Abstract: In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Abstract: In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working drive units, board conveying/holding devices, recognition cameras and so forth are also arranged in the work area. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

Abstract: A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Abstract: In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

Abstract: In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Abstract: In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working their drive units, board conveying/holding devices recognition cameras and so forth are also arranged. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

Abstract: A cart comprises a base frame, driver for extending an operational stroke of a hydraulic jack and transferring this movement into an up and down motion, a pair of elevating rods simultaneously lifted of lowered by movement of the driver, a pair of supporting frames for operably supporting the elevating rods by virtue of guide rollers, and a holder fixed to the elevating rods for lifting and lowering the component supply unit, wherein a multi purpose space is formed surrounded by the driver, the elevating rods, and the holder. By using a positioning mechanism containing a structure where a positioning pin of a fixing device fits into a V-shaped slot formed on a component supply unit side, a component supply unit may be positioned in two different directions by pushing the component supply unit in a single direction.

Abstract: In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Abstract: A component suction device includes a suction nozzle for sucking and holding a component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device which is located above the nozzle turning device and which is connected to the suction nozzle for moving up and down the suction nozzle along an axial direction of the suction nozzle.

Abstract: An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working their drive units, board conveying/holding devices recognition cameras and so forth are also arranged. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: In a component placement recognition mark recognizing device for recognizing recognition marks for component placement that are provided corresponding to component placement positions where components are to be placed in a plurality of partition areas on a board. The device has a recognition camera for recognizing the recognition marks straightly disposed in the plurality of areas and a moving device for running the recognition camera at a generally uniform velocity in a deposition direction in which the recognition marks are straightly disposed. The recognition marks are recognized with use of the recognition camera while the recognition camera is run by the moving device.

Abstract: In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working their drive units, board conveying/holding devices recognition cameras and so forth are also arranged. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.