Abstract: A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed. on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.

Abstract: A light-emitting diode package includes a redistribution layer, a light-emitting diode, a first dielectric layer, a plurality of wavelength conversion structures, and a transparent encapsulant. The light-emitting diode is disposed on and electrically connected to the redistribution layer. The light-emitting diode includes a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode. The first dielectric layer is disposed on the redistribution layer and covers the light-emitting diode. The wavelength conversion structures are disposed on the first dielectric layer and respectively in contact with the second light-emitting diode and the third light-emitting diode. The transparent encapsulant is disposed on the first dielectric layer and covers the plurality of wavelength conversion structures. In addition, a manufacturing method of the light-emitting diode package is provided.

Abstract: A single-row electrical wire structure includes a first circuit board and a wire assembly. A board-to-board connector is on the first circuit board. The first circuit board includes a first group of contacts arranged into a single row. A distance between center portions of adjacent two contacts of the first group of contacts forms a width. The wires assembly includes a plurality of high-speed signal pairs and at least one low-speed signal pair respectively connected to the first group of contacts. A first spacing between a contact in the first group of contacts corresponding to a first high-speed signal pair of the high-speed signal pairs and a contact in the first group of contacts corresponding to a second high-speed signal pair of the high-speed signal pairs adjacent to the first high-speed signal pair is at least equal to or greater than 2 times of the width.

Abstract: A method for fabricating p-type field effect transistor (FET) includes the steps of first providing a substrate, forming a pad layer on the substrate, forming a well in the substrate, performing an ion implantation process to implant germanium ions into the substrate to form a channel region, and then conducting an anneal process to divide the channel region into a top portion and a bottom portion. After removing the pad layer, a gate structure is formed on the substrate and a lightly doped drain (LDD) is formed adjacent to two sides of the gate structure.

Abstract: An estimation method suitable for a receiver and includes the following steps: calculating a relative signal-to-noise ratio, and determining whether the relative signal-to-noise ratio is higher than, lower than or within a threshold range; in response to determining that the relative signal-to-noise ratio is higher than the threshold range, estimating the signal quality indicator as a first preset value, wherein the first preset value represents a best signal quality; in response to determining that the relative signal-to-noise ratio is higher than the threshold range, estimating the signal quality indicator as a first preset value, wherein the first preset value represents a best signal quality; in response to determining that the relative signal-to-noise ratio is within the threshold range, estimating the signal quality indicator as an output value of a function according to a bit error rate, wherein an input value of the function is the relative signal-to-noise ratio.

Abstract: A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.

Abstract: An IV set includes an IV component and a duration monitor device coupled to the IV component. The duration monitor device may include an indicator portion configured to change color after a determined amount of time upon activation of the indicator portion, or an RFID tag configured to be detected by an RFID reader. The duration monitor is configured to provide an indication of passage of a useful-life time period for the IV set or the IV component. Methods of operating a duration monitor device are also provided.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: A portable nebulizer and a vertical-type medicine containing and nebulizing assembly thereof are provided. The vertical-type medicine containing and nebulizing assembly includes a medicine storage module, a nebulizing module and an induction module. The nebulizing module includes a nebulizing device and a first conductive structure. The induction module includes a metal induction element disposed in the medicine storage module and a second conductive structure electrically connected to the metal induction element. The medicine storage casing has an inner surrounding area located in the medicine storage space. The metal induction element has an exposed induction portion exposed on the inner surrounding area for receiving a signal generated by the nebulizing device. Therefore, when a predetermined medicinal liquid contained in the medicine storage space is nebulized through the nebulizing device, the signal generated by the nebulizing device can be transmitted to a microprocessor through the induction module.

Abstract: An optical lens assembly includes a lens barrel and an optical lens group. The lens barrel includes a light entering hole, which is configured for allowing a light to enter the lens barrel. The lens barrel accommodates the optical lens group, and an optical axis passes through the optical lens group. The optical lens group includes a plurality of lens elements and at least one light blocking sheet. The light blocking sheet is an opaque sheet-shaped element and surrounds the optical axis to form a light passing hole. The light blocking sheet includes an object-side surface and an image-side surface, and the object-side surface is located more adjacent to the light entering hole than the image-side surface thereto. A first film layer is disposed on the object-side surface.

Abstract: A magnetic component includes a magnetic body and a coil. The magnetic body includes an inner leg, at least one outer leg, a first bottom portion and a second bottom portion. The inner leg and the at least one outer leg protrude from the first bottom portion and the second bottom portion. A cross-sectional area of the inner leg is larger than a total cross-sectional area of the at least one outer leg. The coil is wound around the inner leg.

