Patents by Inventor Akira Nakamura

Akira Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transmission
    Patent number: 9951863
    Abstract: A controller is configured to determine a current gear ratio step determined on the basis of gear ratio calculation Rg to be actual gear ratio of revolution Nm of main shaft 3a and revolution Nc of counter shaft 3b as well as gear ratio map for defining gear ratio variable allowance range for each of gear ratio steps. When making a decision of status of the determined current gear ratio step, the controller is configured to make delay timer get started when the gear ratio calculation Rg goes within the gear ratio variable allowance range of next step and halt to make a decision of the current gear ratio step while the delay timer is activated. The controller is also configured to make a decision of the status of the current gear ratio step after a predetermined delayed time Tn*(n=1, 2, . . . ) is elapsed.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: April 24, 2018
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Toru Iwasaki, Mitsuhiro Nakamura, Hiroyuki Yoneyama, Akira Nakamura
  • Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
    Patent number: 9943943
    Abstract: A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: April 17, 2018
    Assignee: EBARA CORPORATION
    Inventors: Hiroyuki Shinozaki, Takahiro Shimano, Akira Imamura, Akira Nakamura
  • AUTOMATED NUCLEI AREA/NUMBER ESTIMATION FOR IHC IMAGE ANALYSIS
    Publication number: 20180101949
    Abstract: Automated nuclei area/number estimation utilizes a two-stage estimation framework-area estimation first followed by number estimation. After determining area information, each local patch's shape features are able to be extracted to define a local voting rule. The resulting voting score determines the strength of each local voting peak. The number of voting peaks is exactly the number of nuclei.
    Type: Application
    Filed: October 7, 2016
    Publication date: April 12, 2018
    Inventors: Su Wang, Xun Xu, Akira Nakamura
  • INFORMATION PROCESSING DEVICE
    Publication number: 20180082178
    Abstract: There is provided an information processing device to improve generalization performance of the neural network, the information processing device including: a control unit configured to control display related to a setting of a parameter related to physical simulation; a communication unit configured to transmit the parameter to a physical simulator and receive image information obtained in the physical simulation from the physical simulator; and a machine learning unit configured to perform machine learning on the basis of the image information. The control unit causes a display unit to display a learning result obtained by the machine learning unit and the parameter in association with each other.
    Type: Application
    Filed: December 27, 2016
    Publication date: March 22, 2018
    Applicant: SONY CORPORATION
    Inventors: Akira NAKAMURA, Takuya NARIHIRA, Takuya FUJITA
  • Annular device
    Patent number: 9921419
    Abstract: The object of the present invention is to provide an annular device superior to a conventional annular device in the stability over an eyeball when being worn, which overcomes problems caused by wearing a conventional annular device. The above object is attained by preparing an annular device to be worn over the surface of the sclera, the annular device including an opening exposing the cornea and one or a plurality of approximately encircling grooves on an intermediate part between an inner rim part and an outer rim part. The annular device has a maximum thickness preferably in the intermediate part.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: March 20, 2018
    Assignees: SEED CO., LTD., SENJU PHARMACEUTICAL CO., LTD
    Inventors: Akira Nakamura, Tsutomu Fukushima
  • FILM THICKNESS MEASURING DEVICE, POLISHING APPARATUS, FILM THICKNESS MEASURING METHOD AND POLISHING METHOD
    Publication number: 20180016676
    Abstract: Eddy current formable in a polishing target is detected as an impedance by an eddy current sensor. A resistance component and a reactance component of the impedance are associated with respective axes of a coordinate system having orthogonal axes, respectively. An angle calculator calculates the tangent of an intersection angle between a first straight line connecting a first point corresponding to an impedance for a zero film thickness, and a second point corresponding to an impedance for a non-zero film thickness, and a diameter of a circle passing through the first point. A film thickness calculator determines the film thickness from the tangent.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventor: Akira NAKAMURA
  • FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, FILM THICKNESS SIGNAL PROCESSING METHOD, AND POLISHING METHOD
    Publication number: 20180001437
    Abstract: A receiving unit receives sensor data output from an eddy current sensor for detecting the film thickness of a polishing object to generate film thickness data. A correcting unit corrects the film thickness data in an inside of the edge of the polishing object based on the film thickness data generated by the receiving unit. The correcting unit corrects the film thickness data generated by the receiving unit in the inside of the edge of the polishing object using the film thickness data generated by the receiving unit in an outside of the edge of the polishing object.
    Type: Application
    Filed: June 26, 2017
    Publication date: January 4, 2018
    Inventor: Akira NAKAMURA
  • POLISHING APPARATUS, POLISHING METHOD AND POLISHING CONTROL PROGRAM
    Publication number: 20170368661
    Abstract: A polishing unit polishes a semiconductor wafer. An eddy current sensor measures an eddy current variable according to variation of the film thickness of the semiconductor wafer at plural measurement times. A sensor processor calculates the film thickness of the semiconductor wafer at the measurement times based on the eddy current measured by the eddy current sensor. A film thickness estimating unit estimates film thicknesses after lapse of a processing delay time from the measurement times by using the calculated film thickness.
