Patents by Inventor Akihiro Kimura

Akihiro Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10707185
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: July 7, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga
  • Semiconductor device
    Patent number: 10679927
    Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: June 9, 2020
    Assignee: ROHM Co., Ltd.
    Inventor: Akihiro Kimura
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20200161228
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: January 21, 2020
    Publication date: May 21, 2020
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SLIDE DEVICE
    Publication number: 20200156511
    Abstract: A slide device including a lower rail including a bottom wall, a side wall extending upward from the bottom wall, and a top wall extending from the side wall toward the center in a width direction; and an upper rail movable in a longitudinal direction in the lower rail, wherein: the side wall has a first regulating portion provided lower than the center in a vertical direction thereof, the first regulating portion engaging the upper rail and thereby regulating upward movement of the upper rail; and the bottom wall has a second regulating portion extending upward from the bottom wall, the second regulating portion engaging the upper rail and thereby regulating upward movement of the upper rail.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 21, 2020
    Applicant: SHIROKI CORPORATION
    Inventors: Akihiro KIMURA, Yuta MURAKAMI, Koichi MORITA
  • Electric power charge and discharge system
    Patent number: 10658877
    Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: May 19, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shuhei Nagatsuka, Akihiro Kimura
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20200066675
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Application
    Filed: October 30, 2019
    Publication date: February 27, 2020
    Inventors: Akihiro KIMURA, Takeshi SUNAGA
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10573584
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 25, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10497666
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 3, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga
  • Slide rail device for vehicle
    Patent number: 10464447
    Abstract: In a slide rail device for use in a vehicle, a lock control member comprises a pair of facing walls which face a pair of side walls of an upper rail and extend in upward and downward direction, and a pair of anti-rattle projections which project from the pair of facing walls toward the pair of side walls of the upper rail.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: November 5, 2019
    Assignee: SHIROKI CORPORATION
    Inventors: Akihiro Kimura, Naoki Hayashi
  • ORGANIC ELECTROLUMINESCENT ELEMENT
    Publication number: 20190288219
    Abstract: Provided is an organic electroluminescent element having high efficiency, a long lifetime, and bending resistance. An organic electroluminescent element includes a light emitting layer and an electron transport layer adjacent to the light emitting layer between a positive electrode and a negative electrode. A host compound of the light emitting layer has an ionization potential deeper than that of a light emitting dopant of the light emitting layer by 0.3 eV or more. At least one organic compound contained in the electron transport layer has a molecular dipole moment of 6.0 debye or more.
    Type: Application
    Filed: October 17, 2017
    Publication date: September 19, 2019
    Inventors: Kazuhiro OIKAWA, Akihiro KIMURA
  • Slide rail device for vehicle
    Patent number: 10406942
    Abstract: In a slide rail device for use in a vehicle , a lock spring support portion of an upper rail includes an upward-downward movement restriction support portion. The upward-downward movement restriction support portion includes an open holding portion which is open at a top thereof and holds a supported portion of a lock spring and an uplift prevention projection which is formed projecting into the open holding portion so as to overlap the supported portion of the lock spring, which is held by the open holding portion, in the upward and downward directions.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: September 10, 2019
    Assignee: SHIROKI CORPORATION
    Inventor: Akihiro Kimura
  • MEMORY SYSTEM
    Publication number: 20190235610
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Akihiro KIMURA, Hiroki MATSUSHITA
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190229042
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190157193
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190157239
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10290565
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: May 14, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • Memory system
    Patent number: 10254817
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: April 9, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Akihiro Kimura, Hiroki Matsushita
  • SEMICONDUCTOR DEVICE
    Publication number: 20190080990
    Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.
    Type: Application
    Filed: November 9, 2018
    Publication date: March 14, 2019
    Inventor: Akihiro KIMURA
  • Semiconductor device and method for manufacturing semiconductor device to prevent separation of terminals
    Patent number: 10186496
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: January 22, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga
  • Semiconductor device
    Patent number: 10163850
    Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: December 25, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Motoharu Haga, Shingo Yoshida, Yasumasa Kasuya, Toichi Nagahara, Akihiro Kimura, Kenji Fujii