Abstract: A synthetic methodology for robust, nanostructured films of cobalt oxide over metal evaporated gold or similar material layer of, e.g., 50 nm, directly onto glass or other substrates via aerosol assisted chemical vapor deposition (AACVD). This approach allows film growth rates in the range of, e.g., 0.8 nm/s, using a commercially available precursor, which is ˜10-fold the rate of electrochemical synthetic routes. Thus, 250 nm thick cobalt oxide films may be generated in only 5 minutes of deposition time. The water oxidation reaction for such films may start at ˜0.6 V vs Ag/AgCl with current density of 10 mA/cm2 and is achieved at ˜0.75 V corresponding to an overpotential of 484 mV. This current density is further increased to 60 mA/cm2 at ˜1.5 V (vs Ag/AgCl). Electrochemically active surface area (ECSA) calculations indicate that the synergy between a Au-film, acting as electron sink, and the cobalt oxide film(s), acting as catalytic layer(s), are more pronounced than the surface area effects.

Abstract: An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.

Abstract: A semiconductor system (900) has a flat interposer (510) with a first surface (401a) in a first plane, a second surface (401b) in a parallel second plane, and a uniform first height (401) between the surfaces; the interposer is patterned in metallic zones separated by gaps (412, 415), the zones include metal of the first height and metal of a second height (402) smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first (610) and a second (611) set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe (700) is attached to the second terminals of the second set chips, and a second leadframe (800) is attached to respective metallic zones of the second interposer surface.

Abstract: A system for facilitating evaluation of characteristics related to quality associated with a machine design may include a user input device configured to generate a query related to one or more characteristics related to quality associated with a machine design. The system may also include a display device configured display images, and a processor in communication with the user input device and the display device. The processor may be configured to receive a query from the user input device, access data representative of the machine design, and generate image data representative of characteristics related to quality associated with the machine design. The image data may be communicated to the display device to display a machine image including a color-coded representation of at least a portion of a machine and a textual image including textual representations of information related to the machine design.

Abstract: A system for evaluating characteristics related to quality associated with a machine design may include a user input device and a display device configured to display images representative of characteristics related to quality. The system may also include a processor in communication with the user input device and the display device. The processor may be configured to receive a query from the user input device related to one or more characteristics related to quality, and access data representative of the machine design. The data may include a data format representative of the machine design and including a plurality of nodes. The processor may be configured to associate the plurality of nodes into a node tree structure including a plurality of node branches and generate image data representative of characteristics related to quality associated with the machine design by processing two or more of the node branches substantially concurrently.

Abstract: Embodiments of present disclosure discloses system and method for acquisition of optimal images of object in multi-layer sample. Initially, images for FOV of multi-layer sample comprising objects are retrieved. Each of images are captured by varying focal depth of image capturing unit associated with system. Further, objects associated with multi-layer sample in FOV are identified. For identification, cumulative foreground mask of FOV is obtained based on adaptive thresholding performed on foreground image of FOV. Based on contour detection performed on cumulative foreground mask of FOV, object masks, corresponding to objects, is obtained for identifying objects. Further, sharpness of each of images associated with each of object masks is computed. Based on sharpness, optimal images from images for each of objects is selected for acquisition of optimal images of objects in multi-layer sample.

Abstract: A computer-implemented method and system for a customer experience resource facility for scheduling a time-based resource on a commerce processing device and accepting an input for a product-based resource, and processing a payment in respect of the time-based resource and the product-based resource using a payment processing facility on the commerce processing device, where the payment processing facility processes payments through the commerce processing device based at least in part on an input received from the customer experience resource facility.

Abstract: Aspects of the present disclosure relate to one or more implementations of a substrate support for a processing chamber. In one implementation, a substrate support includes a body having a center, and a support surface on the body configured to at least partially support a substrate. The substrate support includes a first angled wall that extends upward and radially outward from the support surface, and a first upper surface disposed above the support surface. The substrate support also includes a second angled wall that extends upward and radially outward from the first upper surface, the first upper surface extending between the first angled wall and the second angled wall. The substrate support also includes a second upper surface extending from the second angled wall. The second upper surface is disposed above the first upper surface.

Abstract: In a described example, a packaged integrated circuit (IC) includes a lead frame with a lead and with an IC chip mount pad. A portion of the lead adjacent to the IC chip mount pad is mechanically deformed to form a lead lock. An integrated circuit chip is mounted on a first side of the IC chip mount pad; and the integrated circuit chip, the IC chip mount pad, and the portion are covered in molding compound.

Abstract: A voltage-current sensor enables more accurate measurement of the voltage, current, and phase of RF power that is delivered to high-temperature processing region. The sensor includes a planar body comprised of a non-organic, electrically insulative material, a measurement opening formed in the planar body, a voltage pickup disposed around the measurement opening, and a current pickup disposed around the measurement opening. Because of the planar configuration and material composition of the sensor, the sensor can be disposed proximate to or in contact with a high-temperature surface of a plasma processing chamber.

