Patents by Inventor Akira Nakamura

Akira Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11605002
    Abstract: The present technology relates to a program, an information processing method, and an information processing apparatus that make it possible to easily design network. A program according to one aspect of the present technology is a program causing a computer to serve as: a generating unit that generates, in response to specification of a data set including data for learning, a network for inference execution and a network for learning corresponding to the data set; and a learning unit that inputs the data for learning to the network for learning and performs learning of the network for inference execution. The present technology is applicable to a program that supports network design by Deep Learning.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: March 14, 2023
    Assignee: SONY CORPORATION
    Inventors: Naoki Ide, Yoshiyuki Kobayashi, Akira Nakamura, Yukio Oobuchi
  • Publication number: 20230052583
    Abstract: Provided is a production apparatus of a non-aqueous electrolyte solution that can produce conveniently and at a low cost the non-aqueous electrolyte solution while readily controlling an acidic impurity concentration so as to be in a prescribed level. The production apparatus of the non-aqueous electrolyte solution includes an original liquid tank that stores a liquid to be processed containing a non-aqueous electrolyte solution, and an ion-exchange resin container that accommodates a weakly basic anion-exchange resin, and also including a liquid circulation pipe that returns the liquid to be processed that is obtained after flowing the liquid to be processed from the original liquid tank through the ion-exchange resin container to the original liquid tank.
    Type: Application
    Filed: October 9, 2020
    Publication date: February 16, 2023
    Applicant: ORGANO CORPORATION
    Inventors: Kenta AIBA, Akira NAKAMURA
  • Patent number: 11517999
    Abstract: A novel polishing apparatus which determines a polishing end point of a substrate on the basis of a strain of a constituent element of the polishing apparatus caused by friction between a substrate such as a wafer and a polishing pad. The polishing apparatus includes a rotatable polishing table which supports a polishing pad, a polishing head which presses the substrate against the polishing pad, a rotating shaft connected to the polishing head, a support structure which rotatably supports the rotating shaft, a strain measuring instrument which measures a strain of the support structure, and an end point detector which determines a polishing end point of the substrate on the basis of a change in the strain. The strain measuring instrument includes at least one strain sensor fixed to the support structure.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: December 6, 2022
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Publication number: 20220371151
    Abstract: Included are a polishing table provided with an eddy current sensor, the polishing table configured to rotate; a polishing head configured to face the polishing table, the polishing head configured to rotate, the polishing head having a surface which faces the polishing table and to which a substrate is configured to be attached; and a processor configured to generate preprocessed data on a target substrate by executing predetermined preprocessing on an output signal when the eddy current sensor is at each position facing a target substrate during polishing processing of a target substrate to determine a metal line height at at least one position of the target substrate by inputting preprocessed data on the target substrate to a learned machine learning model using a learning data set in which data after predetermined preprocessing is executed on an output signal when the eddy current sensor is at each position facing a substrate is set as an input and a metal line height at at least one position of the subst
    Type: Application
    Filed: September 16, 2020
    Publication date: November 24, 2022
    Inventor: Akira NAKAMURA
  • Publication number: 20220363487
    Abstract: A conveyance abnormality prediction system includes an estimation unit that has a learned model having machine learned a relationship between a data set including sensor data outputted, at a time of substrate transport in the past, from each of a plurality of sensors provided on a substrate transport unit and a degree of conveyance abnormality at the time of the substrate transport, estimates a degree of conveyance abnormality at a time of new substrate transport by using, as an input, a data set including sensor data outputted from each of the plurality of sensors at the time of the new substrate transport, and outputs the estimated degree of conveyance abnormality.
    Type: Application
    Filed: September 18, 2020
    Publication date: November 17, 2022
    Inventor: Akira NAKAMURA
  • Publication number: 20220344164
    Abstract: A device includes: state information acquisition unit that acquires state information including position of substrate in the device and elapsed time in each unit; action selection unit having prediction model that predicts value, in a certain state, to performing action whether to take out new substrate from the cassette and to which processing unit substrate is transferred, the action selection unit selecting one action based on the prediction model taking, as input, the acquired state information; instruction signal transmission unit that transmits instruction signal so as to perform the selected action; operation result acquisition unit that acquires operation result including number of substrates processed and waiting time; and prediction model update unit that calculates reward based on acquired operation result such that reward increases as the number of substrates processed increases and waiting time is short and that updates the prediction model based on the reward.
