Abstract: Embodiments of an end effector assembly for a substrate robot are provided herein. In one embodiment, the end effector assembly includes a wrist and a first and a second end effector coupled to the wrist in a spaced apart relationship. The first end effector includes a base coupled to the wrist and a tip coupled to the base opposite the wrist. The base and the tip may be made of the same or different materials. The first and the second end effectors may have different resonant frequencies to minimize vibration. Optionally, a low emissivity coating may be provided on the first and second end effector. The low emissivity coating may further have a plurality of stress relief grooves to reduce or prevent flaking of the coating due to differences in rates of thermal expansion between the coating and the underlying end effector.

Abstract: A significant change in the static angular position can be produced from a small physical displacement of the flexible member. The flexible member 12 in a magnetic head unit 95 is stressed for adjusting the static angular position. Simultaneously, the stressed areas 14 are irradiated by a laser beam LA.

Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as wall as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

Abstract: Each of a plurality of flash lamps forming a light source is a bar lamp having an elongated cylindrical shape. The ratio of the distance between the flash lamps and a semiconductor wafer to the distance between the flash lamps and a reflector is set to not more than 1.8 or at least 2.2. Consequently, illuminance is weakened on portions of the main surface of the semiconductor wafer located immediately under the flash lamps along the vertical direction and strengthened in portions located immediately under the clearances between adjacent ones of the flash lamps along the vertical direction, thereby reducing illuminance irregularity on the overall main surface of the semiconductor wafer and improving in-plane uniformity of temperature distribution on the semiconductor wafer. Thus, a thermal processing apparatus capable of improving in-plane uniformity of temperature distribution on a substrate is provided.

Abstract: An apparatus for supporting a substrate is described that has a ball adapted to minimize damage between the substrate support and the substrate supported thereon. In one embodiment, an apparatus for supporting a substrate includes ball disposed on an inclined ball support surface. The ball support surface is adapted to bias the ball toward one side of the ball support surface thereby providing space for the ball to roll as the substrate supported thereon changes in length when exposed to thermal influences. In another embodiment, the apparatus further comprises a cage adapted to capture the ball to the ball support surface.

Abstract: In a thermal processing apparatus (1), an upper opening (60) of a chamber body (6) is closed by a transparent plate (61) and a light emitting part (5) emits light into the chamber body (6) through the upper opening (60). Inside the chamber body (6) provided are a susceptor (72) for supporting a substrate (9), a hot plate (71) for heating the susceptor (72) and a cover member (21) disposed between the transparent plate (61) and the susceptor (72). The susceptor (72) is provided with a recessed portion whose depth is larger than the thickness of the substrate (9), and a lower surface of the substrate (9) is supported by a bottom surface of the recessed portion and a periphery of the substrate (9) is surrounded by the side wall portion of the recessed portion. During a processing for the substrate (9), the cover member (21) is moved down and brought into contact with an upper end of the side wall portion of the recessed portion to close the recessed portion.

Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

Abstract: Embodiments of the invention generally provide an apparatus and a method for providing a uniform thermal profile to a plurality of substrates during heat processing. In one embodiment, a cassette containing one or more heated substrate supports is moveably disposed within a heating chamber having an about uniform thermal profile therein to more uniformly heat the substrates.

Abstract: Embodiments of the invention generally provides an apparatus and method for heating substrates, comprising a heater disposed within a chamber, a plurality of heated supports movably disposed within the chamber to support at least two substrates thereon and a contamination collector disposed in communication with the chamber.

Abstract: Embodiments of a method and apparatus for determining a substrate exchange position in a processing system are provided. In one embodiment, a method of determining a substrate exchange position in a processing system includes determining an initial exchange position within a processing chamber, and resolving a change in the exchange position. The step of resolving may further include the step of sensing a change in temperature of a facet of a transfer chamber having the processing chamber coupled thereto, sensing a change in a state of the system, or sensing a change in position of the processing chamber, among others.

Abstract: Embodiments of the present invention generally provide an apparatus for providing a uniform thermal profile to a plurality of large area substrates during thermal processing. In one embodiment, an apparatus for thermal processing large area substrates includes a chamber having a plurality of processing zones disposed therein that are coupled to a lift mechanism. The lift mechanism is adapted to vertically position the plurality of processing zones within the chamber. Each processing zone further includes an upper heated plate, a lower heated plate adapted to support a first substrate thereon and an unheated plate adapted to support a second substrate thereon, wherein the unheated plate is disposed between the upper and lower heated plates.

