Abstract: A light emitting diode (LED) array may include an epitaxial layer comprising a first pixel and a second pixel separated by an isolation region. A reflective layer may be formed on the epitaxial layer. A p-type contact layer may be formed on the reflective layer. The isolation region may have a width that is at least a width of a trench formed in a p-type contact layer.

Abstract: A transmission system includes a first security unit coupling to application ends, a second security unit coupling to a user end, and a server. The server sends a first attribute key to the first security unit based on attributes of the application ends and sends a second attribute key to the second security unit based on attributes of the user end. To enable one application end, the first security unit encrypts a session key with the first attribute key, opens a socket, and sends the encrypted session key to the server. When the second security unit receives a request for the application end, the server sends the encrypted session key to the second security unit. The second security unit decrypts the encrypted session key with the second attribute key and connects to the socket. The second security unit interchanges information with the first security unit via the session key.

Abstract: A method includes forming a first channel region and a first gate structure formed over the first channel region. A first source/drain region is formed adjacent the first channel region and the first source/drain region includes a crystalline structure doped with a first dopant. A first silicide is formed over the first source/drain region. The first source/drain region includes a first concentration of the first dopant between 2.0×1021 atoms per centimeter cubed and 4.0×1021 atoms per centimeter cubed at a depth of 8 to 10 nanometers.

Abstract: A method includes receiving a semiconductor wafer into a chamber; generating a plasma within the chamber to accelerate particles toward the semiconductor wafer; generating a magnetic field above the semiconductor wafer by an electromagnetic structure contained within the chamber, wherein the electromagnetic structure comprises a plurality of electromagnetic elements; and adjusting the magnetic field, wherein the adjusting of the magnetic field includes moving positions of each of the plurality of electromagnetic elements independently.

Abstract: A method for etching an etch layer formed on a front side of a wafer and a wafer etching apparatus are provided. The wafer etching apparatus includes a first flow channel, a temperature-regulating module, and a second flow channel. The first flow channel is configured to carry a preheated/precooled liquid for controlling a temperature of a wafer. The temperature-regulating module is coupled to the first flow channel. The temperature-regulating module is configured to control a temperature of the liquid in the first flow channel. The second flow channel is configured to carry an etchant for etching an etch layer formed on a front side of the wafer. The method includes: controlling the temperature of the wafer by using the preheated/precooled liquid; and etching the etch layer with the etchant.

Abstract: A bracket device includes a supporting frame, a bracket, an elastic member and a fastening member. The bracket is movably connected to the supporting frame. The elastic member is mounted to the supporting frame. The fastening member is connected to the elastic member. When the bracket is located at a first position relative to the supporting frame, the fastening member is in a locking state. When the bracket is located at a second position relative to the supporting frame, the fastening member is in an unlocking state.

Abstract: A power bank has a station and a plurality of battery modules. Each of the battery modules can be positioned in a corresponding slot of the station in a pluggable way and is electrically connected to a charging-discharging control circuit of the station. When a main charging port of the station is electrically connected to a power supply, the charging-discharging control circuit receives electric power from the power supply via the main charging port and uses the received electric power to charge rechargeable batteries of the battery modules. When a main discharging port of the station is electrically connected to an electronic apparatus, the charging-discharging control circuit receives electric power from the rechargeable batteries of the battery modules so as to provide electric power to the electronic apparatus.

Abstract: A power bank has a station and a plurality of battery modules. When the battery modules are stacked on the station, rechargeable batteries of the battery modules are electrically connected in parallel. When a charging port of the station is electrically connected to an external power supply, a charging-discharging control circuit of the station receives electric energy from the external power supply via the charging port and uses the received electric energy to charge the rechargeable batteries. When a discharging port of the station is electrically connected to an external electronic device, the charging-discharging control circuit transfers electric energy received from the rechargeable batteries to the external electronic device. Each of the battery modules is replaceable, and the total number of the battery modules of the power bank is adjustable.

Abstract: Provided are a high temperature and chloride corrosion resistant NiCrTiAlSi/La2O3 coating at a flue gas side of a waste incineration power generating boiler and a preparation method thereof. The method comprises the following steps: (1) preparing a composite powder; (2) uniformly grinding the composite powder to obtain a spherical composite powder, then drying the spherical composite powder; (3) cleaning and roughening a surface of a substrate; (4) using a thermal spraying technique to spray a primer layer on a heating surface; (5) using a thermal spraying technique to spray the spherical composite powder onto the primer layer; and (6) cooling. The coating obtained by the method comprises a composite coating spray-coated on a surface of the primer layer. A rare element in the form of La2O3 is added to the coating to purify a grain boundary of the coating.

Abstract: Embodiment described herein provide a thermal treatment process following a high-pressure anneal process to keep hydrogen at an interface between a channel region and a gate dielectric layer in a field effect transistor while removing hydrogen from the bulk portion of the gate dielectric layer. The thermal treatment process can reduce the amount of threshold voltage shift caused by a high-pressure anneal. The high-pressure anneal and the thermal treatment process may be performed any time after formation of the gate dielectric layer, thus, causing no disruption to the existing process flow.