    Type: Application
    Filed: September 10, 2020
    Publication date: October 27, 2022
    Inventors: Akira NAKAMURA, Takamasa NAKAMURA, Tsuneo TORIKOSHI, Hirofumi OTAKI
  • Publication number: 20220319777
    Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.
    Type: Application
    Filed: March 22, 2022
    Publication date: October 6, 2022
    Applicant: TDK CORPORATION
    Inventors: Noriyuki SAITO, Osamu HIROSE, Toru YOSHIDA, Yoshinori SATO, Akira SUDA, Akira NAKAMURA
  • Publication number: 20220319767
    Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and side surfaces configured to extend to intersect the bottom surface, and a bottom surface electrode formed on the bottom surface of the element body, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, the first electrode layer is a resin electrode laminated to cover the second electrode layer, and has a stretched portion configured to extend to the side surface, and a width dimension of the stretched portion is smaller than a width dimension of the first electrode layer on the bottom surface.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 6, 2022
    Applicant: TDK CORPORATION
    Inventors: Noriyuki SAITO, Yoshinori SATO, Toru YOSHIDA, Akira SUDA, Akira NAKAMURA
  • Publication number: 20220316863
    Abstract: A method of producing a model capable of reducing an influence of spectral variation of reflected light from a workpiece, such as a wafer, and capable of determining an accurate film thickness is disclosed. The method includes: determining sample features representing features of sample spectra of reflected lights from a sample having a film; obtaining similarities by calculating a similarity between each of the sample spectra and a representative spectrum; and producing a film-thickness estimation model by performing machine leaning using training data including the sample features, the similarities, and film thicknesses corresponding to the sample spectra.
    Type: Application
    Filed: March 28, 2022
    Publication date: October 6, 2022
    Inventors: Nachiketa CHAUHAN, Keita YAGI, Akira NAKAMURA, Rohit KAWDE
  • Patent number: 11435968
    Abstract: A method for an information processing apparatus, comprising: acquiring first information to be used to establish connection to a connection target access point and second information concerning a communication apparatus to be connected to the access point by imaging a first image displayed on a display unit of another information processing apparatus connected to the access point; establishing wireless connection to the communication apparatus based on the second information acquired in the acquiring the first information; and transmitting the first information to the communication apparatus to cause the communication apparatus to try connection to the access point.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 6, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akira Nakamura, Yoshinori Yamaguchi
  • Patent number: 11421315
    Abstract: [Object] To provide a sputtering target with further improved sputtering efficiency, and a method of producing the sputtering target. [Solving Means] In order to achieve the above-mentioned object, a sputtering target according to an embodiment of the present invention is a cobalt target having a sputtering surface and a purity of 99.95 wt % or more. An intensity ratio (I(002)+I(004))/(I(100)+I(002)+I(101)+I(102)+I(110)+I(103)+I(112)+I(004)) of X-ray diffraction peaks corresponding to a (100) plane, a (002) plane, a (101) plane, a (102) plane, a (110) plane, a (103) plane, a (112) plane, and a (004) plane of a hexagonal close-packed lattice structure along the sputtering surface is 0.85 or more.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 23, 2022
    Assignee: Ulvac, Inc.
