Abstract: A method and system for predicting upgrade completion times in hyper-converged infrastructure (HCI) environments. Specifically, the method and system disclosed herein entail applying machine learning to forecast these upgrade completion times based on select static and dynamic indicators deduced to significantly impact the performance of upgrade processes across node clusters in HCI environments.

Abstract: An epitaxial light emitting structure includes n-type and p-type semiconductor layers, and a light emitting component disposed therebetween. The light emitting component includes a multiple quantum well structure which contains a plurality of first periodic layered elements, each of which includes first, second and third layers alternately stacked on one another. For each of the first periodic layered elements, the first, second and third layers respectively have a first energy bandgap (Eg1), a second energy bandgap (Eg2), and a third energy bandgap (Eg3) that satisfy a relationship of Eg1<Eg2<Eg3. Also disclosed herein is a light emitting diode which includes the aforementioned epitaxial light emitting structure.

Abstract: Various approaches described herein improve the quality of results when fusing depth maps to generate dynamic three-dimensional (“3D”) models, applying texture details to dynamic 3D models, or rendering views of textured, dynamic 3D models. For example, when fusing depth maps to generate a dynamic 3D model, a fusion component can also incorporate intrinsic color values for points of the dynamic 3D model, potentially making the dynamic 3D model more accurate, especially for areas in which depth values are not reliable or not available. As another example, when applying texture details, a rendering component can apply smoothed, viewpoint-dependent texture weights to texture values from different texture maps, which can reduce blurring and avoid the introduction of noticeable seams. As another example, a rendering component can apply special effects indicated by metadata to rendered views, thereby allowing a content provider to assert artistic control over presentation.

Abstract: A spiky metal organic framework is provided in the present disclosure. The spiky metal organic framework is formed by a coordination reaction between at least one metal ion and an organic ligand, and includes a body and a plurality of spike-like structures. The body is a spherical shape, and a particle size of the body is 1 ?m to 3 ?m. The spike-like structures are distributed on a surface of the body, a diameter of each spike-like structure is 15 nm to 35 nm, and a length of each spike-like structure is 250 nm to 400 nm.

Abstract: A miniature optical lens assembly, which has at least one optical element, includes the optical element. The optical element includes a low reflection layer disposed on at least one surface of the optical element. The low reflection layer includes a plurality of nanocrystalline grains, and the nanocrystalline grains are located on one surface of the low reflection layer. The optical element is at least one of a light blocking element, an annular spacer element and a barrel element.

Abstract: A cable management assembly includes a cable management device and a supporting device. Two engaging members are arranged on one of the cable management device and the supporting device. Amounting member is arranged on the other one of the cable management device and the supporting device. The mounting member is detachably connected to one of the two engaging members.

Abstract: Systems and methods for operation of a medical device may include at least two sensors to confirm a command to control a medical instrument is intentionally made by an operator. The systems may include an operator-detection sensor associated with an input device and configured to detect a presence of an operator at the input device. The systems may also include a motion sensor associated with the input device and configured to detect a displacement distance of the input device. A control unit may use a displacement threshold for the input device and may be configured to permit or prevent control signal generation based on feedback from the at least two sensors.

Abstract: A cable management device of a connecting assembly includes a connecting member, a component and a cable management arm. The component is connected to the connecting member. The cable management arm is connected to the component in a stretchable and retractable manner. At least one cable management feature is arranged on the cable management arm.

Abstract: A cable management assembly includes a cable management device and a supporting device. The cable management device includes a first arm, a second arm and an intermediate frame being mounted between the first arm and the second arm. The intermediate frame includes a first mounting feature. The supporting device is configured to support one of the first arm, the second arm and the intermediate frame. The supporting device includes a base and an elastic member being arranged at the base. The elastic member has a second mounting feature configured to be detachably mounted to the first mounting feature.

Abstract: Systems and methods of generating electrical power for a portable electronic device from a photovoltaic power system are described herein. In some embodiments, a photovoltaic module comprises an interior surface and an exterior surface. The interior photovoltaic cells may be disposed in photovoltaic stripes on the interior surface and exterior photovoltaic cells may be disposed on the exterior surface. Substantially opaque materials are employed to provide a photovoltaic-powered portable electric device with an improved appearance.

Abstract: A shielding member includes a frame body and an outer cover. Two sides of a first end of the frame body respectively include a first shaft portion. Two sides of the frame body respectively include a first side plate. The frame body is covered by the outer cover. Two sides of a first end of the outer cover respectively include a second shaft portion, and each of the second shaft portions is pivotally connected to the corresponding first shaft portion. Two sides of the outer cover respectively include a second side plate, and each of the second side plates covers an outer side of the corresponding first side plate. Accordingly, the frame body and the outer cover are assembled to form a one-piece metallic shielding member. The structure of the shielding member is simple, the manufacturing for the shielding member is easy, and the cost for manufacturing the shielding member is reduced.