Abstract: The electric motor includes at least two opposing magnet sets, at least a coil assembly, and a detection switch circuit. Each magnet set includes at least a magnet whose poles are arranged perpendicular to the movement of the magnet. The magnets in a same magnet set are stacked and have poles on a same side of reversed polarities. Opposing magnets from neighboring magnet sets have facing poles of a same polarity. The coil assembly is disposed between neighboring magnet sets, and axially parallel to an alignment direction between the facing poles of opposing magnets. Each coil assembly includes a magnetizer wrapped in a winding. Yokes are extended from two ends of the magnetizer towards opposite directions and a specific distance is between the yokes' centers. Together with the detection switch circuit's switching between positive and negative power supplies, the electric motor effectively reduces input power, and increases output power.

Abstract: A nebulizer includes a nebulizer main body, an atomization module, a mouthpiece, a signal transmitter and a signal sensor. The atomization module is disposed in the nebulizer main body, and has a plurality of atomization holes. The mouthpiece is disposed on the nebulizer main body, and has an opening corresponding to the plurality of atomization holes. The signal transmitter provides a sensing signal toward the plurality of atomization holes of the atomization module. The signal sensor corresponds to the signal transmitter. The sensing signal passes through or is reflected by the atomization module, so as to produce a clogging rate signal. The signal sensor then receives the clogging rate signal to determine the clogging rate of the plurality of atomization holes.

Abstract: A nebulizer utilizing a nozzle assembly includes a main conduit and an air pressure duct. The main conduit is disposed on the nebulizer and has an inner surface and an outer surface. The main conduit has an atomizing opening. The air pressure duct is disposed on one of the inner surface and the outer surface of the main conduit, and the has a connecting opening connected to the sensor and a detecting opening that is exposed and adjacent to the atomizing opening. The sensor is disposed inside the nebulizer and determines a pressure change of the atomizing opening by detecting the pressure of the detecting opening. The nebulizer includes an atomizing module and a controlling module electrically connected to the atomizing module and the sensor, and the controlling module determines whether the atomizing module should be turned on based on the pressure change of the atomizing opening detected by the sensor.

Abstract: A slide rail assembly includes a first rail, a second rail, a third rail, a first supporting assembly and a sliding auxiliary assembly. The first supporting assembly is arranged on the first rail for supporting the second rail. The sliding auxiliary assembly is movably mounted on the second rail, and includes a plurality of balls for supporting the third rail.

Abstract: A bracket device includes a bracket and a fastening member. The fastening member is pivoted to the bracket by a shaft member. The bracket includes a first structure and the fastening member includes a second structure. When the fastening member is located at a position, the first structure is in cooperation with the second structure, so as to prevent the fastening member from moving along an axis direction of the shaft member.

Abstract: An integrated circuit memory device, in one embodiment, includes a substrate having a plurality of bit lines. A first and second inter-level dielectric layer are successively disposed on the substrate. Each of a plurality of source lines and staggered bit line contacts extend through the first inter-level dielectric layer. Each of a plurality of source line vias and a plurality of staggered bit line vias extend through the second inter-level dielectric layer to each respective one of the plurality of source lines and the plurality of staggered bit line contacts. The source lines and staggered bit line contacts that extend through the first inter-level dielectric layer are formed together by a first set of fabrication processes. The source line vias and staggered bit line contacts that extend through the second inter-level dielectric layer are also formed together by a second set of fabrication processes.

Abstract: The present invention provides a device for separating and purifying the collagen Type 2 in chicken bones, comprising a liquid fluid container, a raw liquid container, a membrane separation tank, a mixing tube, two high pressure metering motors, a precooler, two preheaters, a temperature controller, two one-way valves, two inlet control valves and two outlet control valves. The liquid extract of defatted chicken bones discharged from the raw liquid container and the liquid CO2 discharged from the liquid fluid container can be mixed uniformly in the mixing tube, and then fed into the membrane separation tank. The membrane separation tank produces small-molecular-weight peptides and large-molecular-weight collagen Type 2 harmlessly and efficiently.

Abstract: A flip-chip light emitting device includes: a light-emitting epitaxial laminated layer with two opposite surfaces, in which, the first surface is a light-emitting surface; a first electrode and a second electrode that are separated from each other on the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with two opposite surfaces and two side walls connecting those two surfaces, in which, the first surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; a first external electrode and a second external electrode on the second surface of the non-conductive substrate, which extend to the side walls of the non-conductive substrate till and at least cover parts of the side walls of the first and the second electrodes to form electrical connection.

Abstract: A disc motor uses first, second magnetic components and third, fourth magnetic components of first, second magnetic disc set of a magnetic set to carry out magnetization in the motion direction, a coil of a coil set of an induction set is arranged perpendicularly to the motion direction, so as to form a four magneto-mechanical force effect; poles of the first, second magnetic components and the third, fourth magnetic component of the first, second magnetic disc sets are arranged oppositely to each other if they are different in polarity and adjacently to each other if they are the same in polarity; with the switching of forward reverse circuit power supplies of an induction switch circuit, magnetic resistant force can be avoided, the whole motion process is magnetically assisted, input power can be reduced effectively, and output power is increased.

Abstract: Systems and methods for improving doping and/or deposition uniformity using a tunable electromagnetic field generation device are provided. In an exemplary embodiment, the system includes a chamber configured to contain a semiconductor wafer, a plasma generator, and a gas inlet, and an exhaust gas outlet. The gas inlet permits a controlled flow of a gas into the chamber through a wall of the chamber and the exhaust gas outlet permits exhausting of gas from the chamber. The system further includes a wafer support structure configured to support the semiconductor wafer during a doping or deposition process and an electromagnetic structure positioned within the chamber and at least partially surrounding an upper surface of the wafer support structure.