Abstract: An X-ray detector including a substrate having opposite first and second faces, at least a first temperature sensor on the side of the first or second face, and at least one stack including of a copper oxide layer and a copper layer. The copper oxide layer is located between the copper layer and the substrate. The stack covers at least partially the first temperature sensor or is at least partially opposite the first temperature sensor.

Abstract: A device and method recovering heat energy and converting the heat energy into electrical energy by heat-sensitive molecules to which are connected magnetic particles, with the heat-sensitive molecules able to move the magnetic particles in relation to a conductive circuit to generate an induced current in the circuit.

Abstract: A method of manufacturing an electronic device including a film, including the steps of forming at least one layer of a solution including a solvent and a compound including a polymer selected from the group including poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene) (P(VDF-TrFE-CFE)), poly(vinylidene fluoride-trifluoroethylene-chlorotrifluoroethylene) (P(VDF-TrFE-CTFE)) and a mixture of these compounds, the molecular rate of chlorine in the copolymer being greater than or equal to 3%; and irradiating at least the layer with pulses of at least one ultraviolet radiation.

Abstract: The invention concerns a method of flip-chip assembly between first (1) and second (2) components each comprising connection pads (11, 21) on one of the faces of same, referred to as assembly faces, which involves transferring the components onto each other via the assembly faces of same in such a way as to create electrical interconnections between the pads of the first and second components. The invention involves transforming the copper oxide into copper by UV annealing, very locally, in the gap between the components, at least around the areas adjacent to the connection pads. The method according to the invention can be used for any component that is transparent to UV rays, including for substrates made from a plastic material such as substrates made from PEN or PET. The invention also concerns the assembly of two components obtained by the method.

Abstract: The invention concerns a method of flip-chip assembly between first (1) and second (2) components each comprising connection pads (11, 21) on one of the faces of same, referred to as assembly faces, which involves transferring the components onto each other via the assembly faces of same in such a way as to create electrical interconnections between the pads of the first and second components. The invention involves transforming the copper oxide into copper by UV annealing, very locally, in the gap between the components, at least around the areas adjacent to the connection pads. The method according to the invention can be used for any component that is transparent to UV rays, including for substrates made from a plastic material such as substrates made from PEN or PET. The invention also concerns the assembly of two components obtained by the method.

Abstract: A piezoelectric device including a paper film including cellulose fibers and containing an additive selected from the group including 4-fluorophenethyl isocyanate, 2-2 diphenyl-ethyl isocyanate, nitrophenyl isocyanate, 1-adamantyl iso-cyanate, cyanophenyl isocyanate, and triphenylamine grafted to the cellulose fibers, the film further having a first surface and a second surface opposite to the first surface and a first electrode arranged on the first surface and a second electrode arranged on the second surface.

Abstract: A device including: a paper film including cellulose fibers, a first surface, and a second surface opposite to the first surface; and at least one first heat-sensitive resistor having a negative temperature coefficient, the first heat-sensitive resistor including a first electrode arranged on the first surface, a second electrode arranged on the second surface, the first and second electrodes having at least first portions facing each other, the first heat-sensitive resistor further including the portion of the paper film arranged between the first portions facing each other. The invention also relates to a method of manufacturing such a device.

Abstract: A process for manufacturing a piezoelectric and/or pyroelectric device comprising a polyvinylidene fluoride film, the process comprising a step of forming at least one portion of a layer of a solution comprising a solvent and a compound comprising polyvinylidene fluoride and a step of irradiating the portion with pulses of at least one ultraviolet radiation. The irradiating step enables the formation of at least two ? crystalline phases having different orientations.

Abstract: A system for converting energy, comprising a first device comprising a deformable enclosure containing thermo-reactive molecules suitable for deforming the enclosure when their temperature exceeds a threshold temperature, and a second pyroelectric and/or piezoelectric device making contact with the enclosure.

Abstract: A piezoelectric device including a substrate, at least two electrodes extending on the substrate, at least one piezoelectric strip extending on the substrate and on the electrodes, and at least one electrically-conductive strip extending at least on one of the electrodes and on the piezoelectric strip and in contact with the substrate on either side of the piezoelectric strip.

