Abstract: An integrated apparatus for chemical precipitation and rapid filtration of water samples. The invention relates to an apparatus for chemical precipitation and filtration of water samples. The integrated apparatus includes a reaction vessel, a lid of reaction vessel, a opening for reagent addition and gas leakage, an aerating tube, a support, a liquid phase remover, a solid phase collector, a control cover of the liquid phase remover, and a control cover of the solid phase collector.

Abstract: A device includes a first channel region and a first gate structure formed over the first channel region. A first source/drain region is adjacent the first channel region and the first source/drain region includes a crystalline structure doped with a first dopant. A first silicide is formed over the first source/drain region. The first source/drain region includes a first concentration of the first dopant between 2.0×1021 atoms per centimeter cubed and 4.0×1021 atoms per centimeter cubed at a depth of 8 to 10 nanometers. A gradient of decreasing concentration of the first dopant is one decade for every 5.5 to 7.5 nanometers deeper than the first concentration.

Abstract: A display device includes a first display unit, a first selecting switch, a first block switch, a first selecting gate line, a second display unit, a second selecting switch, a second block switch, a second selecting gate line, and a block gate line. The first selecting gate line is configured to provide a first selecting gate signal to a control end of the first selecting switch. The second selecting gate line is configured to provide a second selecting gate signal to a control end of the second selecting switch. The block gate line is configured to provide a block gate signal to a control end of the first block switch and a control end of the second block switch.

Abstract: A method for forming a semiconductor device is disclosed. A p-type field-effect transistor (p-FET) is formed on a semiconductor substrate. A dielectric layer is formed on the semiconductor substrate and completely covers the p-FET. At least an opening is formed in the dielectric layer and exposes a source/drain region of the p-FET.

Abstract: A nebulization structure includes a carrier unit, a vibration unit, a nebulization unit and a position-limiting unit. The carrier unit has a first carrier portion and a first surrounding portion extended from an outer perimeter of the first carrier portion, and the first carrier portion has a through hole. The vibration unit includes an annular vibrating sheet disposed on the carrier unit. The nebulization unit is disposed on the first carrier portion, and the nebulization unit has a plurality of micro holes communicated with the through hole. The position-limiting unit has a first position-limiting portion disposed on the nebulization unit and a second position-limiting portion extended from an outer perimeter of the first position-limiting portion and along the first surrounding portion. The nebulization unit is positioned between the first carrier portion and the position-limiting unit, and the first position-limiting portion has an opening for exposing the micro holes.

Abstract: A modular power supply including a voltage regulator configured to output a voltage, a first output configured to connect to a device under test and output the voltage from the regulator, a microcontroller connected to the voltage regulator, and an interface configured to connect to a test and measurement instrument. The interface includes an input configured to receive power from the test and measurement instrument and a second output configured to output a signal characteristic of the first output.

Abstract: Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.

Abstract: A semiconductor substructure with an improved source/drain structure is described. The semiconductor substructure can include an upper surface; a gate structure formed over the substrate; a spacer formed along a sidewall of the gate structure; and a source/drain structure disposed adjacent the gate structure. The source/drain structure is disposed over or on a recess surface of a recess that extends below said upper surface. The source/drain structure includes a first epitaxial layer, having a first composition, over or on the interface surface, and a subsequent epitaxial layer, having a subsequent composition, over or on the first epitaxial layer. A dopant concentration of the subsequent composition is greater than a dopant concentration of the first composition, and a carbon concentration of the first composition ranges from 0 to 1.4 at.-%. Methods of making semiconductor substructures including improved source/drain structures are also described.

Abstract: A slide rail assembly includes a first rail, a second rail and a third rail. The second rail is movably mounted between the first rail and the third rail. The second rail and the third rail are movable relative to the first rail. The second rail and the third rail are detachable from the first rail.

Abstract: A display control device includes a detector, a frequency adjusting signal generator, a clock generator and an output timing generator. The detector compares an input field reference signal with an output field reference signal to determine a time difference signal. The frequency adjusting signal generator outputs a frequency adjusting signal. The clock generator outputs a clock according to the frequency adjusting signal. The output timing generator generates an output field synchronization signal according to the clock. The clock generator adjusts the frequency of the clock according to the frequency adjusting signal.

