Abstract: A first semiconductor component and a second semiconductor component are attached together via an adhesion layer so that the first semiconductor component and the second semiconductor component are electrically connected with each other via a through electrode. The through electrode is formed to fill a through hole formed in the second semiconductor component and a through hole formed in a portion the adhesion layer. The through hole formed in the portion the adhesion layer is positioned between the through hole formed in the second semiconductor component and a second connection surface of a first semiconductor component through electrode.

Abstract: At least one electronic component having a plurality of terminals on one of surfaces is temporarily fixed to a surface of a first support with a first adhesive layer in such a manner that the terminal side of the electronic component faces the first support. A second support having a second adhesive layer is fixed to the electronic component in order to interpose the electronic component between the first support and the second support. The first support and the first adhesive layer are peeled. The electronic component on the second support is sealed with a sealing resin in such a manner that at least a part of the terminals of the electronic component is exposed. An insulating resin layer and a wiring layer to be electrically connected to the terminal of the electronic component are stacked on the electronic component and the sealing resin.

Abstract: A method of producing a resin-sealed package is provided with: providing an electronic component which has a plurality of terminals on one face, a first support member and a second support member; temporarily fixing said electronic component to a surface of said first support member by a first adhesive agent layer, to face said terminals with said first support member; fixing said second support member having a second adhesive agent layer to said electronic component while interposing said electronic component between said first support member and said second support member to face said second adhesive agent layer with a back face side of said electronic component; resin sealing said electronic component between said first support member and said second support member; peeling said first support member and said first adhesive agent layer from said electronic component and a sealing resin; and stacking an insulating resin layer and a wiring layer which is electrically connected to said terminals of said electr

Abstract: A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin.

Abstract: A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin is provided and having a projection-shaped resin portion which projects locally around the lead pin and covers a side surface of a base portion side of the lead pin. The projection-shaped resin portion has a top surface extending from an outer peripheral portion of the lead pin to an outside, and a side surface constituting a non-identical surface to the top surface.

Abstract: A module substrate is provided. The module substrate includes: a core portion; a build-up layer formed on the core portion and including a wiring pattern and an insulating layer; an optical transmission mechanism including: an optical transmission component including an optical waveguide, and a mounting portion on which a semiconductor element is to be mounted. The mounting portion is electrically connected to the optical transmission mechanism via the wiring pattern. The mounting portion includes a first mounting portion and a second mounting portion, and the optical transmission mechanism is disposed between the first mounting portion and the second mounting portion.

Abstract: In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.

Abstract: A display device includes a laser light source, refraction means for refracting a laser beam emitted from the laser light source, and scan means for scanning the refracted laser beam by driving the refraction means. Further, in the display device, the scan means includes first scan means and second scan means that change a position of the refraction means with respect to the laser light source along two directions orthogonal to each other. Further, the refraction means includes first refraction means driven by the first scan means and second refraction means driven by the second scan means.

Abstract: A tape-like optical fiber cable comprises a plurality of optical fibers arranged in parallel to each other and each abutted to an adjacent fiber. Each of the optical fibers includes a cover and a lead extending therefrom. A method of forming an inclined surface at a terminal face of each lead comprises the steps of: pushing the respective leads of the optical fibers in parallel and together toward a grinding surface of a grinding means while moving in a certain direction so that terminal portions of the respective leads are simultaneously resiliently bent to form an inclined surfaces at the terminal faces of the respective leads.

Abstract: An optical collimator structure comprising an optical fiber assembly of a plurality of unitary single-mode optical fibers each having a core, and a ferrule for supporting the optical fiber assembly inserted partially therein and bonded thereto, wherein the core has a graded index optical fiber bonded to the end face thereof, the graded index optical fiber along with the end portion of the core to which the graded index optical fiber is bonded being inserted in a hole of a capillary provided at an end of the ferrule, and the end face of the graded index optical fiber for emitting or receiving a beam of light has a tilt angle relative to the optical axis of the optical collimator structure.

Abstract: An optical fiber collimator is provided in which the optical axis of a beam of light incident upon and emergent from the end face of the optical fiber collimator utilizing graded index (GI) optical fiber is made to perfectly agree with the axial direction of the optical fiber and further the optical fiber collimator is capable of obtaining a return loss characteristic. The optical fiber collimator comprises: a single mode (SM) optical fiber and GI optical fiber fused to an end face of SM optical fiber so that an optical axis of SM optical fiber is coincide with an optical axis of GI optical fiber to effect an optical transmission between these fibers; and GI optical fiber having a second end face provided with a bulge portion defining a smooth outer surface symmetrical with respect to the common optical axis of SM and GI optical fibers.

Abstract: An optical collimator structure comprising an optical fiber assembly of a plurality of unitary single-mode optical fibers each having a core, and a ferrule for supporting the optical fiber assembly inserted partially therein and bonded thereto, wherein the core has a graded index optical fiber bonded to the end face thereof, the graded index optical fiber along with the end portion of the core to which the graded index optical fiber is bonded being inserted in a hole of a capillary provided at an end of the ferrule, and the end face of the graded index optical fiber for emitting or receiving a beam of light has a tilt angle relative to the optical axis of the optical collimator structure.

Abstract: A tape-like optical fiber cable comprises a plurality of optical fibers arranged in parallel to each other and each abutted to an adjacent fiber. Each of the optical fibers includes a cover and a lead extending therefrom. A method of forming an inclined surface at a terminal face of each lead comprises the steps of: pushing the respective leads of the optical fibers in parallel and together toward a grinding surface of a grinding means while moving in a certain direction so that terminal portions of the respective leads are simultaneously resiliently bent to form an inclined surfaces at the terminal faces of the respective leads.