Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds (A) of general formula (I) below that when exposed to actinic rays or radiation, generates an acid and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.

Abstract: A photosensitive composition comprises (A) a resin whose solubility in an alkali developer is increased by the action of an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation, wherein the resin (A) contains two or more repeating units respectively having acid-decomposable groups that are different from each other in the acid decomposition ratio at an image formation sensitivity.

Abstract: An object of the present invention is to provide an actinic-ray-sensitive or radiation-sensitive resin composition which is significantly excellent in terms of exposure latitude, is capable of forming a favorable rectangular pattern profile, and exhibits low dissolution of the components into an immersion liquid when performing immersion exposure, and a resist film and a pattern forming method each using the same composition. The actinic-ray-sensitive or radiation-sensitive resin composition contains (A) a compound represented by formula (I) and capable of generating an acid upon irradiation of actinic-rays or radiations, and (B) a resin capable of increasing the solubility in an alkaline developer by the action of an acid.

Abstract: An actinic-ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent critical dimension uniformity (CDU) in the line width, and a pattern forming method using the same are provided. The actinic-ray-sensitive or radiation-sensitive resin composition of the present invention includes (A) a resin containing a repeating unit having a specific lactone structure and a repeating unit having a specific monocyclic alicyclic structure, which increases a solubility in an alkaline developer by the action of an acid, and (B) a compound having a specific structure, which generates an acid upon irradiation with an actinic-ray or a radiation.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds of general formula (I) below, a compound that when exposed to actinic rays or radiation, generates an acid and a hydrophobic resin. (The characters used in general formula (I) have the meanings mentioned in the description.

Abstract: Provided are an actinic-ray-sensitive or radiation-sensitive resin composition which has improved development defect and is capable of forming a good pattern shape, an actinic-ray-sensitive or radiation-sensitive film formed using the composition, and a pattern forming method using the composition. The actinic-ray-sensitive or radiation-sensitive resin composition includes (A) a compound which generates an acid represented by the following general formula (I) or (I?) upon irradiation with an actinic-ray or a radiation, and (B) a resin which decomposes by an action of an acid to increase a solubility of the resin in an alkaline developer [each of the symbols in the general formulae (I) and (I?) indicates the meaning described in Claims].

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition including: (PA) a compound having a proton acceptor functional group and undergoing decomposition upon irradiation with an actinic ray or radiation to generate a compound reduced in or deprived of proton acceptor property or changed to be acidic from being proton acceptor-functioning, wherein a molar extinction coefficient ? of the compound (PA) at a wavelength of 193 nm as measured in acetonitrile solvent is 55,000 or less, and a pattern forming method using the composition are provided.

Abstract: Provided is a resist composition, including (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, the compound being any of those of general formulae (I) and (II) below, (C) a resin containing at least either a fluorine atom or a silicon atom, and (D) a mixed solvent containing a first solvent and a second solvent, at least either the first solvent or the second solvent exhibiting a normal boiling point of 200° C. or higher.

Abstract: According to one embodiment, a method of forming a pattern includes the step of applying an actinic-ray- or radiation-sensitive resin composition on a substrate so as to form a film, the step of selectively exposing the film through a mask and the step of developing the exposed film with the use of a developer containing an organic solvent, wherein the actinic-ray- or radiation-sensitive resin composition contains a resin (A) whose polarity is increased by the action of an acid so that the solubility of the resin in the developer containing an organic solvent is decreased, a photoacid generator (B) that when exposed to actinic rays or radiation, generates an acid containing a fluorine atom and a solvent (C), and wherein the photoacid generator (B) is contained in the composition in a ratio of 8 to 20 mass % based on the total solids of the composition.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, wherein (B) the compound capable of generating an acid upon irradiation with an actinic ray or radiation is contained in an amount of 10 to 30 mass % based on the entire solid content of the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method uses the composition.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, wherein when a film having a film thickness of 100 nm is formed from the actinic ray-sensitive or radiation-sensitive resin composition, the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm, and a pattern forming method using the composition are provided.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition comprising (A) a fluorine-containing compound capable of generating an acid upon irradiation with an actinic ray or radiation, wherein the acid has a polarity converting group, and the fluorine content of the fluorine-containing compound (A) is 20% or more based on the molecular weight of the fluorine-containing compound (A).

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition excelling in the LWR, pattern collapse performance and DOF, and a method of forming a pattern using the same. The composition according to the present invention contains (A) a resin containing a repeating unit with any of partial structures of general formula (I) below, (B) a compound (PA) as defined in the specification, and (C) a compound being configured to generate an acid when exposed to actinic rays or radiation, wherein the resin is contained in an amount of 50 mass % or more based on total solids of the composition.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method each using the composition are provided, the composition including: (A) a resin containing a repeating unit having a specific lactone structure and a repeating unit having a specific sulfonamide structure and being capable of increasing the solubility of the resin (A) in an alkali developer by the action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation.

Abstract: A positive photosensitive composition, includes: (A) a resin having a repeating unit represented by formula (1) as defined in the specification and a repeating unit represented by formula (2) as defined in the specification and being capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; and a solvent, and a pattern forming method uses the positive photosensitive composition.

Abstract: Provided is a positive resist composition using a resin having, in the polymer main chain, a specific acid decomposable structure and further having, in the side chain thereof, several specific acid decomposable groups, satisfactory in an exposure latitude, a focus latitude, and pattern collapse prevention at a high level, and having reduced development defects; and a pattern forming method.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes any of the compounds (A) of general formula (I) below that when exposed to actinic rays or radiation, generates an acid and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.

Abstract: A positive resist composition and a pattern forming method using the resist composition are provided, the resist composition including: (A) a resin containing a repeating structural unit represented by formula (I) as defined in the specification and being capable of decomposing by an action of an acid to increase the solubility in an alkali developer; (B) an acid generator; and (C) a mixed solvent containing at least one solvent selected from the group consisting of the following Group (a) and at least one solvent selected from the group consisting of the following Groups (b) to (d): Group (a): an alkylene glycol monoalkyl ether, Group (b): an alkylene glycol monoalkyl ether carboxylate, Group (c): a linear ketone, a branched chain ketone, a cyclic ketone, a lactone and an alkylene carbonate, and Group (d): a lactic acid ester, an acetic acid ester and an alkoxypropionic acid ester.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound (A) that when exposed to actinic rays or radiation, generates any of the acids of general formula (II) below and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.

Abstract: A polymer compound having a structure represented by the formula (1) as defined herein at a main chain terminal, and a positive photosensitive composition containing a polymer compound having a structure represented by the following formula (1) as defined herein at a main chain terminal and a photoacid generator capable of generating an acid upon irradiation with actinic rays or radiation.