Abstract: A slide rail assembly includes a first rail, a second rail, a third rail, a synchronization member and a fastening member. The third rail is movably mounted between the first and second rails. The synchronization member and the fastening member are movably mounted to the third rail. The synchronization member is configured to engage with the second rail, such that the second and third rails can be synchronously moved relative to the first rail along an opening direction. When the second and third rails are moved to a first predetermined position, the synchronization member is disengaged from the second rail. When the third rail is moved from the first predetermined position to a second predetermined position along the opening direction, the third rail is fastened to the first rail by the fastening member to prevent the third rail from being moved relative to the first rail along a retracted direction.

Abstract: A slide rail assembly includes a first rail, a second rail, a blocking structure and a locking member. The second rail is movable relative to the first rail. The blocking structure is mounted to the first rail. The locking member is movably mounted to the second rail and configured to abut against the blocking structure, in order to prevent the second rail from being moved relative to the first rail from a retracted position along an opening direction.

Abstract: A slide rail assembly includes a rail, a moving rail, and a damping device. When the moving rail is moved relative to the rail, the damping device is pushed by the moving rail to provide damping effect.

Abstract: A handle device adapted to be mounted to a container including a base defining a space, and a cover openably mounted to the base to cover the receiving space. The cover is formed with a through hole spatially communicated with the receiving space. The handle device includes a handle that is adapted to be mounted to the cover and that defines an installation space adapted to be spatially communicated with the through hole, and a receiving box that is detachably received in the installation space and that defines a feeding space spatially communicated with the installation space. A cooking apparatus including the container and the handle device is also provided.

Abstract: A display apparatus including a display panel and a driver circuit is provided. The display panel includes a display region and a non-display region. The non-display region includes a plurality of dummy pixels connected to one another. The driver circuit provides gate driving voltages and a test data voltage, so as to make the dummy pixels connected to one another generate a charging rate test signal in response to the test data voltage.

Abstract: A display device includes a first display unit, a first selecting switch, a first block switch, a first selecting gate line, a second display unit, a second selecting switch, a second block switch, a second selecting gate line, and a block gate line. The first selecting gate line is configured to provide a first selecting gate signal to a control end of the first selecting switch. The second selecting gate line is configured to provide a second selecting gate signal to a control end of the second selecting switch. The block gate line is configured to provide a block gate signal to a control end of the first block switch and a control end of the second block switch.

Abstract: Certain aspects relate to systems and techniques for folded optic stereoscopic imaging, wherein a number of folded optic paths each direct a different one of a corresponding number of stereoscopic images toward a portion of a single image sensor. Each folded optic path can include a set of optics including a first light folding surface positioned to receive light propagating from a scene along a first optical axis and redirect the light along a second optical axis, a second light folding surface positioned to redirect the light from the second optical axis to a third optical axis, and lens elements positioned along at least the first and second optical axes and including a first subset having telescopic optical characteristics and a second subset lengthening the optical path length. The sensor can be a three-dimensionally stacked backside illuminated sensor wafer and reconfigurable instruction cell array processing wafer that performs depth processing.

Abstract: A fabrication method of a nitride underlayer structure includes, during AlN layer sputtering with PVD, a small amount of non-Al material is doped to form nitride with decomposition temperature lower than that of AlN. A high-temperature annealing is then performed. After annealing, the AlN layer has a rough surface with microscopic ups and downs instead of a flat surface. By continuing AlGaN growth via MOCVD over this surface, the stress can be released via 3D-2D mode conversion, thus improving AlN cracks.

Abstract: A bracket device includes a supporting frame, a bracket, an elastic member and a fastening member. The bracket is movably connected to the supporting frame. The elastic member is mounted to the supporting frame. The fastening member is connected to the elastic member. When the bracket is located at a first position relative to the supporting frame, the fastening member is in a locking state. When the bracket is located at a second position relative to the supporting frame, the fastening member is in an unlocking state.

Abstract: Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.