Patents by Inventor Akira Miyata

Akira Miyata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11881504
    Abstract: A semiconductor device according to the present disclosure includes: a first conductivity-type silicon substrate including a cell part and a termination part surrounding the cell part in plan view; a first conductivity-type emitter layer provided on a front surface of the silicon substrate in the cell part; a second conductivity-type collector layer provided on a back surface of the silicon substrate in the cell part; a first conductivity-type drift layer provided between the emitter layer and the collector layer; a trench gate provided to reach the drift layer from a front surface of the emitter layer; and a second conductivity-type well layer provided on the front surface of the silicon substrate in the termination part. Vacancies included in a crystal defect in the cell part are less than vacancies included in a crystal defect in the termination part.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: January 23, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenji Suzuki, Yuki Haraguchi, Haruhiko Minamitake, Taiki Hoshi, Takuya Yoshida, Hidenori Koketsu, Yusuke Miyata, Akira Kiyoi
  • Patent number: 11871682
    Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: January 9, 2024
    Assignee: NEC CORPORATION
    Inventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
  • Publication number: 20230410779
    Abstract: An electronic device includes: a memory including a data region that stores data; a display device; and at least one processor. At least one processor executes: first boot processing in which a boot time is constant irrespective of a usage state of data in the data region, first output processing of outputting information of a first pattern to the display device during execution of the first boot processing, second boot processing in which a boot time varies depending on a usage state of the data, and second output processing of outputting information of a second pattern to the display device until the second boot processing is completed.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 21, 2023
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Shingo OKANO, Tomoya KAJIKAWA, Osamu MORIYAMA, Shinichi MORITANI, Yutaro ICHIMURA, Akira MIYATA, Ken TERAO
  • Publication number: 20230393359
    Abstract: An optical fiber cable includes: optical fibers each including a glass portion including a core and a cladding surrounding the core, a primary covering layer covering the cladding, and a secondary covering layer covering the primary covering layer; and a sheath accommodating the optical fibers in an internal space. A value of a micro-bend loss characteristic factor F?BL_GO is 5.
    Type: Application
    Filed: July 6, 2021
    Publication date: December 7, 2023
    Applicant: Fujikura Ltd.
    Inventors: Miku Miyata, Akira Murata
  • Publication number: 20230393332
    Abstract: An optical fiber cable includes: optical fibers each including a glass portion including a core and a cladding surrounding the core, a primary covering layer covering the cladding, and a secondary covering layer covering the primary covering layer; and a sheath accommodating the optical fibers in an internal space. A value of a micro-bend loss characteristic factor F?BL_G?? is 1.2×10?9 or less when represented by F?BL_G??=F?BL_G×F?BL_??×Dc.
    Type: Application
    Filed: July 6, 2021
    Publication date: December 7, 2023
    Applicant: Fujikura Ltd.
    Inventors: Miku Miyata, Akira Murata
  • Publication number: 20230387218
    Abstract: A semiconductor device includes a drift region that is of first conductive type and formed in a semiconductor substrate; a hydrogen buffer region that is of first conductive type, positioned on the back surface side of the drift region, contains hydrogen as impurities, and has impurity concentration higher than impurity concentration of the drift region; a flat region that is of first conductive type, positioned on the back surface side of the hydrogen buffer region, and has impurity concentration higher than impurity concentration of the drift region; and a carrier injection layer that is of first or second conductive type, positioned on the back surface side of the flat region, and has impurity concentration higher than impurity concentrations of the hydrogen buffer region and the flat region. The hydrogen buffer region and the flat region each have a constant oxygen concentration of 1E16 atoms/cm3 to 6E17 atoms/cm3 inclusive.