Abstract: An apparatus for supporting a substrate is provided having a ball adapted to minimize damage between the substrate support and the substrate supported thereon. In one embodiment, an apparatus for supporting a substrate includes a ball disposed on an inclined ball support surface. The ball support surface is adapted to bias the ball toward one side of the ball support surface thereby providing space for the ball to roll as the substrate supported thereon changes in length when exposed to thermal influences. In another embodiment, the apparatus further comprises a cage adapted to capture the ball to the ball support surface.

Abstract: A vacuum processing chamber with walls defining a cavity for processing a substrate. The processing chamber includes a substrate support for supporting a substrate being processed in the cavity, a shadow frame for preventing processing of a perimeter portion of the substrate, and a shadow frame support supporting the shadow frame within the cavity. The shadow frame is positionable with a gap between an underside of the shadow frame and an upper surface of the substrate. At least one conductive element insulated from the walls and establishes a conductive path from the shadow frame to outside the cavity. The conductive path may be used to discharge charge from the shadow frame at a rate sufficient to prevent a voltage differential from accumulating between the shadow frame and the substrate which would cause arcing therebetween, or to apply a bias voltage to the shadow frame sufficient to attract particles to reduce contamination of the substrate.

Abstract: In a first aspect, a first apparatus is provided for heating substrates. The first apparatus includes (1) a chamber having a bottom portion and a top portion; (2) a plurality of heated supports disposed within the chamber to support at least two substrates thereon; and (3) a heater disposed within the chamber between a sidewall of the chamber and the plurality of substrate supports and having an edge region and a center region. The heater is adapted to produce more heat within the edge region than within the center region of the heater. Numerous other aspects are provided.

Abstract: Embodiments of the invention generally provide an apparatus and a method for providing a uniform thermal profile to a plurality of substrates during heat processing. In one embodiment, a cassette containing one or more heated substrate supports is moveably disposed within a heating chamber having an about uniform thermal profile therein to more uniformly heat the substrates.

Abstract: A susceptor is formed with a cavity having a tapered surface and a receiving surface. The gradient &agr; of the tapered surface with respect to the receiving surface is set to at least 5° and less than 30°, so that a semiconductor wafer received by the susceptor can be located on the receiving surface through the tapered surface while the semiconductor wafer can be protected against excess stress also when the surface of the wafer abruptly thermally expands due to flashlight irradiation and can be prevented from cracking in thermal processing. Thus provided are a thermal processing susceptor and a thermal processing apparatus capable of preventing a substrate from cracking in thermal processing.

Abstract: Embodiments of the invention generally provide a substrate support for supporting a substrate. In one embodiment, a substrate support is provided that includes a plate assembly having at least a first heating element disposed therein or coupled thereto. A plurality of thermal isolators are disposed through plate assembly, defining a plurality of temperature controllable zones across the plane of the plate assembly.

Abstract: Each of a plurality of flash lamps forming a light source is a bar lamp having an elongated cylindrical shape. The ratio of the distance between the flash lamps and a semiconductor wafer to the distance between the flash lamps and a reflector is set to not more than 1.8 or at least 2.2. Consequently, illuminance is weakened on portions of the main surface of the semiconductor wafer located immediately under the flash lamps along the vertical direction and strengthened in portions located immediately under the clearances between adjacent ones of the flash lamps along the vertical direction, thereby reducing illuminance irregularity on the overall main surface of the semiconductor wafer and improving in-plane uniformity of temperature distribution on the semiconductor wafer. Thus, a thermal processing apparatus capable of improving in-plane uniformity of temperature distribution on a substrate is provided.

Abstract: Generally, an end effector assembly for a substrate transfer robot is provided. In one embodiment, an end effector assembly for a substrate transfer robot includes an end effector having a plurality of metallic pads disposed thereon. A polymer pad is disposed on each metallic pad wherein a ratio of an exposed portion of an upper surface of the metallic pad to a top surface of the polymer pad is at least about 3.5 to 1. In another embodiment, an end effector assembly for a substrate transfer robot includes an end effector having a plurality of polymer pads disposed thereon. Each polymer pad includes a fluoropolymer coating disposed on at least a top surface of the polymer pad. The metallic pad and/or the coating allows the polymer pad to be at least temporarily utilized in applications above its normal operating temperature.

Abstract: In accordance with a first aspect, a susceptor is provided that includes (1) a supporting surface adapted to support a substrate, the supporting surface comprising a first material; and (2) a support frame encased within the first material, the support frame comprising a second material that has a lower coefficient of thermal expansion than the first material. The support frame is offset from a center of the susceptor toward the supporting surface. In accordance with a second aspect, a susceptor is provided that includes (1) a supporting surface adapted to support a substrate, the supporting surface comprising a first material; and (2) a support frame encased within the first material, the support frame comprising a second material that has a higher coefficient of thermal expansion than the first material. The support frame is offset from a center of the susceptor away from the supporting surface. Other aspects are also provided.