Abstract: A microelectronic device comprises a first die comprising a memory array region comprising a stack structure comprising vertically alternating conductive structures and insulative structures, and vertically extending strings of memory cells within the stack structure. The first die further comprises first control logic region comprising a first control logic devices including at least a word line driver. The microelectronic device further comprise a second die attached to the first die, the second die comprising a second control logic region comprising second control logic devices including at least one page buffer device configured to effectuate a portion of control operations of the vertically extending string of memory cells. Related microelectronic devices, electronic systems, and methods are also described.

Abstract: A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

Abstract: Apparatus might include a controller configured to cause the apparatus to program a plurality of memory cells from a first data state to a second data state higher than the first data state, determine a respective first voltage level of a control gate voltage deemed to cause each memory cell of a first and second subset of memory cells of the plurality of memory cells to reach the second data state, determine a respective second voltage level of a control gate voltage deemed sufficient to cause each memory cell of the first subset of memory cells to reach a third data state higher than the second data state, and determine a respective second voltage level of a control gate voltage deemed sufficient to cause each memory cell of the second subset of memory cells to reach a fourth data state higher than the third data state.

Abstract: A memory device stores data in non-volatile memory. The memory device includes a non-volatile memory array. The memory array includes tiers for accessing data stored in blocks of the memory array, including a block having a left block portion and a right block portion. A first staircase is positioned between the left block portion and the right block portion, and a bottom portion of the first staircase includes steps corresponding to first tiers of the left block portion. A second staircase is positioned between the left block portion and the right block portion, and a top portion of the second staircase includes steps corresponding to second tiers of the right block portion. The steps of the first staircase and the steps of the second staircase descend in opposite directions.

Abstract: Methods of operating a memory, and memories configured to perform such methods, might include applying a programming pulse having a plurality of different voltage levels to a selected access line during a programming operation, and for each group of memory cells of a plurality of groups of memory cells of a plurality of memory cells selected for programming, enabling that group of memory cells for programming during a respective portion of the duration of the programming pulse of a corresponding voltage level of the plurality of different voltage levels, wherein memory cells of the plurality of memory cells selected for programming and having a particular intended data state are members of more than one of the groups of memory cells, and at least one of the groups of memory cells comprises a memory cell having the particular intended data state and a memory cell having a different intended data state

Abstract: Methods, as well as apparatus configured to perform similar methods, might include programming a plurality of memory cells to a particular data state of a plurality of data states, and, for each memory cell of the plurality of memory cells whose target data state is higher than the particular data state, determining a respective indication of a programming voltage level deemed sufficient to program that memory cell to a respective target threshold voltage corresponding to its respective target data state, and further programming that memory cell using a programming voltage level of a plurality of programming voltage levels corresponding to the respective indication of the programming voltage level deemed sufficient to program that memory cell to the respective target threshold voltage corresponding to its respective target data state.

Abstract: A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

Abstract: Memories having block select circuitry having an output that is selectively connected to a plurality of driver circuitries, with each driver circuitry connected to a respective block of memory cells.

Abstract: Methods of operating a memory include applying a programming pulse having a particular voltage level to a selected access line connected to a plurality of memory cells selected for programming during a programming operation, concurrently enabling for programming each memory cell of the plurality of memory cells selected for programming while applying the programming pulse, applying a subsequent programming pulse having a plurality of different voltage levels to the selected access line, and, for each group of memory cells of a plurality of groups of memory cells of the plurality of memory cells selected for programming, enabling that group of memory cells for programming while the subsequent programming pulse has a corresponding voltage level of the plurality of different voltage levels.

Abstract: A memory device stores data in non-volatile memory. The memory device includes a non-volatile memory array. The memory array includes tiers for accessing data stored in blocks of the memory array, including a block having a left block portion and a right block portion. A first staircase is positioned between the left block portion and the right block portion, and a bottom portion of the first staircase includes steps corresponding to first tiers of the left block portion. A second staircase is positioned between the left block portion and the right block portion, and a top portion of the second staircase includes steps corresponding to second tiers of the right block portion. The steps of the first staircase and the steps of the second staircase descend in opposite directions.