Abstract: A semiconductor light emitting device includes an epitaxial light emitting structure that includes a light emitting component. The light emitting component includes a multiple quantum well structure which contains a plurality of first periodic layered elements, each of which includes first, second and third layers alternately stacked on one another. For each of the first periodic layered elements, the first, second and third layers respectively have first, second and third energy bandgaps (Eg1, Eg2, Eg3) that satisfy a relationship of Eg1<Eg2<Eg3. The third layer has a thickness smaller than that of the first layer. Also disclosed herein is another embodiment of the aforementioned semiconductor light emitting device.

Abstract: An imaging optical system includes an infrared light absorbing element, an infrared light reducing film and a plate element in order along a paraxial path. The infrared light absorbing element is made of an infrared light absorbing plastic material, and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an image surface of the imaging optical system than an incident surface of the infrared light absorbing element to the image surface of the imaging optical system. The plate element is disposed between the infrared light reducing film and the image surface, the plate element includes a translucent portion, a holder portion and a taper structure coating. The taper structure coating is disposed on at least one of an incident surface and an exit surface of the translucent portion.

Abstract: A slide rail assembly includes a rail member ad a bracket device. The bracket device can be displaced with respect to the rail member and is provided with a first structure. The rail member is provided with a second structure. When the bracket device is at a predetermined position with respect to the rail member, the first structure and the second structure are blocked by each other to prevent the bracket device from being displaced with respect to the rail member in either of a first direction and a second direction.

Abstract: A fluid storage tank can be configured to store a cooling fluid in a liquid state and a gas state. A first heat exchanger can be configured to release heat into the fluid storage tank. A second heat exchanger can be disposed fluidly downstream of the fluid storage tank and configured to exchange heat between the cooling fluid and a heat load. A pressure control device can be disposed fluidly downstream of the second heat exchanger. The first heat exchanger can be fluidly downstream of the second heat exchanger such that cooling fluid, after being heated in the second heat exchanger, passes through the first heat exchanger and thereby heats upstream cooling fluid resident in the fluid storage tank.

Abstract: A method and a system for stacking printed circuit boards includes providing a lower baseboard, a pinboard, and an upper baseboard; printing a first solder paste on the lower baseboard; placing a placement component on the lower baseboard; placing the pinboard on the lower baseboard; reflow soldering the lower baseboard with the placement component and the pinboard and forming a first assembly; printing the first solder paste and a second solder paste on the upper baseboard; placing the placement component on the upper baseboard and the first assembly on the upper baseboard; and reflow soldering the upper baseboard with the placement component and the first assembly and forming a printed circuit board; a melting point of the first solder paste is higher than a melting point of the second solder paste.

Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.

Abstract: A nebulizer assembly and an airflow-guiding component thereof are provided. The airflow-guiding component includes an air-guiding part and a structural matching part. The air-guiding part includes a first hollow tube body, a second hollow tube body, and an air-guiding structure connected between the first hollow tube body and the second hollow tube body. The structural matching part is connected to the first hollow tube body. The air-guiding structure has a plurality of rear main air-introducing channels surrounding the first hollow tube body, and each of the plurality of rear main air-introducing channels has a rear main air-introducing opening perpendicular or inclined to the structural matching part. Therefore, external air outside the airflow-guiding component can be guided into the rear air-guiding channel through the plurality of rear main air-introducing channels.

Abstract: An isolated converter includes an input circuit, a transformer, a first switch, a second switch and a snubber circuit. The input circuit includes at least two input capacitors, and is configured to provide an input voltage. A divider node is arranged between the at least two input capacitors. The transformer includes a primary winding and a secondary winding to generate an output voltage on the secondary winding according to the input voltage. The primary winding of the transformer is electrically connected between the first switch and the second switch. The snubber circuit is electrically connected between the first switch and the second switch, and forms a discharge path with the primary winding. The snubber circuit is configured to receive a reflected voltage from the secondary winding back to the primary winding, and the divider node is connected to the discharge path.

Abstract: An optical imaging lens assembly includes at least one optical lens element. The optical lens element includes an anti-reflective coating, and the anti-reflective coating is arranged on at least one surface of the optical lens element. The anti-reflective coating includes a high-low refractive coating and a gradient refractive coating, and the high-low refractive coating is arranged between the optical lens element and the gradient refractive coating. The high-low refractive coating includes at least one high refractive coating layer and at least one low refractive coating layer, which are stacked in alternations. The low refractive coating layer is in contact with the optical lens element. The gradient refractive coating includes a plurality of holes, and the holes away from the optical lens element are relatively larger than the holes close to the optical lens element.