Patents by Inventor Akihiko Saito

Akihiko Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5372778
    Abstract: An electromagnetic stainless steel consists essentially of not more than 0.015 wt % of C, not more than 3.0 wt % of Si, not more than 0.5 wt % of Mn, not more than 0.030 wt % of P, not more than 0.030 wt % of S, 4-20 wt % of Cr, 0.2-7.0 wt % of Al, 0.02-0.50 wt % of Bi and the remainder being Fe and inevitable impurity and has excellent magnetic properties, electric resistance, cold forgeability and machinability.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: December 13, 1994
    Assignee: Daido Tokushuko Kabushiki Kaisha
    Inventors: Shinichiro Yahagi, Akihiko Saito
  • Patent number: 4958608
    Abstract: An ignition system for an internal combustion engine is widely known which includes a primary current control switch circuit adapted to be turned off at an ignition position to interrupt flowing of a primary current through an ignition coil, to thereby induce a high voltage for ignition across the ignition coil. Continuation of the flow of the primary current causes an increase in power consumption and generation of heat from the ignition coil. An ignition system of the present invention utilizes charging and discharging of a control capacitor to permit control over the time for which the primary current is flowing to be accomplished with a simple structure. A discharge resistor which is arranged in parallel with the control capacitor carries out discharge of the control capacitor to interrupt the flow of the primary current when the internal combustion engine is stopped.
    Type: Grant
    Filed: April 14, 1989
    Date of Patent: September 25, 1990
    Assignee: Kokusan Denki Company, Ltd.
    Inventors: Akihiko Saito, Hideki Yukawa
  • Patent number: 4786579
    Abstract: The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion.
    Type: Grant
    Filed: April 14, 1987
    Date of Patent: November 22, 1988
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kenji Tazawa, Akihiko Saito