    Inventors: Xiaoli Lu, Junichi Nitta, Akira Nakamura, Miho Satou
  • Patent number: 11416190
    Abstract: An information processing apparatus for communicating with a printing apparatus includes a generation unit configured to generate, when communication with the printing apparatus using first port setting information in a print queue for the printing apparatus is disabled, second port setting information that is different from the first port setting information and that enables communication with the printing apparatus, the generation of the second port setting information being based on information acquired from the printing apparatus; and a change unit configured to change port setting information in the print queue from the first port setting information to the second port setting information.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: August 16, 2022
    Assignee: Canon Kabushiki Kaisha
    Inventor: Akira Nakamura
  • Patent number: 11376704
    Abstract: To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: July 5, 2022
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Patent number: 11331764
    Abstract: A polishing device includes a polishing table comprising a polishing surface, a top ring configured to press a polishing target surface against the polishing surface and comprising a plurality of pressing portions configured to independently apply a pressing force to a plurality of areas of the wafer, and a controller configured to store a first pressing portion effect rate for a first pressing portion of the plurality of pressing portions in a storage unit, the first pressing portion effect rate being a change in polishing amount of the polishing target surface for a change in pressing force applied by the first pressing portion and control the pressing force applied by the first pressing portion based on the first pressing portion effect rate and a polishing profile of the polishing target surface.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: May 17, 2022
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Patent number: 11305272
    Abstract: An ion exchanger filled cartridge accommodated inside an accommodating container of a metal removing column and in which an ion exchanger is filled is provided. The ion exchanger filled cartridge includes a cylinder portion, an upper lid in which a through hole for a liquid to be treated is formed and which is provided on an upper end of the cylinder portion, a lower lid in which a through hole for a treated liquid is formed and which is provided on a lower end of the cylinder portion, an insertion pipe connected to the lower lid, having an O-ring attached to an outer side, and inserted into a treated liquid discharge pipe provided on a bottom portion of the accommodating container of the metal removing column, and the ion exchanger filled inside the cylinder portion.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: April 19, 2022
    Assignee: ORGANO CORPORATION
    Inventors: Noriko Takada, Akira Nakamura
  • Publication number: 20220105505
    Abstract: An apparatus for pretreating an ion exchange resin includes at least a stock solution tank for storing a non-aqueous solvent, an ion exchange resin container accommodating an ion exchange resin, and a moisture removal apparatus for removing moisture in the non-aqueous solvent, and at least one solution feed pipe selected from: a circulating solution feed pipe for returning, to the stock solution tank, the non-aqueous solvent that has passed through the ion exchange resin container and the moisture removal apparatus in this order from the stock solution tank; and a circulating solution feed pipe for returning, to the stock solution tank, the non-aqueous solvent that has passed through the moisture removal apparatus and the ion exchange resin container in this order from the stock solution tank.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 7, 2022
    Applicant: ORGANO CORPORATION
    Inventors: Kenta AIBA, Akira NAKAMURA
  • Publication number: 20210394338
    Abstract: A polishing apparatus comprises: a generation unit configured to generate time-series data of a feature value up to a target time point by using data regarding a frictional force between a polishing member and a target substrate up to the target time point during polishing or a temperature measurement data of the polishing member or the target substrate; and an prediction unit configured to input at least the time-series data of the feature value generated by the generation unit to a machine learning model trained with a training data set, and output an predicted value of a polishing amount or a residual film amount at the target time point during polishing of the target substrate.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 23, 2021
    Inventors: Akira Nakamura, Yuta Suzuki, Shunsuke Sekiyama
  • Publication number: 20210384557
    Abstract: Provided is an apparatus for producing a non-aqueous electrolytic solution capable of easily performing purification treatment by removal of acidic impurities such as hydrogen fluoride contained in a non-aqueous electrolytic solution. The apparatus for producing a non-aqueous electrolytic solution comprises an ion exchange unit accommodating a weakly basic anion exchange resin through which an alkali metal salt electrolyte-containing solution having the alkali metal salt electrolyte dispersed in an carbonate ester is passed to obtain the non-aqueous electrolytic solution, wherein the weakly basic anion exchange resin has a styrene-based resin as substrate and an amino group as weakly basic anion exchange group.
    Type: Application
    Filed: September 27, 2019
    Publication date: December 9, 2021
    Applicant: ORGANO CORPORATION
    Inventors: Kenta AIBA, Akira NAKAMURA, Eiya YAO
  • Publication number: 20210354050
    Abstract: The apparatus for producing a non-aqueous electrolytic solution includes: a moisture adsorption apparatus accommodating zeolite through which an organic non-aqueous solvent passes, an electrolyte addition apparatus for adding an alkali metal salt electrolyte to the organic non-aqueous solvent treated by the moisture adsorption apparatus, and an acid adsorption apparatus accommodating a weakly basic anion exchange resin through which an alkali metal salt electrolyte-containing solution obtained by the electrolyte addition apparatus passes.
    Type: Application
    Filed: September 27, 2019
    Publication date: November 18, 2021
    Applicant: ORGANO CORPORATION
    Inventors: Kenta AIBA, Akira NAKAMURA, Miwa ITO
  • Publication number: 20210291312
    Abstract: A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached there
    Type: Application
    Filed: March 18, 2021
    Publication date: September 23, 2021
    Inventors: Akira Nakamura, Tsuneo Torikoshi, Yuta Suzuki, Hisanori Matsuo, Takahito Kagoshima