Abstract: Piezoelectric ceramics whose mechanical quality factor Qm is small and which has an excellent heat resistance, e.g. piezoelectric ceramics for filtering elements whose group delay time characteristic is flat, phase distortion is small and which can be accommodated to surface mounting, and a method for stably producing it are provided. Manganese oxide and lead oxide are caused to coexist in high concentration in grain boundary parts of the piezoelectric ceramics containing composite oxides of at least lead, zirconium and titanium as compared to intra-crystal grains of the piezoelectric ceramics. It is manufactured by treating the piezoelectric ceramics by heat after adhering manganese and lead compounds on the surface thereof to diffuse the oxides in the grain boundary parts of the piezoelectric ceramics.

Abstract: A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.

Abstract: An anti-theft apparatus prevents a delay in engine start caused by an ID legitimacy determination performed by an immobilizer. When an ignition key is operated, a starter motor is immediately energized and an engine control unit and a theft detector are actuated at the same time. Then, when independent running of the engine is detected by a detector, an immobilization determining section determines whether an enable code has been provided from the theft detector. If no enable code is present, then the immobilization determining section issues a halt command to the engine control unit. Thus, as soon as the key is turned to the on-position, the engine is started, thereby preventing a delay in engine start caused by the ID determination performed by the immobilizer.

Abstract: A vehicle anti-theft system in which, only when the ID signal is obtained from a right ignition key and when the vehicle anti-theft function is halted by the failure of an anti-theft circuit or theft detection unit itself, the start-up of the engine is permitted. The system comprises a unit for generating a start-up enable signal in response to a verification signal representing a right ID signal, and an engine control unit for performing the start-up control of the engine in response to the start-up enable signal and disabling the engine in response to a theft signal. The start-up enable signal generating unit generates a start-up enable signal in response to the fault signal. A dummy line for detecting a breakage is wired along various signal lines wired on the substrate of an immobilizer, which, if intentionally broken by an ill-intentioned third party, could cause a fault signal similar to that for the failure of the immobilizer to be outputted from a determination signal output terminal.

Abstract: A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.

Abstract: A vehicle anti-theft system in which a registration of an ID code of a new key to a vehicle side cannot easily be made by an ill-intentioned third party. Provided are a first memory for storing ID codes of operation keys and a second memory for storing an ID code of an L-key. Of a particular ID code of an inserted key has been registered as an operation key in the first memory, an immobilizer code stored in an immobllizer code memory is sent out to an engine ECU to enable the engine to be started up, and if the registered L-key is inserted, and operation keys are successively inputted, the renewal mode for the ID code is activated to rewrite the ID codes of the previously registered operation keys with ID codes of subsequently inserted operation keys in the first memory.

Abstract: A vehicle antitheft system comprising an ID code compare unit for comparing a key ID code obtained from an ignition key with a reference ID code stored in advance in the vehicle and generating an enable signal when these ID codes are in a preset relationship (for example, both codes are identical), an engine ECU for receiving the enable signal and enabling control of the engine when the enable signal is correct and a delay times that is started in response to generation of the enable signal and generates a signal which enables starting of the motor starter after the lapse of a preset time period following the generation of the enable signal (for example, at least period necessary for the engine ECU to store or identify the enable signal).

Abstract: A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is an unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

Abstract: The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

Abstract: A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

Abstract: Provided are N-(9-fluorenylmethoxycarbonyl)-4-substituted proline derivatives represented by the following formula (I): ##STR1## wherein Q is O or S, R represents a particular monovalent group, and T represents H or --C(CH.sub.3).sub.3. Where T is H, the derivatives can each be prepared by reacting a corresponding electron attractive compound with N-(9-fluorenylmethoxycarbonyl)-4-hydroxyproline in the presence of a coupling reagent. The derivatives in which T stands for --(CH.sub.3).sub.3 can each be prepared by reacting the corresponding N-(9-fluorenylmethoxy-carbonyl)-4-hydroxyproline derivative with isobutylene in the presence of a catalytic amount of sulfuric acid. The staring material, N-(9-fluorenylmethoxycarbonyl)-4-hydroxyproline, can be purified by adsorbing it on anhydrous magnesium sulfate.

Abstract: A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

Abstract: According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant.A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.

Abstract: A flame-retardant resin composition contains a prepolymer represented by the general formula: ##STR1## wherein R.sub.1 stands for a hydrogen atom or an unreactive saturated group; R.sub.2 stands for a reactive unsaturated group; m and n each stand for a positive number of 1 to 4 and X and Y are each a copolymerization ratio and are in the range of 0.3 to 0.7 with the proviso that the sum total of X and Y is 1,as an essential component.

Abstract: The present invention provide a thermosetting resin composition comprising(a) a poly-p-hydroxstyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and from more than denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

Abstract: A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.

Abstract: The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

Abstract: The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.

Abstract: A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):A--R.sub.1 --A (I)wherein R.sub.1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): ##STR1## wherein X is a fluorine atom, a bromine atom and a chlorine atom, R.sub.2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and ##STR2## m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.

Abstract: A circuit board, which comprises an insulating substrate, a copper wiring having a coarsely roughened surface provided on the insulating substrate, and a copper oxide-reduced layer provided on the coarsely roughened surface of the copper wiring and formed by reduction of copper oxide and electroless plating, the copper oxide-reduced layer having a finely roughed surface and having a deposited layer of at least one of nickel and cobalt, where the copper oxide-reduced layer having a deposited layer of at least one of nickel and cobalt on the surface is roughened in a range of 0.05 to 5 .mu.m in terms of a maximum vertical distance between the top of convex parts and the bottom of concave parts of the copper oxide-reduced layer per .mu.m of the longitudinal distance of the copper oxide-reduced layer, and at least one of nickel and cobalt is deposited in an amount of 5.times.10.sup.-7 to 1.times.10.sup.-4 g/cm.sup.2 on the copper oxide-reduced layer, has a high adhesiveness to an insulating resin.