: A power converter to supply power to each phase of a three-phase motor includes a booster circuit connected to a DC power supply to boost an input voltage input from the DC power supply in response to a pulse width modulation boosting signal, an inverter connected to the booster circuit and including a three-phase switching circuit including switches, and an output connected to the three-phase switching circuit to supply power to each phase of the three-phase motor, and a controller to output the pulse width modulation boosting signal to the booster circuit and output the pulse width modulation boosting signal to the booster circuit when detecting that the booster circuit is in a boosted state.

Abstract: A thermoplastic vulcanizate is provided. The thermoplastic vulcanizate includes: (A) about 100 parts by weight of a styrene copolymer rubber; (B) about 40-90 parts by weight of a thermoplastic elastomer; (C) about 5-15 parts by weight of an interfacial compatible resin; and (D) about 0.2-3 parts by weight of a cross-linking formulation, wherein the content of component (A) is greater than the content of component (B). Component (A) is dispersed in component (B) in the form of particles with a particle size of about 0.5-10 ?m.

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a gate structure sandwiched between and in contact with a first spacer feature and a second spacer feature, a top surface of the first spacer feature and a top surface of the second spacer feature extending above a top surface of the gate structure, a gate self-aligned contact (SAC) dielectric feature over the first spacer feature and the second spacer feature, a contact etch stop layer (CESL) over the gate SAC dielectric feature, a dielectric layer over the CESL, a gate contact feature extending through the dielectric layer, the CESL, the gate SAC dielectric feature, and between the first spacer feature and the second spacer feature to be in contact with the gate structure, and a liner disposed between the first spacer feature and the gate contact feature.

Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a field plate. A gate structure overlies a substrate between a source region and a drain region. A drift region is disposed laterally between the gate structure and the drain region. A first dielectric layer overlies the substrate. A field plate is disposed within the first dielectric layer between the gate structure and the drain region. A conductive wire overlies the first dielectric layer and contacts the field plate. At least a portion of the conductive wire directly overlies a first sidewall of the drift region.

Abstract: An imaging lens assembly has an optical axis, and includes a plastic carrier element and an imaging lens element set. The plastic carrier element includes an object-side surface, an image-side surface, an outer surface and an inner surface. The object-side surface includes an object-side opening. The image-side surface includes an image-side opening. The inner surface is connected to the object-side opening and the image-side opening. The imaging lens element set is disposed in the plastic carrier element, and includes at least three lens elements, each of at least two adjacent lens elements of the lens elements includes a first axial assembling structure, the first axial assembling structures are corresponding to and connected to each other. A solid medium interval is maintained between the adjacent lens elements and the inner surface. The solid medium interval is directly contacted with the adjacent lens elements and the inner surface.