Abstract: This disclosure describes one or more implementations of a video inference system that utilizes machine-learning models to efficiently and flexibly process digital videos utilizing various improved video inference architectures. For example, the video inference system provides a framework for improving digital video processing by increasing the efficiency of both central processing units (CPUs) and graphics processing units (GPUs). In one example, the video inference system utilizes a first video inference architecture to reduce the number of computing resources needed to inference digital videos by analyzing multiple digital videos utilizing sets of CPU/GPU containers along with parallel pipeline processing. In a further example, the video inference system utilizes a second video inference architecture that facilitates multiple CPUs to preprocess multiple digital videos in parallel as well as a GPU to continuously, sequentially, and efficiently inference each of the digital videos.

Abstract: Methods and devices are provided for treating a food allergy in a subject in need thereof. The method entails delivering an effective amount of an allergen associated with the food allergy into the subject's cutis skin layer. Delivering the allergen is carried out by inserting one or more allergen-coated solid microneedles into the subject's skin. The one or more solid microneedles each has a base, shaft and tip, and when inserted in the subject, do not extend beyond the cutis. The allergen is allowed to dissociate from the one or more microneedles while inserted in the subject's cutis. Once the allergen disassociates, the one or more microneedles is removed from the subject's skin.

Abstract: Methods and devices are provided for treating a food allergy in a subject in need thereof. The method entails delivering an effective amount of an allergen associated with the food allergy into the subject's cutis skin layer. Delivering the allergen is carried out by inserting one or more allergen-coated solid microneedles into the subject's skin. The one or more solid microneedles each has a base, shaft and tip, and when inserted in the subject, do not extend beyond the cutis. The allergen is allowed to dissociate from the one or more microneedles while inserted in the subject's cutis. Once the allergen disassociates, the one or more microneedles is removed from the subject's skin.

Abstract: The present disclosure relates to system(s) and method(s) for generating an alert based on change in traffic pattern. The system receives historic traffic data and current traffic data, associated with each road segment, from a set of road segments. Further, the system identifies a change traffic pattern based on analysing the historic traffic pattern and the current traffic pattern, using data analytics and a machine learning algorithm. Furthermore, the system identifies a sub-set of road segments, from the set of road segments, based on comparison of the change in traffic pattern and a pre-defined threshold. The system further determines root cause of change in traffic pattern by analysing the sub-set of road segments. Further, the system generates an alert for updating one or more road segments, from the sub-set of road segments, based on the root cause of change in traffic pattern.

Abstract: A semiconductor device comprises a substrate including a set of interconnect pads, a die mounted on the substrate, wherein the die includes circuitry that cannot withstand typical lead-free (Pb-free) solder reflow temperature during reflow process, and a reinforcing interposer including a first set of interconnect pads and a second set of interconnect pads. Low temperature solder material connects one of the set of interconnect pads on the substrate to a corresponding one of the first set of interconnect pads on the reinforcing interposer. A printed circuit board includes a set of interconnect pads. Low temperature solder material connects one of the set of interconnect pads of the printed circuit board to a corresponding one of the second set of interconnect pads of the reinforcing interposer. The low temperature solder material has a reflow temperature below typical Pb-free solder material.

Abstract: Embodiments for a packaged semiconductor device and methods of making are provided herein, which includes a packaged semiconductor device including: a semiconductor die; a carrier; a plurality of electrical connections formed between the semiconductor die and the carrier; an electrical isolation layer that covers an outer surface of each of the plurality of electrical connections; and a conductive underfill structure between the semiconductor die and the carrier, and surrounding each of the plurality of electrical connections, wherein the electrical isolation layer electrically isolates each electrical connection from the conductive underfill structure.

Abstract: Multidimensional digital content search techniques are described that support an ability of a computing device to perform search with increased granularity and flexibility over conventional techniques. In one example, a control is implemented by a computing device that defines a multidimensional (e.g., two-dimensional) continuous space. Locations in the multidimensional continuous space are usable to different search criteria through different weights applied to the criteria associated with the axes. Therefore, user interaction with this control may be used to define a location and corresponding coordinates that may act as weights to the search criteria in order to perform a search of digital content through use of a single user input.

Abstract: The present invention relates generally to methods and compositions useful for therapeutic vascular tissue engineering. In particular, the present invention provides methods for generating substantially pure populations of vasculogenic cells from human mesenchymal progenitors, and methods and compositions for clinical applications in the field of regenerative medicine.

Abstract: Embodiments of the present invention provide systems, methods, and computer storage media for detecting and classifying an exposure defect in an image using neural networks trained via a limited amount of labeled training images. An image may be applied to a first neural network to determine whether the images includes an exposure defect. Detected defective image may be applied to a second neural network to determine an exposure defect classification for the image. The exposure defect classification can includes severe underexposure, medium underexposure, mild underexposure, mild overexposure, medium overexposure, severe overexposure, and/or the like. The image may be presented to a user along with the exposure defect classification.

