Abstract: To make a composite article comprising a copper element and an adhesive material adhesively bonded to a surface thereof, the surface of the copper element is provided with knife-shaped elongate projections whose opposite flanks are at an average angle of less than 60.degree. to each other. The knife-shaped elongate projections may include rod-shaped projections much smaller than the knife-shaped projections projecting outwardly from the surface of the knife-shaped projections. The knife-shaped projections may be formed by electroless plating and the rod-shaped projections by oxidation and optionally reduction. Bonding strength is improved.

Abstract: A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

Abstract: The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

Abstract: A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

Abstract: A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

Abstract: Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.

Abstract: An anchoring structure is disclosed for connecting to a casing of an optical submarine repeater or a cable joint box an optical submarine cable which is composed of a cylindrical pressure proof layer formed by a combination of three deformed metal wires of the same sectorial cross-section and disposed inside an insulator so that the pressure proof layer has centrally thereof a circularly-sectioned optical fiber unit housing space for housing an optical fiber unit formed by at least one optical fiber, a cable tensile-strength member formed by a plurality of tensile-strength wires disposed concentrically with the cylindrical pressure proof layer on the outside thereof and a metallic tape layer disposed in a cylindrical form outside the tensile-strength member to extend in its axial direction, the seam of the metallic tape layer being welded and the insulator being disposed outside the metallic tape layer.

Abstract: The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.

Abstract: A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.