Patents by Inventor Akihiro Itou
Akihiro Itou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170263502Abstract: The method for manufacturing an element chip includes a mounting step and a plasma dicing step. In the mounting step, a semiconductor substrate with flexibility, which has a first main surface and a second main surface located at an opposite side of the first main surface, which has a plurality element regions and a dividing region for defining the element regions, and on which a mask for covering the first main surface in the element region and for exposing the first main surface in the dividing region is formed, is mounted on a stage. In the plasma dicing step, the semiconductor substrate is diced into a plurality of element chips including the element; region by exposing the first main surface side of the semiconductor substrate to plasma on the stage and etching from the first main surface side to the second main surface while forming a groove on the dividing region.Type: ApplicationFiled: February 9, 2017Publication date: September 14, 2017Inventors: SHOGO OKITA, ATSUSHI HARIKAI, AKIHIRO ITOU, NORIYUKI MATSUBARA, BUNZI MIZUNO
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Patent number: 9505915Abstract: A fastening component is a molded article of a mixture in which microfibrillated cellulose fibers are dispersed in a thermoplastic resin, wherein the thermoplastic resin has a melting point of between 150 and 200° C., and wherein when the total mass % of the thermoplastic resin and the cellulose fibers is set to be 100 mass %, the mass % of the cellulose fibers included in the mixture is greater than 20 mass % and less than 60 mass %. When the total mass % of the thermoplastic resin and the cellulose fibers is set to be 100%, the mass % of the cellulose fibers included in the mixture is preferably equal to or greater than 30 mass % and equal to or less than 50 mass %.Type: GrantFiled: November 5, 2012Date of Patent: November 29, 2016Assignees: Kyoto Municipal Institute of Industrial Technology and Culture, YKK CorporationInventors: Takeshi Senba, Kazuo Kitagawa, Akihiro Itou, Kazuya Mizumoto
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Patent number: 9469750Abstract: A fastening component is a molded article of a mixture in which microfibrillated cellulose fibers are dispersed in a thermoplastic resin, wherein the thermoplastic resin has a melting point of between 150 and 200° C., and wherein when the total mass % of the thermoplastic resin and the cellulose fibers is set to be 100 mass %, the mass % of the cellulose fibers included in the mixture is greater than 20 mass % and less than 60 mass %. When the total mass % of the thermoplastic resin and the cellulose fibers is set to be 100%, the mass % of the cellulose fibers included in the mixture is preferably equal to or greater than 30 mass % and equal to or less than 50 mass %.Type: GrantFiled: November 5, 2012Date of Patent: October 18, 2016Assignees: Kyoto Municipal Institute of Industrial Technology and Culture, YKK CorporationInventors: Takeshi Senba, Kazuo Kitagawa, Akihiro Itou, Kazuya Mizumoto
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Patent number: 9458544Abstract: An exemplary organic hydride conversion device for generating a hydrogen gas through organic hydride conversion according to the present disclosure comprises an anode containing a dehydrogenation catalyst, a cathode containing hydrogenation catalyst, and a proton conductor disposed between the anode and the cathode. The proton conductor has a perovskite crystal structure expressed by the compositional formula AaB1-xB?xO3-x. The A element is an alkaline-earth metal and is contained in a range of 0.4<a<0.9, where the a value represents a mole fraction of this element, and the B? element is a trivalent group 3 or group 13 element and is contained in a range of 0.2<x<0.6, where the x value represents a mole fraction of this element.Type: GrantFiled: January 26, 2015Date of Patent: October 4, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuji Zenitani, Takashi Nishihara, Tetsuya Asano, Akihiro Itou, Saifullah Badar
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Publication number: 20150225862Abstract: An exemplary organic hydride conversion device for generating a hydrogen gas through organic hydride conversion according to the present disclosure comprises an anode containing a dehydrogenation catalyst, a cathode containing hydrogenation catalyst, and a proton conductor disposed between the anode and the cathode. The proton conductor has a perovskite crystal structure expressed by the compositional formula AaB1-xB?xO3-x. The A element is an alkaline-earth metal and is contained in a range of 0.4<a<0.9, where the a value represents a mole fraction of this element, and the B? element is a trivalent group 3 or group 13 element and is contained in a range of 0.2<x<0.6, where the x value represents a mole fraction of this element.Type: ApplicationFiled: January 26, 2015Publication date: August 13, 2015Inventors: YUJI ZENITANI, TAKASHI NISHIHARA, TETSUYA ASANO, AKIHIRO ITOU, SAIFULLAH BADAR
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Publication number: 20150225859Abstract: An exemplary dehydrogenation device for generating a hydrogen gas through dehydrogenation according to the present disclosure comprises an anode containing a dehydrogenation catalyst, a cathode containing catalyst capable of reducing protons, and a proton conductor disposed between the anode and the cathode. The proton conductor has a perovskite crystal structure expressed by the compositional formula AaB1-xB?xO3-?. The A element is an alkaline-earth metal and is contained in a range of 0.4<a<0.9, where the a value represents a mole fraction of this element, and the B? element is a trivalent group 3 or group 13 element and is contained in a range of 0.2<x<0.6, where the x value represents a mole fraction of this element.Type: ApplicationFiled: January 27, 2015Publication date: August 13, 2015Inventors: YUJI ZENITANI, TAKASHI NISHIHARA, TETSUYA ASANO, AKIHIRO ITOU, HIROKI TAKEUCHI
