Patents by Inventor Adam Wade

Adam Wade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040267824
    Abstract: A server provides Web responses that can include content from data tables in a database. The server maintains a cache (e.g., in system memory) that can store content (including content from data tables) so as to increase the efficiency of subsequently providing the same content to satisfy client Web requests. The server monitors data tables for changes and, when a change in a particular data table occurs, invalidates cached entries that depend on a particular data table. Further, in response to a client Web request for a Web response, the server assigns a database cache dependency to at least a portion of a constructed Web response (e.g., to content retrieved from a data table) based on commands executed during construction of the Web response. The at least a portion of the constructed Web response is subsequently cached in a cache location at the server.
    Type: Application
    Filed: June 25, 2003
    Publication date: December 30, 2004
    Applicant: Microsoft Corporation
    Inventors: Michael Joseph Pizzo, Robert Michael Howard, Patrick Yu-Kwan Ng, Scott D. Guthrie, Adam Wade Smith
  • Publication number: 20030069284
    Abstract: Aryl- and heteroaryl-substituted urea compounds useful in the treatment of diseases and conditions related to DNA damage or lesions in DNA replication are disclosed. Methods of making the compounds, and their use as therapeutic agents, for example, in treating cancer and other diseases characterized by defects in DNA replication, chromosome segregation, or cell division also are disclosed.
    Type: Application
    Filed: March 1, 2002
    Publication date: April 10, 2003
    Inventors: Kathleen S. Keegan, Edward A. Kesicki, John Joseph Gaudino, Adam Wade Cook, Scott Douglas Cowen, Laurence Edward Burgess
  • Patent number: 6439143
    Abstract: A garment portion processing assembly receives uncut material to process the material into a desired shape, such as the shape of a shirt collar, and then organize the formed material into separate stacks. The garment portion processing assembly includes a stack queuing assembly, a garment portion cutting apparatus, and a garment receiving assembly. In operation, the stack queuing assembly prepares the stacks of garment portions to be collected by the garment portion cutting apparatus to be processed. The garment portion cutting apparatus then collects the garment portions and processes the garment portions as desired by the user. The garment portion cutting apparatus includes a folding assembly for precisely folding the garment portion in an even manner, a shaping knife assembly treat is used to trim the garment portion according to the desired pattern, and a width knife assembly that makes sure the garment portion has the proper width.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: August 27, 2002
    Assignee: Russell Corporation, Inc.
    Inventors: James Adam Wade, William D. Crahen
  • Patent number: 5910334
    Abstract: An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: June 8, 1999
    Assignee: Delco Electronics Corporation
    Inventors: Frans Peter Lautzenhiser, John Karl Isenberg, James Edward Walsh, Adam Wade Schubring
  • Patent number: D451087
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: November 27, 2001
    Assignee: Harman International Industries, Inc.
    Inventors: Jerry Moro, Adam Wade, Tim Nugent