Abstract: A semiconductor package includes a die pad and leads extending from the die pad. Each lead has a free end with outer surfaces extending at angles from one another. An electrically conductive plating material covers at least portions of the outer surfaces. A die attached to the die pad is electrically connected to the leads. An insulating layer extends over the leads and the die such that the free ends of the leads are exposed.

Abstract: A processing chamber and a processing method for processing a substrate in the processing chamber with thermal control are described herein. The method includes heating a first substrate using a heater apparatus during a first processing operation. The heater apparatus has a first setpoint during at least a first portion of the first processing operation. The first substrate is disposed on a substrate support surface of an electrostatic chuck in a processing chamber. The method further includes determining a first parameter change corresponding to a resistivity change in the electrostatic chuck, determining a second setpoint for the heater apparatus based on the first parameter change, and controlling the heater apparatus to the second setpoint.

Abstract: Methods for processing a substrate, such as bevel etch processing, are provided. In one embodiment, a method includes placing a substrate on a cover plate inside of a processing chamber, where the substrate has a center and a bevel edge and contains a dielectric layer thereon, the processing chamber contains a mask disposed above the substrate and an edge ring disposed under the substrate, the edge ring has an annular body, and the cover plate is disposed on a support assembly. The method further includes heating the substrate with a heater attached to the support assembly, raising the edge ring to contact the mask, flowing a process gas containing an etchant along an outer surface of the mask and to the bevel edge, where the process gas is ignited to produce a plasma, and exposing an upper surface of the substrate at the bevel edge to the process gas.

Abstract: The present disclosure provides compositions and methods for treating subjects at risk for or with sensorineural hearing loss. Such compositions and methods include modulating the epigenetic status of the cell, or rate of protein degradation, to increase expression and/or levels of Atoh1 protein.

Abstract: Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.

Abstract: Embodiments of present disclosure discloses system and method for acquisition of optimal images of object in multi-layer sample. Initially, images for FOV of multi-layer sample comprising objects are retrieved. Each of images are captured by varying focal depth of image capturing unit associated with system. Further, objects associated with multi-layer sample in FOV are identified. For identification, cumulative foreground mask of FOV is obtained based on adaptive thresholding performed on foreground image of FOV. Based on contour detection performed on cumulative foreground mask of FOV, object masks, corresponding to objects, is obtained for identifying objects. Further, sharpness of each of images associated with each of object masks is computed. Based on sharpness, optimal images from images for each of objects is selected for acquisition of optimal images of objects in multi-layer sample.

Abstract: A semiconductor system (900) has a flat interposer (510) with a first surface (401a) in a first plane, a second surface (401b) in a parallel second plane, and a uniform first height (401) between the surfaces; the interposer is patterned in metallic zones separated by gaps (412, 415), the zones include metal of the first height and metal of a second height (402) smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first (610) and a second (611) set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe (700) is attached to the second terminals of the second set chips, and a second leadframe (800) is attached to respective metallic zones of the second interposer surface.

Abstract: Embodiments described herein relate to coating materials with high resistivity for use in processing chambers. To counteract the high charges near the top surface of the thermal conductive support, the top surface of the thermal conductive support can be coated with a high resistivity layer. The high resistivity of the layer reduces the amount of charge at the top surface of the thermally conductive element, greatly reducing or preventing arcing incidents along with reducing electrostatic chucking degradation. The high resistivity layer can also be applied to other chamber components. Embodiments described herein also relate to methods for fabricating a chamber component for use in a processing environment. The component can be fabricated by forming a body of a chamber component, optionally ex-situ seasoning the body, installing the chamber component into a processing chamber, in-situ seasoning the chamber component, and performing a deposition process in the processing chamber.

Abstract: A method of recovering a hydrocarbon from a reservoir, whereby an oil recovery formulation containing carboxylic acid functionalized-pyrolyzed date leaf particles is injected into the reservoir, and the hydrocarbon is collected from the reservoir. The carboxylic acid functionalized-pyrolyzed date leaf particles are obtained sequentially from date leaves by cutting the date leaves and drying, pulverizing in the presence of a metal bicarbonate, pyrolyzing at 700 to 1,000° C., and treating the product thus obtained with an acid solution that includes nitric acid to introduce carboxylic acid functional groups.

Abstract: A method of assembling a flip chip on a leadframe package. A locking dual leadframe (LDLF) includes a top metal frame portion including protruding features and a die pad and a bottom metal frame portion having apertures positioned lateral to the die pad. The protruding features and apertures are similarly sized and alignable. A flipped integrated circuit (IC) die having a bottomside and a topside including circuitry connected to bond pads having solder balls on the bond pads is mounted with its topside onto the top metal frame portion. The top metal frame portion is aligned to the bottom metal frame portion so that the protruding features are aligned to the apertures. The bottomside of the IC die is pressed with respect to a top surface of the bottom frame portion, wherein the protruding features penetrate into the apertures.