    Type: Application
    Filed: February 1, 2023
    Publication date: November 30, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Taiki HOSHI, Kenji SUZUKI, Yuki HARAGUCHI, Haruhiko MINAMITAKE, Hidenori KOKETSU, Yusuke MIYATA, Akira KIYOI
  • Patent number: 11830409
    Abstract: A peripheral image display device is configured to: acquire wheel speeds of a vehicle; determine a slip state or a non-slip state of a wheel of the vehicle based on the acquired wheel speeds; acquire multiple camera images from respective cameras; store, as a past image, the camera image indicating a range in a traveling direction of the vehicle; generate a peripheral image indicating a periphery of the vehicle by synthesizing the camera images, display the peripheral image on a display. In the non-slip state, the peripheral image display device displays a transparent image showing, in a transparent manner, a portion under a floor of the vehicle using the past image selected based on current wheel speeds is. In the slip state, the peripheral image display device deactivates the display of the transparent image.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: November 28, 2023
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shinya Aoki, Yoshitsugu Yamashita, Akira Sugie, Tomoki Miyata, Jun Kamishima, Yamato Yorifuji, Kohei Maejima
  • Publication number: 20230363293
    Abstract: A superconducting quantum circuit apparatus includes a resonator including a SQUID including at least two Josephson junctions in a loop, a magnetic field application part that includes a conductor portion, a current passing therethrough generating a magnetic flux penetrating through the SQUID, the current supplied from a current control part, and a parallel LC circuit including an inductor and a capacitor each made of a superconducting material, the inductor and the capacitor having respective one ends connected in common to the magnetic field application part and respective other ends connected in common to a current path from the current control part.
    Type: Application
    Filed: January 26, 2023
    Publication date: November 9, 2023
    Applicant: NEC Corporation
    Inventors: Akira Miyata, Tsuyoshi Yamamoto
  • Patent number: 11805708
    Abstract: A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: October 31, 2023
    Assignee: NEC CORPORATION
    Inventors: Katsumi Kikuchi, Akira Miyata, Suguru Watanabe, Takanori Nishi, Hideyuki Satou, Kenji Nanba, Ayami Yamaguchi
  • Publication number: 20230345844
    Abstract: Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess 31 formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.
    Type: Application
    Filed: June 5, 2020
    Publication date: October 26, 2023
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Patent number: 11798895
    Abstract: A quantum device (100) includes an interposer (112), a quantum chip (111) mounted on the interposer (112), and a shield part (150) provided so as to surround a quantum circuit region of the interposer (112) and the quantum chip (111). Accordingly, the quantum device (100) is able to prevent interference in the quantum circuit region due to exogenous noise.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: October 24, 2023
    Assignee: NEC CORPORATION
    Inventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
  • Publication number: 20230309419
    Abstract: A quantum device includes a chip including a superconducting circuit, a first wiring substrate, a second wiring substrate, first connection portions connecting the chip and a wiring layer on a first surface of the first wiring substrate and second connection portions connecting the second wiring substrate and a wiring layer on a second surface of the first wiring substrate, wherein one or more second connection portions arranged in a first row as viewed from the edge of the first substrate are provided at positions corresponding respectively to one or more of the first connection portions arranged in a first row as viewed from the edge and are arranged closer to the edge than the first connection portions arranged in the first row.
    Type: Application
    Filed: March 17, 2023
    Publication date: September 28, 2023
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira Miyata, Takanori Nishi, Kenji Nanba, Ayami Yamaguchi
  • Publication number: 20230276717
    Abstract: Provided are an oscillator and a quantum computer capable of suppressing an occupied area of a circuit. An oscillator (300) includes a resonator (100) including a plurality of loop circuits in which a first superconducting line (112a), a first Josephson junction (111a), a second superconducting line (112b), and a second Josephson junction (111b) are annularly connected, and a magnetic field application circuit (200) including an electrode that goes around in a predetermined shape and configured to apply a magnetic field to the loop circuit, in which the electrode is arranged so as to face at least two of the loop circuits.
    Type: Application
    Filed: June 5, 2020
    Publication date: August 31, 2023
    Applicant: NEC Corporation
    Inventors: Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Tomohiro YAMAJI, Tsuyoshi YAMAMOTO, Yoshihito HASHIMOTO
  • Publication number: 20230237362
    Abstract: Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip (10) is flip-chip mounted on an interposer (20) by a bump (30). A coplanar line (12) coupling adjacent quantum bits is formed on the quantum chip (10). A gap (22) is provided, in the interposer (20), at a location facing a center conductor (12a) of the coplanar line (12). A second ground electrode (24) is formed around gap (22). The interposer (20) has a connection electrode (40) connecting the second ground electrode (24) around the gap (22). A bump (30A) formed in the vicinity of the connection electrode (40) is connected to the first ground electrode (12b) and the second ground electrode (24).
