Abstract: Monodisperse carboxylate functionalized gold nanoparticles comprising a capping agent layer of pamoic acid and colloidal suspensions thereof are disclosed. These gold nanoparticles have an average particle size of greater than 15 nm or less than 8 nm and demonstrate significant fluorescent properties. In addition, a method for the size controlled preparation of these monodisperse carboxylate functionalized gold nanoparticles wherein pamoic acid acts as both a reducing and capping agent and wherein the size of the particles can be controlled by the pH of the process is disclosed. In addition, a method for the size controlled preparation of these monodisperse carboxylate functionalized gold nanoparticles utilizing seed mediated growth is disclosed.

Abstract: A method of producing submicron carbon particles from oil ash. The method comprises pyrolyzing the oil ash to produce a pyrolyzed oil ash and milling the pyrolyzed oil ash to produce carbon particles having a mean particle size in the submicron regime. The method produces submicron carbon particles which have a very high carbon content (90 to 99 atom %) and a very low content of oxygen, the particles having a ratio of carbon to oxygen ratio of 10:1 to 99:1. The size of the particles may be controlled by the duration of the milling. The submicron carbon particles are devoid of functionalities containing carbon-oxygen double bonds as measured by Raman spectroscopy and X-ray photoelectron spectroscopy (XPS).

Abstract: In accordance with at least one example of the disclosure, a system comprises a semiconductor package, comprising a first side surface having a first set of metal contacts extending therefrom; a second side surface having a second set of metal contacts extending therefrom; a top surface; a bottom surface; and an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.

Abstract: Systems and methods for synchronous content viewing are provided. In embodiments, a method includes providing an interface to a user of a remote user device; receiving a user selection of one or more contacts of the user as invitees to a synchronized session; providing content synchronously to the remote user device of the user and other remote user devices of the respective one or more contacts of the user based on receiving an acceptance from the one or more contacts of the user, wherein the user and the one or more contacts of the user view the content synchronously during the synchronized session; and providing functions of an application to the participants synchronously, wherein the functions enable the participants to interact with the content in real-time during the synchronized session, and wherein all participants view interactions with the content simultaneously.

Abstract: A method of assembling a flip chip on a leadframe package. A locking dual leadframe (LDLF) includes a top metal frame portion including protruding features and a die pad and a bottom metal frame portion having apertures positioned lateral to the die pad. The protruding features and apertures are similarly sized and alignable. A flipped integrated circuit (IC) die having a bottomside and a topside including circuitry connected to bond pads having solder balls on the bond pads is mounted with its topside onto the top metal frame portion. The top metal frame portion is aligned to the bottom metal frame portion so that the protruding features are aligned to the apertures. The bottomside of the IC die is pressed with respect to a top surface of the bottom frame portion, wherein the protruding features penetrate into the apertures.

Abstract: A memory module testing system operating in a vibratory environment can retain a memory module in place in a memory socket using both socket latches and a retainer clip. The retainer clip can attach to a module support tower of the memory socket. The retainer clip can have a flexible multi-spring structure forming a three-axis vibration dampening system that can prevent the socket latches from opening while testing in the test environment. The retainer clip can secure the socket latches using an upper flange and a lower flange to prevent unintended motion of the socket latches. The retainer clip can be secured to the module support towers at the ends of the memory socket using clip arms and clip arm tips to attach to the module support towers.

Abstract: A method includes forming a leadframe assembly to have a pair of opposing sides, and having semiconductor die receiving portions extending between the opposing sides. The method also includes placing semiconductor dies on the leadframe assembly in the die receiving portions. Each die has a row of leads on each of two opposing sides of the die and a longitudinal axis parallel to the rows of leads. The longitudinal axis of each die is orthogonal to the opposing sides of the leadframe assembly. The method further includes applying mold compound to the semiconductor dies. The method includes punching through the leadframe assembly between the opposing sides using a first tool having a first tool longitudinal axis parallel to longitudinal axes of the dies.

Abstract: Embodiments of present disclosure discloses system and method for reconstruction of FOV. Initially, presence of one of single object and distinct objects in FOV of image of sample comprising one or more objects is determined based on sharpness of one or more objects. A single optimal representation of FOV may be generated when presence of single object is determined. At least one of single optimal representation and a depth-based enhanced representation of FOV may be generated when presence of distinct objects is determined. For generating depth-based enhanced representation, one or more first optimal images associated with each of distinct objects in FOV may be retrieved. An optimal representation of each of distinct objects is generated based on corresponding one or more first optimal images. Further, optimal representation of each of distinct objects is placed at corresponding optimal depth associated with respective distinct object to generate depth-based enhanced representation.

Abstract: Embodiments described herein generally relate to apparatuses for processing a substrate. In one or more embodiments, a heater support kit includes a heater assembly contains a heater plate having an upper surface and a lower surface, a chuck ring disposed on at least a portion of the upper surface of the heater plate, a heater arm assembly contains a heater arm and supporting the heater assembly, and a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate.

Abstract: A computer-implemented method and system for a customer experience resource facility for scheduling a time-based resource on a commerce processing device and accepting an input for a product-based resource, and processing a payment in respect of the time-based resource and the product-based resource using a payment processing facility on the commerce processing device, where the payment processing facility processes payments through the commerce processing device based at least in part on an input received from the customer experience resource facility.