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Publication number: 20150148460Abstract: A fastening component is a molded article of a mixture in which microfibrillated cellulose fibers are dispersed in a thermoplastic resin, wherein the thermoplastic resin has a melting point of between 150 and 200° C., and wherein when the total mass % of the thermoplastic resin and the cellulose fibers is set to be 100 mass %, the mass % of the cellulose fibers included in the mixture is greater than 20 mass % and less than 60 mass %. When the total mass % of the thermoplastic resin and the cellulose fibers is set to be 100%, the mass % of the cellulose fibers included in the mixture is preferably equal to or greater than 30 mass % and equal to or less than 50 mass %.Type: ApplicationFiled: November 5, 2012Publication date: May 28, 2015Inventors: Takeshi Senba, Kazuo Kitagawa, Akihiro Itou, Kazuya Mizumoto
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Patent number: 8790563Abstract: A method is presented for stably, highly, and efficiently producing a three-dimensional molded article of a fiber-reinforced composite material having a three-dimensional shape, uniform quality, and free from wrinkles by press molding a plurality of prepregs cut out in a predetermined shape and also to a molded article.Type: GrantFiled: August 20, 2003Date of Patent: July 29, 2014Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Tsuneo Takano, Kiharu Numata, Akihiro Itou, Masato Taguchi, Junnichi Muramatsu
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Patent number: 7491774Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).Type: GrantFiled: February 12, 2007Date of Patent: February 17, 2009Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7307128Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).Type: GrantFiled: August 27, 2004Date of Patent: December 11, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7304120Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.Type: GrantFiled: January 26, 2007Date of Patent: December 4, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7285602Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less.Type: GrantFiled: March 5, 2004Date of Patent: October 23, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
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Publication number: 20070135616Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).Type: ApplicationFiled: February 12, 2007Publication date: June 14, 2007Applicant: JAPAN EPOXY RESINS CO., LTD.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
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Publication number: 20070123684Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.Type: ApplicationFiled: January 26, 2007Publication date: May 31, 2007Applicant: JAPAN EPOXY RESINS CO., LTD.Inventors: Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7070861Abstract: A flame retardant epoxy resin composition containing (A) a phenolic novolak type epoxy resin including a phenolic novolak type epoxy resin of the following formula (1) and/or formula (2) in a total of at least 50 wt %: (wherein, n is 0 or a positive integer) (wherein, n is 0 or a positive integer) (B) a bisphenol type epoxy resin not containing a halogen, (C) an inorganic filler, and (D) an organic flame retardant. A prepreg and a fiber-reinforced composite using this epoxy resin composition.Type: GrantFiled: December 18, 2001Date of Patent: July 4, 2006Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Masato Taguchi, Yasushi Suzumura, Tadayoshi Saitou, Akihiro Itou
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Publication number: 20050253294Abstract: A method is presented for stably, highly, and efficiently producing a three-dimensional molded article of a fiber-reinforced composite material having a three-dimensional shape, uniform quality, and free from wrinkles by press molding a plurality of prepregs cut out in a predetermined shape and also to a molded article.Type: ApplicationFiled: August 20, 2003Publication date: November 17, 2005Inventors: Tsuneo Takano, Kiharu Numata, Akihiro Itou, Masato Taguchi, Junnichi Muramatsu
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Publication number: 20050069715Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).Type: ApplicationFiled: August 27, 2004Publication date: March 31, 2005Inventors: Atsuhito Hayakawa, Akihiro Itou
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Publication number: 20040202864Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation.Type: ApplicationFiled: March 5, 2004Publication date: October 14, 2004Applicant: JAPAN EPOXY RESINS CO., LTD.Inventors: Yasuyuki Murata, Atsuhito Hayakawa, Akihiro Itou
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Publication number: 20040034127Abstract: A flame retardant epoxy resin composition containing (A) a phenolic novolak type epoxy resin including a phenolic novolak type epoxy resin of the following formula (1) and/or formula (2) in a total of at least 50 wt %: 1Type: ApplicationFiled: June 18, 2003Publication date: February 19, 2004Inventors: Masato Taguchi, Yasushi Suzumura, Tadayoshi Saitou, Akihiro Itou