Patents by Inventor Aaron R. Wilson
Aaron R. Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100038796Abstract: A contact formed in accordance with a process for etching a insulating layer to produce an opening having an aspect ratio of at least 15:1 by first exposing the insulating layer to a second plasma of a second gaseous etchant comprising Ar, Xe, and combinations thereof to form an opening having an aspect ratio of less than 15:1. Secondly, the insulating layer is exposed to a first plasma of a first gaseous etchant having at least fifty percent helium (He) to etch the opening having an aspect ratio of at least 15:1, thereby increasing the aspect ratio to greater than 15:1, where the first gaseous etchant has a lower molecular weight than the second gaseous etchant.Type: ApplicationFiled: September 29, 2009Publication date: February 18, 2010Applicant: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Patent number: 7648915Abstract: Some embodiments include methods of recessing multiple materials to a common depth utilizing etchant comprising C4F6 and C4F8. The recessed materials may be within isolation regions, and the recessing may be utilized to form trenches for receiving gatelines. Some embodiments include structures having an island of semiconductor material laterally surrounded by electrically insulative material. Two gatelines extend across the insulative material and across the island of semiconductor material. One of the gatelines is recessed deeper into the electrically insulative material than the other.Type: GrantFiled: January 12, 2007Date of Patent: January 19, 2010Assignee: Micron Technology, Inc.Inventors: Larson Lindholm, Aaron R. Wilson, David K. Hwang
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Patent number: 7608195Abstract: A process for etching a insulating layer to produce an opening having an aspect ratio of at least 15:1 by supplying a first gaseous etchant having at least fifty (50) percent He to a plasma etch reactor, and exposing the insulating layer to a plasma of the first gaseous etchant. Use of the first gaseous etchant reduces the occurrence of twisting in openings in insulating layers having an aspect ratio of at least 15:1.Type: GrantFiled: February 21, 2006Date of Patent: October 27, 2009Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Publication number: 20090026530Abstract: Fin-FET (fin field effect transistor) devices and methods of fabrication are disclosed. The Fin-FET devices include dual fin structures that may form a channel region between a source region and a drain region. In some embodiments, the dual fin structures are formed by forming shallow trench isolation structures, using a pair of shallow trench isolation (STI) structures as a mask to define a recess in a portion of the substrate between the pair of STI structures, and recessing the STI structures so that the resulting dual fin structure protrudes from an active surface of the substrate. The dual fin structure may be used to form single-gate, double-gate or triple-gate fin-FET devices. Electronic systems including such fin-FET devices are also disclosed.Type: ApplicationFiled: July 17, 2007Publication date: January 29, 2009Applicant: MICRON TECHNOLOGY, INC.Inventors: Aaron R. Wilson, Larson Lindholm, David Hwang
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Publication number: 20080169504Abstract: Some embodiments include methods of recessing multiple materials to a common depth utilizing etchant comprising C4F6 and C4F8. The recessed materials may be within isolation regions, and the recessing may be utilized to form trenches for receiving gatelines. Some embodiments include structures having an island of semiconductor material laterally surrounded by electrically insulative material. Two gatelines extend across the insulative material and across the island of semiconductor material. One of the gatelines is recessed deeper into the electrically insulative material than the other.Type: ApplicationFiled: January 12, 2007Publication date: July 17, 2008Inventors: Larson Lindholm, Aaron R. Wilson, David K. Hwang
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Patent number: 7358146Abstract: A carbon containing masking layer is patterned to include a plurality of container openings therein having minimum feature dimensions of less than or equal to 0.20 micron. The container openings respectively have at least three peripheral corner areas which are each rounded. The container forming layer is plasma etched through the masking layer openings. In one implementation, such plasma etching uses conditions effective to both a) etch the masking layer to modify shape of the masking layer openings by at least reducing degree of roundness of the at least three corners in the masking layer, and b) form container openings in the container forming layer of the modified shapes. Capacitors comprising container shapes are formed using the container openings in the container forming layer. Other implementations and aspects are disclosed.Type: GrantFiled: August 22, 2005Date of Patent: April 15, 2008Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Patent number: 7276409Abstract: A carbon containing masking layer is patterned to include a plurality of container openings therein having minimum feature dimensions of less than or equal to 0.20 micron. The container openings respectively have at least three peripheral corner areas which are each rounded. The container forming layer is plasma etched through the masking layer openings. In one implementation, such plasma etching uses conditions effective to both a) etch the masking layer to modify shape of the masking layer openings by at least reducing