Abstract: A method of manufacturing a hybrid package including a flat package and a Wafer Level Chip Scale Package (WLCSP) is disclosed. The method includes fabricating a strip including a plurality of flat packages attached to each other via metal pins, turning the strip upside down, applying a layer of a thermal interface material (TIM) on each of the flat packages while the each of the flat packages is turned upside down, mounting the WLCSP on the layer of the TIM such that a top side of the WLCSP is interfaced with the layer of the TIM, curing the layer of the TIM and singulating each of the flat packages by cutting the metal pins and bending the metal pins.

Abstract: Methods and devices are provided for treating a food allergy in a subject in need thereof. The method entails delivering an effective amount of an allergen associated with the food allergy into the subject's cutis skin layer. Delivering the allergen is carried out by inserting one or more allergen-coated solid microneedles into the subject's skin. The one or more solid microneedles each has a base, shaft and tip, and when inserted in the subject, do not extend beyond the cutis. The allergen is allowed to dissociate from the one or more microneedles while inserted in the subject's cutis. Once the allergen disassociates, the one or more microneedles is removed from the subject's skin.

Abstract: Techniques and mechanisms for interconnecting network circuitry of an integrated circuit (IC) die and physical layer (PHY) circuits of the same IC die. In an embodiment, nodes of the network circuitry include first routers and processor cores, where the first routers are coupled to one another in an array configuration which includes rows and columns. First interconnects each extend to couple both to a corresponding one of the PHY circuits and to a corresponding one of the first routers. For each of one or more of the first interconnects, a respective one or more rows (or one or more columns) of the array configuration extend between the corresponding PHY and the corresponding router. In another embodiment, the network circuitry comprises network clusters which each include a different respective row of the array configuration.

Abstract: The present invention relates generally to methods and compositions useful for therapeutic vascular tissue engineering. In particular, the present invention provides methods for generating substantially pure populations of vasculogenic cells from human mesenchymal progenitors, and methods and compositions for clinical applications in the field of regenerative medicine.

Abstract: Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. The methods can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC); performing a thermal simulation for each respective template of the IC based on a sequence of power patterns of tiles of the respective template; and training a neural network with a plurality of training data collected via thermal simulations performed for the templates of the IC. These systems and methods can use a machine learning predictor, that has been trained to determine a transient temperature rise across an entire IC, and then append the determined transient temperature rise to a system level thermal profile of the IC.

Abstract: Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network.

Abstract: Disclosed embodiments relate to a cache line eviction algorithm. In one example, a system includes a last level cache (LLC) having multiple ways, each allocated to one of multiple priorities, each having specified minimum and maximum ways to occupy, a cache control circuit (CCC) to store an incoming cache line (CL) having a requestor priority to an invalid CL, if any, otherwise, when the requestor priority is a lowest priority and has an occupancy of one or more, or when the occupancy is at a maximum, to evict a least recently used (LRU) CL of the requestor priority, otherwise, when the occupancy is between a minimum and a maximum, to evict a LRU CL of the requestor or a lower priority, otherwise, when the occupancy is less than the minimum, to evict a LRU CL, if any, of the lower priority, and otherwise, to evict a LRU CL of a higher priority.

Abstract: Embodiments for a packaged semiconductor device and methods of making are provided herein, which includes a packaged semiconductor device including: a semiconductor die; a carrier; a plurality of electrical connections formed between the semiconductor die and the carrier; an electrical isolation layer that covers an outer surface of each of the plurality of electrical connections; and a conductive underfill structure between the semiconductor die and the carrier, and surrounding each of the plurality of electrical connections, wherein the electrical isolation layer electrically isolates each electrical connection from the conductive underfill structure.

Abstract: Machine assisted systems and methods for detecting unreliable circuit patterns are described. These systems and methods can use a machine learning classifier, that has been trained to recognize such circuit patterns, to detect the unreliable circuit patterns without requiring computationally expensive simulations of a circuit netlist which can be over a million devices (e.g. over a million FETs). The classifier, once trained, can recognize unreliable circuit patterns quickly and can be updated over time as new unreliable circuit patterns are discovered from simulations or other sources.

Abstract: A method of manufacturing a hybrid package including a flat package and a Wafer Level Chip Scale Package (WLCSP) is disclosed. The method includes fabricating a strip including a plurality of flat packages attached to each other via metal pins, turning the strip upside down, applying a layer of a thermal interface material (TIM) on each of the flat packages while the each of the flat packages is turned upside down, mounting the WLCSP on the layer of the TIM such that a top side of the WLCSP is interfaced with the layer of the TIM, curing the layer of the TIM and singulating each of the flat packages by cutting the metal pins and bending the metal pins.

Abstract: Methods and devices are provided for treating a food allergy in a subject in need thereof. The method entails delivering an effective amount of an allergen associated with the food allergy into the subject's cutis skin layer. Delivering the allergen is carried out by inserting one or more allergen-coated solid microneedles into the subject's skin. The one or more solid microneedles each has a base, shaft and tip, and when inserted in the subject, do not extend beyond the cutis. The allergen is allowed to dissociate from the one or more microneedles while inserted in the subject's cutis. Once the allergen disassociates, the one or more microneedles is removed from the subject's skin.