Abstract: The invention concerns a heat-sensitive resistor with a negative or positive temperature coefficient, comprising respectively an antimony-doped tin oxide-based resistive element or a carbon black-based resistive element, containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50000 and 150000 g/mol, and a glass transition temperature Tg between 40 and 100° C.

Abstract: The invention concerns a flexible film (20) of crystalline or semi-crystalline material comprising a first region (24) surrounded by a first amorphized wall (26).

Abstract: A method of manufacturing a microelectronic device including a first component hybridized with a second component via electric interconnects, involves the steps of: (i) forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; (ii) forming interconnection elements including copper oxide on the second component at the locations provided for the interconnects; (iii) placing the first and second components on each other; and (iv) applying the ultraviolet radiation through the second component on the elements including copper oxide to implement an ultraviolet anneal converting copper oxide into copper.

Abstract: A device and method recovering heat energy and converting the heat energy into electrical energy by heat-sensitive molecules to which are connected magnetic particles, with the heat-sensitive molecules able to move the magnetic particles in relation to a conductive circuit to generate an induced current in the circuit.

Abstract: Production of a triboelectric generator element based on a given dielectric polymer material , provided with a rough surface comprising conical micro-tip shaped structures obtained by means of a heat treatment of the polymer material (FIG. 1C).

Abstract: A tactile sensor including a piezoresistive layer having its electric resistance varying according to mechanical stress exerted thereon, the piezoresistive layer being at least partially transparent to light; a photosensitive layer, having its electric resistance varying according to the quantity of incident light thereon, the photosensitive layer being arranged opposite the piezoresistive layer; and electric connection elements electrically connecting in parallel the piezoresistive layer and the photosensitive layer.

Abstract: A pressure sensor including a lower substrate having two electrodes partially covered with a semiconductor layer and a piezoelectric layer made of a piezoelectric material, and in contact with the semiconductor layer in such a way that semiconductor material is in contact with the piezoelectric material and with the two electrodes, deposited thereon. The electrodes are intended to be connected to a voltage source or to a device for measuring the intensity of a current generated by the displacement of the electric charges in the semiconductor layer between the electrodes, said electric charges being created when a pressure is exerted on the piezoelectric layer.

Abstract: A method of forming a hybridized device comprising forming a first microelectronic component provided, on a surface, with metal balls, and a second microelectronic component provided, on a surface, with connection elements corresponding to said metal balls, and hybridizing the first and second components to attach the metal balls of the first component to the connection elements of the second component. The manufacturing of the second microelectronic component comprises forming a substrate provided with cavities at the locations provided for the connection elements, and forming resistive elements made of fusible metal respectively suspended above the cavities. The hybridizing of the first and second components comprises transferring the first component onto the second component to have the metal balls rest on the suspended resistive elements, and circulating an electric current through the resistive elements to melt said elements.

Abstract: A method of forming a hybridized device including forming a first component provided with metal bumps, and a second component provided with connection elements, attaching the bumps to the connection elements. The manufacturing of the second component includes forming, on a surface of a substrate, resistive elements at the locations provided for the connection elements; depositing an electric insulator layer at least on the resistive elements; and forming the connection elements, each comprising a metal well having an opening capable of receiving the corresponding metal bump of the first microelectronic component and at least partially filled with a fusible element, particularly indium or an alloy of tin and gold, or with a conductive ink, particularly based on silver or copper. Further, the attachment of the balls to the connection elements comprises applying an electric current through the resistive elements to heat the bumps.

Abstract: A method of manufacturing a microelectronic device including a first component hybridized with a second component via electric interconnects, involves the steps of: (i) forming the first and second components, the second component being transparent to ultraviolet radiation at least in line with locations provided for the interconnects; (ii) forming interconnection elements including copper oxide on the second component at the locations provided for the interconnects; (iii) placing the first and second components on each other; and (iv) applying the ultraviolet radiation through the second component on the elements including copper oxide to implement an ultraviolet anneal converting copper oxide into copper.