degree of roundness of the at least three corners in the masking layer, and b) form container openings in the container forming layer of the modified shapes. Capacitors comprising container shapes are formed using the container openings in the container forming layer. Other implementations and aspects are disclosed.Type: GrantFiled: August 22, 2005Date of Patent: October 2, 2007Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Patent number: 6933193Abstract: A carbon containing masking layer is patterned to include a plurality of container openings therein having minimum feature dimensions of less than or equal to 0.20 micron. The container openings respectively have at least three peripheral corner areas which are each rounded. The container forming layer is plasma etched through the masking layer openings. In one implementation, such plasma etching uses conditions effective to both a) etch the masking layer to modify shape of the masking layer openings by at least reducing degree of roundness of the at least three corners in the masking layer, and b) form container openings in the container forming layer of the modified shapes. Capacitors comprising container shapes are formed using the container openings in the container forming layer. Other implementations and aspects are disclosed.Type: GrantFiled: June 24, 2003Date of Patent: August 23, 2005Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Publication number: 20040219790Abstract: An etching method includes applying a photoresist over a substrate, forming an opening in the photoresist, and etching the substrate under the opening using a plasma generated with a gas composition containing argon and an amount of higher atomic mass inert gas. The amount may be effective to increase photoresist stability compared to otherwise identical etching lacking any of the higher atomic mass inert gas. The photoresist may have a composition sensitized to an actinic energy wavelength of 248 nm or less. A method of increasing the stability of 248 nm or less photoresist during RIE includes providing a means for reducing electron temperature of a plasma and etching a substrate exposed through photoresist openings without substantially destabilizing the photoresist.Type: ApplicationFiled: April 30, 2003Publication date: November 4, 2004Inventor: Aaron R. Wilson
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Patent number: 6753643Abstract: A method of forming emitter tips for use in a field emission array is described. The tips are formed by utilizing a polymer residue that forms during the dry etch sharpening step to hold the mask caps in place on the emitter tips. The residue polymer continues to support the mask caps as the tips are over-etched, enabling the tips to be etched past sharp without losing their shape and sharpness. The dry etch utilizes an etchant including fluorine and chlorine gasses. The mask caps and residue polymer are easily removed after etching by washing the wafers in a wash of deionized water, or Buffered Oxide Etch.Type: GrantFiled: January 24, 2002Date of Patent: June 22, 2004Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Publication number: 20040072433Abstract: A carbon containing masking layer is patterned to include a plurality of container openings therein having minimum feature dimensions of less than or equal to 0.20 micron. The container openings respectively have at least three peripheral corner areas which are each rounded. The container forming layer is plasma etched through the masking layer openings. In one implementation, such plasma etching uses conditions effective to both a) etch the masking layer to modify shape of the masking layer openings by at least reducing degree of roundness of the at least three corners in the masking layer, and b) form container openings in the container forming layer of the modified shapes. Capacitors comprising container shapes are formed using the container openings in the container forming layer. Other implementations and aspects are disclosed.Type: ApplicationFiled: June 24, 2003Publication date: April 15, 2004Inventor: Aaron R. Wilson
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Patent number: 6689282Abstract: A method of forming emitter tips for use in a field emission array is disclosed. The tips are formed by utilizing a polymer residue that forms during the dry etch sharpening step to hold the mask caps in place on the emitter tips. The residue polymer continues to support the mask caps as the tips are over-etched, enabling the tips to be etched past sharp without losing their shape and sharpness. The dry etch utilizes an etchant comprised of fluorine and chlorine gases. The mask caps and residue polymer are easily removed after etching by washing the wafers in a wash of deionized water, or Buffered Oxide Etch.Type: GrantFiled: July 19, 2002Date of Patent: February 10, 2004Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Patent number: 6679998Abstract: A method of forming a pattern in a layer of material on a substrate, comprising providing a plurality of spheres, covering the layer on the substrate with the plurality of spheres to form a mask, reducing the diameter of at least one sphere of the plurality of spheres, etching the layer on the substrate using at least one sphere having a reduced diameter as a mask, and etching the substrate.Type: GrantFiled: August 23, 2002Date of Patent: January 20, 2004Assignee: Micron Technology, Inc.Inventors: Eric J. Knappenberger, Aaron R. Wilson