Abstract: A microelectronic device comprises a stack structure having tiers each including a conductive structure and an insulating structure, the stack structure comprises a staircase region comprising staircase structures, a select gate contact region, and a memory array region between the staircase region and the select gate contact region; contact structures on steps of the staircase structures; string drivers coupled to the contact structures and comprising transistors underlying and within horizontal boundaries of the staircase region; a triple well structure underlying the memory array region; a select gate structure between the stack structure and the triple well structure; semiconductive pillar structures within horizontal boundaries of the memory array region and extending through the stack structure and the select gate structure to the triple well structure; and a select gate contact structure within horizontal boundaries of the select gate contact region and extending through the stack structure to the sele

Abstract: An example method for determining likelihood of erroneous data bits stored in memory cells may include sensing a first plurality of memory cells based on a first sense thresholds. Responsive to sensing the first plurality of cells, a first set of probabilistic information may be associated with the first plurality of memory cells. A second plurality of memory cells may be sensed based on a second sense threshold. Responsive to sensing the second plurality of memory cells, a second set of probabilistic information may be associated with the second plurality of memory cells. An error correction operation may be performed on the first and second pluralities of memory cells based, at least in part, on the first and second values.

Abstract: A memory device includes a memory array with memory blocks each having a plurality of memory cells, and one or more current monitors configured to measure current during post-deployment operation of the memory device; and a controller configured to identify a bad block within the memory blocks based on the measured current, and disable the bad block for preventing access thereof during subsequent operations of the memory device.

Abstract: Memories having block select circuitry having an output that is selectively connected to a plurality of driver circuitries, with each driver circuitry connected to a respective block of memory cells.

Abstract: Memories having block select circuitry having an output that is selectively connected to a plurality of driver circuitries, each driver circuitry connected to a respective block of memory cells, as well as methods of operating such memories.

Abstract: Methods of operating a memory include applying a programming pulse having a particular voltage level to a selected access line connected to a plurality of memory cells selected for programming during a programming operation, concurrently enabling for programming each memory cell of the plurality of memory cells selected for programming while applying the programming pulse, applying a subsequent programming pulse having a plurality of different voltage levels to the selected access line, and, for each group of memory cells of a plurality of groups of memory cells of the plurality of memory cells selected for programming, enabling that group of memory cells for programming while the subsequent programming pulse has a corresponding voltage level of the plurality of different voltage levels.

Abstract: Memories having block select circuitry having an output that is selectively connected to a plurality of driver circuitries, each driver circuitry connected to a respective block of memory cells, as well as methods of operating such memories.

Abstract: Memories having a controller configured to apply a first voltage level to channel regions of memory cells of an array of memory cells coupled to a plurality of access lines; apply a second voltage level, lower than the first voltage level, to a first access line; apply a third voltage level, lower than the second voltage level, to a second access line while applying the second voltage level to the first access line and while applying the first voltage level to the channel regions of the memory cells; and increase the voltage level applied to the second access line to the second voltage level and decrease the voltage level applied to the first access line to a fourth voltage level, lower than the second voltage level and different than the third voltage level, while applying the first voltage level to the channel regions of the memory cells.

Abstract: Methods of operating a memory include applying a programming pulse having a particular voltage level to a selected access line connected to a plurality of memory cells selected for programming during a programming operation, concurrently enabling for programming each memory cell of the plurality of memory cells selected for programming while applying the programming pulse, applying a subsequent programming pulse having a plurality of different voltage levels to the selected access line, and, for each group of memory cells of a plurality of groups of memory cells of the plurality of memory cells selected for programming, enabling that group of memory cells for programming while the subsequent programming pulse has a corresponding voltage level of the plurality of different voltage levels.

Abstract: Memories having a controller configured to apply a first voltage level to channel regions of memory cells of an array of memory cells coupled to a plurality of access lines; apply a second voltage level, lower than the first voltage level, to a first access line; apply a third voltage level, lower than the second voltage level, to a second access line while applying the second voltage level to the first access line and while applying the first voltage level to the channel regions of the memory cells; and increase the voltage level applied to the second access line to the second voltage level and decrease the voltage level applied to the first access line to a fourth voltage level, lower than the second voltage level and different than the third voltage level, while applying the first voltage level to the channel regions of the memory cells.