Abstract: Some example communication systems include a fixed network equipment (FNE) operable to receive a talk group call from a first radio. The FNE is operable to transmit the talk group call to a second radio. The FNE is operable to receive a request for a high priority call. The communication system includes a gateway operable to transmit an interrupt signaling message through a broadband channel to the first radio. The interrupt signaling message includes instructions to de-key from the talk group call. Some example communication systems include a first radio operable to communicate with a second radio in a talk group call. The communication system includes a gateway operable to receive a request for a high priority call. The gateway is operable to transmit an interrupt signaling message through a broadband channel to the first radio. The interrupt signaling message includes instructions to make a high priority call decision.

Abstract: Implementations of the present disclosure generally relate to methods and apparatus for generating and controlling plasma, for example RF filters, used with plasma chambers. In one implementation, a plasma processing apparatus is provided. The plasma processing apparatus comprises a chamber body, a powered gas distribution manifold enclosing a processing volume and a radio frequency (RF) filter. A pedestal having a substrate-supporting surface is disposed in the processing volume. A heating assembly comprising one or more heating elements is disposed within the pedestal for controlling a temperature profile of the substrate-supporting surface. A tuning assembly comprising a tuning electrode is disposed within the pedestal between the one or more heating elements and the substrate-supporting surface. The RF filter comprises an air core inductor, wherein at least one of the heating elements, the tuning electrode, and the gas distribution manifold is electrically coupled to the RF filter.

Abstract: The present disclosure generally relates to substrate supports for semiconductor processing. In one embodiment, a substrate support is provided. The substrate support includes a body comprising a substrate chucking surface, an electrode disposed within the body, a plurality of substrate supporting features formed on the substrate chucking surface, wherein the number of substrate supporting features increases radially from a center of the substrate chucking surface to an edge of the substrate chucking surface, and a seasoning layer formed on the plurality of the substrate supporting features, the seasoning layer comprising a silicon nitride.

Abstract: A method for making an electrocatalyst containing manganese oxide nanoparticles present on carbon obtained from Albizia procera (MnOxNPs-C) for electrochemical water oxidation. The method includes a thermal decomposition and forms a product with specific morphological variations, including crystalline structure, elemental composition, and chemical compatibility. The manganese oxide nanoparticles are well dispersed over the carbon. The amount of manganese oxide nanoparticles increases by increasing the amount of precursor. Single-phase formation of the Mn3O4, and Mn3O4 along with MnO phase occurs at low and high amount of the precursor materials, respectively. The electrocatalyst can be used for the purpose electrolytic water splitting.

Abstract: A method of preparing porous nitrogen-doped carbon nanosheets by pyrolysis of Albizia procera leaves. The nitrogen-doped carbon nanosheets display enhanced electrochemical properties including large surface area and specific capacitance. Electrodes coated with the nitrogen-doped carbon nanosheets are particularly suitable for use in supercapacitors and solar cells.

Abstract: A leadframe for electronic systems comprising a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.

Abstract: The present disclosure generally relates to processing chamber seasoning layers having a graded composition. In one example, the seasoning layer is a boron-carbon-nitride (BCN) film. The BCN film may have a greater composition of boron at the base of the film. As the BCN film is deposited, the boron concentration may approach zero, while the relative carbon and nitrogen concentration increases. The BCN film may be deposited by initially co-flowing a boron precursor, a carbon precursor, and a nitrogen precursor. After a first period of time, the flow rate of the boron precursor may be reduced. As the flow rate of boron precursor is reduced, RF power may be applied to generate a plasma during deposition of the seasoning layer.

Abstract: One or more embodiments described herein generally relate to selective deposition of substrates in semiconductor processes. In these embodiments, a precursor is delivered to a process region of a process chamber. A plasma is generated by delivering RF power to an electrode within a substrate support surface of a substrate support disposed in the process region of the process chamber. In embodiments described herein, delivering the RF power at a high power range, such as greater than 4.5 kW, advantageously leads to greater plasma coupling to the electrode, resulting in selective deposition to the substrate, eliminating deposition on other process chamber areas such as the process chamber side walls. As such, less process chamber cleans are necessary, leading to less time between depositions, increasing throughput and making the process more cost-effective.

Abstract: In accordance with at least one example of the disclosure, a system comprises a semiconductor package, comprising a first side surface having a first set of metal contacts extending therefrom; a second side surface having a second set of metal contacts extending therefrom; a top surface; a bottom surface; and an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.

Abstract: Embodiments of the present disclosure generally relate to methods for conditioning an interior wall surface of a remote plasma generator. In one embodiment, a method for processing a substrate is provided. The method includes exposing an interior wall surface of a remote plasma source to a conditioning gas that is in excited state to passivate the interior wall surface of the remote plasma source, wherein the remote plasma source is coupled through a conduit to a processing chamber in which a substrate is disposed, and the conditioning gas comprises an oxygen-containing gas, a nitrogen-containing gas, or a combination thereof. The method has been observed to be able to improve dissociation/recombination rate and plasma coupling efficiency in the processing chamber, and therefore provides repeatable and stable plasma source performance from wafer to wafer.