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Patent number: 6660173Abstract: A method of forming emitter tips for use in a field emission array is disclosed. The tips are formed by utilizing a polymer residue that forms during the dry etch sharpening step to hold the mask caps in place on the emitter tips. The residue polymer continues to support the mask caps as the tips are over-etched, enabling the tips to be etched past sharp without losing their shape and sharpness. The dry etch utilizes an etchant comprised of fluorine and chlorine gases. The mask caps and residue polymer are easily removed after etching by washing the wafers in a wash of deionized water, or Buffered Oxide Etch.Type: GrantFiled: May 22, 2002Date of Patent: December 9, 2003Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Patent number: 6649469Abstract: A carbon containing masking layer is patterned to include a plurality of container openings therein having minimum feature dimensions of less than or equal to 0.20 micron. The container openings respectively have at least three peripheral corner areas which are each rounded. The container forming layer is plasma etched through the masking layer openings. In one implementation, such plasma etching uses conditions effective to both a) etch the masking layer to modify shape of the masking layer openings by at least reducing degree of roundness of the at least three corners in the masking layer, and b) form container openings in the container forming layer of the modified shapes. Capacitors comprising container shapes are formed using the container openings in the container forming layer. Other implementations and aspects are disclosed.Type: GrantFiled: October 11, 2002Date of Patent: November 18, 2003Assignee: Micron Technology, Inc.Inventor: Aaron R. Wilson
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Patent number: 6555402Abstract: An extraction grid for field emitter tip structures and method of forming are described. A conductive layer is deposited over an insulative layer formed over the field emitter tip structures. The conductive layer is milled using ion milling. Owing to topographical differences along an exposed surface of the conductive layer, ions strike the exposed surface at various angles of incidence. As etch rate from ion milling is dependent at least in part upon angle of incidence, a selectivity based on varying topography of the exposed surface (“topographic selectivity”) results in non-uniform removal of material thereof. In particular, portions of the conductive layer in near proximity to the field emitter tip structures are removed faster than portions of the conductive layer between emitter tip structures. Thus, portions of the insulative layer in near proximity to the field emitter tip structures may be exposed while leaving intervening portions of the conductive layer for forming the extraction grid.Type: GrantFiled: February 8, 2002Date of Patent: April 29, 2003Assignee: Micron Technology, Inc.Inventors: David H. Wells, Ji Ung Lee, Aaron R. Wilson
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Publication number: 20030000914Abstract: A method of forming a pattern in a layer of material on a substrate, comprising providing a plurality of spheres, covering the layer on the substrate with the plurality of spheres to form a mask, reducing the diameter of at least one sphere of the plurality of spheres, etching the layer on the substrate using at least one sphere having a reduced diameter as a mask, and etching the substrate.Type: ApplicationFiled: August 23, 2002Publication date: January 2, 2003Inventors: Eric J. Knappenberger, Aaron R. Wilson
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Publication number: 20020190026Abstract: A method of forming emitter tips for use in a field emission array is disclosed. The tips are formed by utilizing a polymer residue that forms during the dry etch sharpening step to hold the mask caps in place on the emitter tips. The residue polymer continues to support the mask caps as the tips are over-etched, enabling the tips to be etched past sharp without losing their shape and sharpness. The dry etch utilizes an etchant comprised of fluorine and chlorine gasses. The mask caps and residue polymer are easily removed after etching by washing the wafers in a wash of deionized water, or Buffered Oxide Etch.Type: ApplicationFiled: July 19, 2002Publication date: December 19, 2002Inventor: Aaron R. Wilson
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Publication number: 20020175141Abstract: A method of forming emitter tips for use in a field emission array is disclosed. The tips are formed by utilizing a polymer residue that forms during the dry etch sharpening step to hold the mask caps in place on the emitter tips. The residue polymer continues to support the mask caps as the tips are over-etched, enabling the tips to be etched past sharp without losing their shape and sharpness. The dry etch utilizes an etchant comprised of fluorine and chlorine gases. The mask caps and residue polymer are easily removed after etching by washing the wafers in a wash of deionized water, or Buffered Oxide Etch.Type: ApplicationFiled: May 22, 2002Publication date: November 28, 2002Inventor: Aaron R. Wilson
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Patent number: 6464890Abstract: A method of forming a pattern in a layer of material on a substrate, comprising providing a plurality of spheres, covering the layer on the substrate with the plurality of spheres to form a mask, reducing the diameter of at least one sphere of the plurality of spheres, etching the layer on the substrate using at least one sphere having a reduced diameter as a mask, and etching the substrate.Type: GrantFiled: August 29, 2001Date of Patent: October 15, 2002Assignee: Micron Technology, Inc.Inventors: Eric J. Knappenberger, Aaron R. Wilson