Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.

Abstract: A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. In one embodiment the metal contacts are formed on the same side as the thin plastic layer, and in an alternate embodiment the metal contacts are formed on a block that is mounted on the PCB during the SMT process.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.

Abstract: A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.

Abstract: A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.

Abstract: An extended Universal-Serial-Bus (USB) connector plug and socket each have a pin substrate with one surface that supports the four metal contact pins for the standard USB interface. An extension of the pin substrate carries another 8 extension metal contact pins that mate when both the connector plug and socket are extended. The extension can be an increased length of the plug's and socket's pin substrate or a reverse side of the substrate. Standard USB connectors do not make contact with the extension metal contacts that are recessed, retracted by a mechanical switch, or on the extension of the socket's pin substrate that a standard USB connector cannot reach. Standard USB sockets do not make contact with the extension metal contacts because the extended connector's extension contacts are recessed, or on the extension of the connector pin substrate that does not fit inside a standard USB socket.

Abstract: A flash system has multiple channels of flash memory chips that can be accessed in parallel. Host data is assigned to one of the channels by a multi-channel controller processor and accumulated in a multi-channel page buffer. When a page boundary in the page buffer is reached, the page buffer is written to a target physical block if full, or combined with old data fragments in an Aggregating Flash Block (AFB) when the logical-sector addresses (LSA's) match. Thus small fragments are aggregated using the AFB, reducing erases and wear of flash blocks. The page buffer is copied to the AFB when a STOP command occurs. Each channel has one or more AFB's, which are tracked by an AFB tracking table.

Abstract: A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed.

Abstract: A portable USB device with an improved configuration is described herein. According to one embodiment, a portable USB device includes a core unit having a USB plug connector coupled to one or more multi-level cell (MLC) flash memory devices and an MLC flash controller disposed therein. The portable USB device further includes a housing for enclosing the core unit, including a front end opening to allow the USB plug connector to be deployed. The portable USB device further includes a core unit carrier for carrying the core unit for deploying and retracting the core unit, including a slide button to allow a finger of a user to slide the USB plug connector of the core unit in and out of the housing via the front end opening of the housing.

Abstract: A flash memory system stores blocks of data in Non-Volatile Memory Devices (NVMD) that are addressed by a logical block address (LBA). The LBA is remapped for wear-leveling and bad-block relocation by the NVMD. The NVMD are interleaved in channels that are accessed by a NVMD controller. The NVMD controller has a controller cache that caches blocks stored in NVMD in that channel, while the NVMD also contain high-speed cache. The multiple levels of caching reduce access latency. Power is managed in multiple levels by a power controller in the NVMD controller that sets power policies for power managers inside the NVMD. Multiple NVMD controllers in the flash system may each controller many channels of NVMD. The flash system with NVMD may include a fingerprint reader for security.

Abstract: A portable USB device is described herein. According to one embodiment, a portable USB device includes a core unit having a USB plug connector coupled to one or more multi-level cell (MLC) flash memory devices and an MLC flash controller disposed therein. The device further includes a housing for enclosing the core unit. The device further includes a swivel cap having a top surface and a bottom surface by bending a flat panel into a U-shape block having an opening end, a close end, and two side-openings, where the top and bottom surfaces of the swivel cap include a rivet opening align with each other. The housing having the core unit therein is sandwiched by the swivel cap using a set of rivets through the rivet openings of the housings and the swivel cap. The core unit can be rotated with respect to the rivet set in and out of the swivel cap.

Abstract: A Universal-Serial-Bus (USB) device has a USB plug that is centered over a center-line of a circuit board. The circuit board with flash memory and a USB flash controller has metal pads that a USB connector is soldered to. The USB connector has a rear step that is about half the height of the USB connector plug. Contacts on the rear step are soldered to the metal pads on the circuit board so that the USB connector is centered around the edge of the circuit board. The overall height of the flash device can be reduced since the bulky USB connector is not attached off-center to the circuit board, but is attached at the half-height rear step. Both the USB connector and the circuit board share the same center line, allowing a printed-circuit board assembly (PCBA) to be symmetric around the center line.

Abstract: A Multi-Media Card/Secure Digital (MMC/SD) single-chip flash device contains a MMC/SD flash microcontroller and flash mass storage blocks containing flash memory arrays that are block-addressable rather than randomly-addressable. MMC/SD transactions from a host MMC/SD bus are read by a bus transceiver on the MMC/SD flash microcontroller. Various routines that execute on a CPU in the MMC/SD flash microcontroller are activated in response to commands in the MMC/SD transactions. A flash-memory controller in the MMC/SD flash microcontroller transfers data from the bus transceiver to the flash mass storage blocks for storage. Rather than boot from an internal ROM coupled to the CPU, a boot loader is transferred by DMA from the first page of the flash mass storage block to an internal RAM. The flash memory is automatically read from the first page at power-on. The CPU then executes the boot loader from the internal RAM to load the control program.

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications.

Abstract: A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.

Abstract: An open-frame flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips, a controller chip, and a Serial AT-Attachment (SATA) connector soldered to it. The PCBA is only partially encased by left and right frames or by a U-shaped bracket frame. The frames have PCBA supports and guide posts that fit near edges of the PCBA. The frames do not cover the top and bottom of the PCBA, allowing chips on the PCBA to be ventilated by unblocked air flow. Screws that attach the PCBA to the frame have metal collars that ground the frame to the PCBA's ground plane. The screws form a current path to draw any electro-static-discharge (ESD) current off the frame and onto a PCBA ground. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the open frame.

Abstract: A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.

Abstract: A high volume testing/formatting process is provided for Universal Serial Bus-based (USB-based) electronic data flash cards (USB devices) that meets the increasing demand for USB electronic data flash cards (USB devices). A test host is simultaneously coupled to the multiple USB devices (e.g., using a multi-port card reader or a probe fixture), a controller endpoint value is read from each of the USB devices and verified with a known good value, and then testing/formatting is performed on each of the USB devices by writing predetermined data into each USB device in a pipelined manner, then reading out and testing the predetermined data. In one embodiment, the test host implements a special USB driver that blocks standard USB registration procedures upon detecting the plurality of USB devices. Control and/or boot code data are written onto the flash memory device (i.e., instead of being provided on a controller ROM).

Abstract: A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

Abstract: An electronic data flash card includes a processor and at least one flash memory device. The flash memory is partitioned such that it includes a first partition that is formatted using a file system that supports an Autorun function (e.g., CD-ROM file system (CDFS) format, fixed-disk format or Universal Disk Format (UDF)), and a disk partition that is formatted using a typical controller-based flash device file system (e.g., 16-bit File Allocation Table (FAT16) file system, 32-bit FAT (FAT32) file system, or New Technology File System (NTFS)). The electronic data flash card is produced such that Autorun-enabled application automatically executes a predetermined application or action when the electronic data flash card is installed in a host system. In one embodiment, the Autorun application includes an advertisement displayed on the host system prior to allowing access to data stored in the disk partition.