Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.

Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

Abstract: The present invention pertains to a nonwoven fabric that can effectively allow the passage of high-viscosity waste. The nonwoven fabric (1) is formed from a substrate (10), which extends in an approximately planar shape and has a first surface (FF) and a second surface (FS) positioned at the reverse side from the first surface, and a plurality of protrusions (12), which protrude from the substrate to the first surface side. The fiber density of the first surface side is greater than the fiber density of the second surface side at the apices of the protrusions.

Abstract: The present invention provides an absorbent article that has flexible cushioning properties, favorable rebound when compressed, superior collection of waste, and superior liquid migration properties from a surface sheet to an absorbent element. The absorbent article has: a surface sheet, which has a textured structure used at the skin surface side of the absorbent article, and has first protrusions protruding to the skin surface side and second protrusions protruding to the clothing side at the reverse of the skin surface side; and an absorbent element disposed at a position overlapping the surface sheet in a plan view. The surface sheet and the absorbent element are joined in a planar manner at a join section at the apices of the second protrusions.

Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.

Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

Abstract: A composite material for an absorbent article and a method for manufacturing said composite material, said composite material being obtained by causing an absorbent material to adhere by electrostatic interaction to a substrate material, the surface of the absorbent material being positively or negatively charged in a prescribed solvent selected from among a nonpolar organic solvent, a polar organic solvent, and a water/polar organic solvent mixture; and the surface of the composite material being charged to an electrical charge opposite to that of the surface of the substrate material, in the prescribed solvent. The substrate material has a fiber substrate or a plastic substrate, and a polyelectrolyte layer provided on the surface layer; and/or the absorbent material has an absorbent-particle substrate or an absorbent fiber substrate, and a polyelectrolyte layer provided on the surface layer.

Abstract: An absorbent article contains a non-woven fabric sheet for an absorbent. The non-woven fabric sheet is produced without employing a strength-imparting means such as post-coating of an adhesive agent that can deteriorate a liquid diffusion property of the non-woven fabric sheet. The absorbent article includes a liquid-permeable surface sheet, a liquid-impermeable back sheet, an absorbent arranged therebetween, and the non-woven fabric sheet for the absorbent. The non-woven fabric sheet contains pulp, a pulp fiber layer, a first-surface-side fiber layer arranged on a first surface of the pulp fiber layer and mainly composed of hydrophilic fibers having an average fiber length of 25 to 64 mm, and a second-surface-side fiber layer arranged on a second surface of the pulp fiber layer and mainly composed of hydrophilic fibers having an average fiber length of 25 to 64 mm.

Abstract: A vehicle includes an internal combustion engine that generates power for rotating drive wheels, a differential mechanism that is provided between the engine and the drive wheels, and has at least three rotary elements including a first rotary element coupled to the engine, and a second rotary element coupled to the drive wheels, and a controller configured to control the engine. The controller is configured to determine whether to perform correction to increase the power generated by the engine, or perform correction to reduce the power, depending on a rotational speed of the second rotary element, when it changes a rotational speed of the engine.

Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.

Abstract: There is provided a method for manufacturing a silicon single crystal, the method includes: a raw material melting step of melting polycrystalline silicon accommodated in a crucible to obtain a silicon melt; and bringing a seed crystal into contact with the silicon melt and pulling up the seed crystal to grow the silicon single crystal, wherein, after the raw material melting step and before the pulling step, there are performed: a cristobalitizing step of leaving the silicon melt at a predetermined number of rotations of the crucible with a predetermined gas flow rate and a predetermined furnace pressure to generate cristobalite while applying a magnetic field; and a dissolving step of partially dissolving the cristobalite by carrying out any one of an increase in number of rotations of the crucible, an increase in gas flow rate, and a reduction in furnace pressure beyond counterpart figures in the cristobalitizing step.

Abstract: A hybrid vehicle includes a differential device, a first motor, an engine, a second motor, an engagement device, and an electronic control unit. The electronic control unit is configured to control the first motor and the second motor when an engagement state of the engagement device changes, such that a first angular acceleration and a second angular acceleration reach a first target value and the second target value respectively, the first angular acceleration and the second angular acceleration being two angular accelerations of the engine, the first motor, and the second motor and to calculate the first target value and the second target value by applying a constraint condition to at least one of the first target value and the second target value.

Abstract: A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.

Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.

Abstract: A composite material for an absorbent article and a method for manufacturing said composite material, said composite material being obtained by causing an absorbent material to adhere by electrostatic interaction to a substrate material, the surface of the absorbent material being positively or negatively charged in a prescribed solvent selected from among a nonpolar organic solvent, a polar organic solvent, and a water/polar organic solvent mixture; and the surface of the composite material being charged to an electrical charge opposite to that of the surface of the substrate material, in the prescribed solvent. The substrate material has a fiber substrate or a plastic substrate, and a polyelectrolyte layer provided on the surface layer; and/or the absorbent material has an absorbent-particle substrate or an absorbent fiber substrate, and a polyelectrolyte layer provided on the surface layer.

Abstract: A fuel supply device has a module installed in a fuel tank. The module has a cap and a support pillar arranged between the cap and a bottom of the fuel tank. The support pillar supports a suction filter and a level sensor to use the bottom of the fuel tank as a base point for defining proper positions. The cap supports a valve relevant to ventilation of the fuel tank. The valve is supported by a base portion. The valve is positioned in the support pillar. The valve and the support pillar are arranged to overlap each other along the height direction. Various components are arranged in the small cap.

Abstract: The fuel supply device has a module installed in a fuel tank. The module has a cap and a support pillar arranged between the cap and a bottom of the fuel tank. The cap is supporting a valve relevant to ventilation of the fuel tank. The valve is supported by a base portion. The base portion and a large diameter part are connected by snap-fit mechanisms. The valve and the base portion are connected by snap-fit mechanisms. A hook part is arranged in an engaging window. It is possible to inspect the valve through the engaging window.

Abstract: A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.