Abstract: A single-row electrical wire structure includes a first circuit board and a wire assembly. A board-to-board connector is on the first circuit board. The first circuit board includes a first group of contacts arranged into a single row. A distance between center portions of adjacent two contacts of the first group of contacts forms a width. The wires assembly includes a plurality of high-speed signal pairs and at least one low-speed signal pair respectively connected to the first group of contacts. A first spacing between a contact in the first group of contacts corresponding to a first high-speed signal pair of the high-speed signal pairs and a contact in the first group of contacts corresponding to a second high-speed signal pair of the high-speed signal pairs adjacent to the first high-speed signal pair is at least equal to or greater than 2 times of the width.

Abstract: A miniature optical lens assembly, which has at least one of optical element, includes the optical element. The optical element includes a low reflection layer disposed on at least one surface of the optical element. The low reflection layer includes a plurality of nanocrystalline grains, and the nanocrystalline grains are located on one surface of the low reflection layer. The optical element is at least one of a light blocking element, an annular spacer element and a barrel element.

Abstract: A mobile device includes sensors and a processor. The sensors are disposed on opposite edges of the mobile device respectively. The processor is configured to collect a first data set labeled with a right hand holding gesture, collect a second data set labeled with a left hand holding gesture, establish a determination model associated with the first data set and the second data set, and in response to the processor collects a third data set comprising the holding positions and the force values detected by the sensor, determine a current holding gesture according to the third data set in reference to the determination model.

Abstract: A pixel array with a gate driver and a matrix sensor array are provided. The pixel array includes at least one pixel unit and a gate driver. The pixel unit includes a pixel circuit and an open area. The pixel circuit includes a thin film transistor (TFT) and a physical quantity conversion device. The TFT includes gate terminal, source terminal, and drain terminals. The source terminal is coupled to a corresponding data line. The physical quantity conversion device is coupled to the drain terminal of the TFT. The gate driver is disposed in a corresponding pixel unit and a scan line outputted by the gate driver is coupled to the gate terminal in the corresponding pixel unit. The gate driver is disposed adjacent to one of the at least one pixel unit. The gate driver is controlled by a gate control signal to drive the at least one pixel unit.

Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.

Abstract: A disc motor uses first, second magnetic components and third, fourth magnetic components of first, second magnetic disc set of a magnetic set to carry out magnetization in the motion direction, a coil of a coil set of an induction set is arranged perpendicularly to the motion direction, so as to form a four magneto-mechanical force effect; poles of the first, second magnetic components and the third, fourth magnetic component of the first, second magnetic disc sets are arranged oppositely to each other if they are different in polarity and adjacently to each other if they are the same in polarity; with the switching of forward reverse circuit power supplies of an induction switch circuit, magnetic resistant force can be avoided, the whole motion process is magnetically assisted, input power can be reduced effectively, and output power is increased.

Abstract: A pixel array with a gate driver and a matrix sensor array are provided. The pixel array includes at least one pixel unit and a gate driver. The pixel unit includes a pixel circuit and an open area. The pixel circuit includes a thin film transistor (TFT) and a physical quantity conversion device. The TFT includes gate terminal, source terminal, and drain terminals. The source terminal is coupled to a corresponding data line. The physical quantity conversion device is coupled to the drain terminal of the TFT. The gate driver is disposed in a corresponding pixel unit and a scan line outputted by the gate driver is coupled to the gate terminal in the corresponding pixel unit. The gate driver is disposed adjacent to one of the at least one pixel unit. The gate driver is controlled by a gate control signal to drive the at least one pixel unit.

Abstract: Embodiment described herein provide a thermal treatment process following a high-pressure anneal process to keep hydrogen at an interface between a channel region and a gate dielectric layer in a field effect transistor while removing hydrogen from the bulk portion of the gate dielectric layer. The thermal treatment process can reduce the amount of threshold voltage shift caused by a high-pressure anneal. The high-pressure anneal and the thermal treatment process may be performed any time after formation of the gate dielectric layer, thus, causing no disruption to the existing process flow.

Abstract: A flexible circuit board including at least two electrical conducting layers, at least two non-electrical conducting layers, and at least one adhesion layer is provided. The non-electrical conducting layers are disposed between the electrical conducting layers. The non-electrical conducting layers are adhered together via the adhesion layer. A sum of thickness of the non-electrical conducting layers is greater than 4 mil, and there is no electrical conducting layer sandwiched between the at least two non-electrical conducting layers.