    Type: Application
    Filed: June 5, 2020
    Publication date: July 27, 2023
    Applicant: NEC Corporation
    Inventors: Akira MIYATA, Katsumi KIKUCHI, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Tomohiro YAMAJI, Tsuyoshi YAMAMOTO, Yoshihito HASHIMOTO
  • Patent number: 11696517
    Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: July 4, 2023
    Assignee: NEC CORPORATION
    Inventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou
  • Patent number: 11586397
    Abstract: A printing system includes an information processing apparatus including first circuitry and an image forming apparatus. The first circuitry is configured to receive designation of superimposing an image of a particular color on a print target image, associate the image of the particular color with the print target image in response to a reception of the designation of superimposing, and transmit print data including the print target image and the image of the particular color to the image forming apparatus. The image forming apparatus includes second circuitry configured to receive the print data and interpret the print data, and a printer engine configured to superimpose the image of the particular color on the print target image in printing, according to interpretation of the print data.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: February 21, 2023
    Assignee: Ricoh Company, Ltd.
    Inventor: Akira Miyata
  • Publication number: 20230004332
    Abstract: A printing system that is communicable with an image management server through a network includes an information processing apparatus and an image forming apparatus. The information processing apparatus controls a display to display a print setting screen for receiving a print setting that designates printing of a specific color image superimposed on an image to be printed, transmits the specific color image corresponding to the print setting to the image management server, acquires storage location information from the image management server, and transmits print data to the image forming apparatus. The image forming apparatus includes a printer. The image forming apparatus receives the print data, acquires the specific color image from the image management server, generates image data for overprinting the specific color image on the image to be printed, and controls the printer to perform printing based on the image data.
    Type: Application
    Filed: June 27, 2022
    Publication date: January 5, 2023
    Inventor: Akira MIYATA
  • Publication number: 20220344562
    Abstract: A quantum device according to an example embodiment includes: a quantum chip with a first surface and a second surface located on a side opposite to the first surface, in the quantum chip, at least a part of a qubit circuit being provided on the second surface; a first interposer with a third surface and a fourth surface located on a side opposite to the third surface, the first interposer being connected to the quantum chip in such a manner that the second surface of the quantum chip is opposed to the third surface of the first interposer; and a second interposer with a fifth surface and a sixth surface located on a side opposite to the fifth surface, the second interposer being connected to the first interposer in such a manner that the fourth surface of the first interpose is opposed to the fifth surface of the second interposer.
    Type: Application
    Filed: April 4, 2022
    Publication date: October 27, 2022
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Takanori NISHI, Kenji NANBA, Ayami YAMAGUCHI
  • Publication number: 20220011988
    Abstract: A printing system includes an information processing apparatus including first circuitry and an image forming apparatus. The first circuitry is configured to receive designation of superimposing an image of a particular color on a print target image, associate the image of the particular color with the print target image in response to a reception of the designation of superimposing, and transmit print data including the print target image and the image of the particular color to the image forming apparatus. The image forming apparatus includes second circuitry configured to receive the print data and interpret the print data, and a printer engine configured to superimpose the image of the particular color on the print target image in printing, according to interpretation of the print data.
    Type: Application
    Filed: June 16, 2021
    Publication date: January 13, 2022
    Applicant: Ricoh Company, Ltd.
    Inventor: Akira Miyata
  • Publication number: 20210408358
    Abstract: A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); a predetermined signal line (w1) arranged in the wiring layer of the quantum chip (111); first shield wires (ws1) arranged in the wiring layer of the quantum chip (111) along the predetermined signal line (w1); a second shield wire (ws2) arranged in the wiring layer of the interposer (112); and a second connection part (150) that is provided between the interposer (112) and the quantum chip (111) so as to contact the first shield wires (ws1) and the second shield wire (ws2).
    Type: Application
    Filed: June 23, 2021
    Publication date: December 30, 2021
    Applicant: NEC Corporation
    Inventors: Kenji Nanba, Ayami Yamaguchi, Akira Miyata, Katsumi Kikuchi, Suguru Watanabe, Takanori Nishi, Hideyuki Satou