    Type: Application
    Filed: June 26, 2017
    Publication date: December 28, 2017
    Inventor: Akira NAKAMURA
  • Converter lens system
    Patent number: 9851626
    Abstract: There is provided converter lens system including a first lens that is a negative lens of which both surfaces are concave, a second lens that is a negative lens of which both an image plane side and an object side are convex toward an object side, and a third lens that is a positive lens of which both sides are convex. The first to third lenses are disposed in this order from the object side, and the converter lens system is inserted and used between an imaging lens and a camera.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: December 26, 2017
    Assignee: SONY CORPORATION
    Inventor: Akira Nakamura
  • Spray gun for coating, spray coating device, and method for producing electrophotographic photoconductor
    Patent number: 9846376
    Abstract: A spray gun, which contains: a coating liquid nozzle configured to discharge a coating liquid from an outlet; and a flow channel forming member configured to surround an outer perimeter surface of the coating liquid nozzle to form an air flow channel, through which atomizing air passes, between the outer perimeter surface of the coating liquid nozzle and the flow channel forming member, wherein the spray gun is configured to atomize the coating liquid with the atomizing air to spray the atomized coating liquid to a coating target, wherein a gap T of the narrowest part of the air flow channel is 0.48 mm or smaller, and wherein a ratio T/L of the gap T to a distance L from the narrowest part to an apical surface at which the outlet of the coating liquid nozzle is open is 0.60 or greater.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: December 19, 2017
    Assignee: RICOH COMPANY, LTD.
    Inventor: Akira Nakamura
  • SHIFT CHANGE PRACTICE DEVICE
    Publication number: 20170284543
    Abstract: A shift change practice device capable of improving the effect of learning a shift change operation is provided. The shift change practice device includes: an optimum speed calculation unit that calculates an optimum value or an optimum range of an engine revolution speed in the event of a shift change; a revolution speed comparison unit that determines whether or not a detected revolution speed that is a detected value of the engine revolution speed is equal to the optimum value or whether or not the detected revolution speed is included in the optimum range, in a state where a clutch is disconnected; and a notification instruction unit that instructs a notification device to give a predetermined notification to a driver when the detected revolution speed is equal to the optimum value or the detected revolution speed is included in the optimum range, in the state where the clutch is disconnected.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 5, 2017
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yuji Nishikawa, Akira Nakamura, Yoshiaki Nedachi
  • POLISHING APPARATUS
    Publication number: 20170259394
    Abstract: An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.
    Type: Application
    Filed: February 21, 2017
    Publication date: September 14, 2017
    Inventors: Taro TAKAHASHI, Akira NAKAMURA, Hiroaki SHIBUE, Mitsuo TADA
  • Balloon
    Patent number: 9751024
    Abstract: A balloon can maintain a bent state even if a bent state-holding member is not used. A balloon includes two plastic films that are stacked and sealed at a peripheral edge. The balloon includes a first part, a second part, and a bending part that is situated between the first part and the second part. The bending part includes a gas passage through which the interior of the first part and the interior of the second part communicate with each other, and a bending sealed part that is formed by sealing the two plastic films situated opposite to each other in an inward area relative to the peripheral edge. An outer edge of the bending sealed part extends beyond the bending part so as to be situated within the first part and the second part.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: September 5, 2017
    Assignee: Takara Kosan Co., Ltd.
    Inventors: Takemi Morita, Mitsunori Yoshida, Akira Nakamura, Satoru Taniguchi
  • Battery state control circuit, battery state control device, and battery pack
    Patent number: 9755439
    Abstract: A battery state control circuit is provided for connection to multiple rechargeable batteries, the multiple batteries being connected in series, for connection to a primary coil connected in series to the multiple batteries, and for connection to multiple secondary coils to which electrical energy stored in the primary coil is transferred, the multiple secondary coils being connected in parallel to the multiple batteries, respectively. The battery state control circuit includes an adjustment unit to adjust the energy amount stored in the primary coil, in accordance with a state of at least one of the multiple batteries.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: September 5, 2017
    Assignee: RICOH COMPANY, LTD.
    Inventors: Norifumi Yamamoto, Akira Nakamura
  • Characterizing pathology images with statistical analysis of local neural network responses
    Patent number: 9710695
    Abstract: For digital pathology imaging, intelligent processing, such as automatic recognition or content-based retrieval, is one significant benefit that drives the wide application of this technology. Before any intelligent processing on pathology images, every image is converted into a feature vector which quantitatively capture its visual characteristics. An algorithm characterizing pathology images with statistical analysis of local responses of neural networks is described herein. The algorithm framework enables extracting sophisticated textural features that are well adapted to the image data of interest.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: July 18, 2017
    Assignee: Sony Corporation
    Inventors: Xun Xu, Akira Nakamura, Su Wang
  • Hydraulic press brake
    Patent number: 9623463
    Abstract: The pump discharge volume of a bi-directional piston pump is set to a reference pump discharge volume Qa in condition where the actuation state of lift cylinders is a no-load state, and is set to a small-discharge pump discharge volume Qb smaller than the reference pump discharge volume Qa in condition where the actuation state of the lift cylinders is a high-load state. Qb·Pb which is the product of the pump discharge volume Qb and a pump discharge pressure Pb of the bi-directional piston pump in condition where the actuation state of the lift cylinders is the high-load state is set to be equal to or less than or approximately equal to a Qa·Pa which is the product of the pump discharge volume Qa and a pump discharge pressure Pa of the bi-directional piston pump in condition where the actuation state of the lift cylinders is the no-load state.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: April 18, 2017
    Assignee: AMADA COMPANY, LIMITED
    Inventors: Tomohiro Yukita, Akira Nakamura, Takanori Okubo
  • POLISHING APPARATUS
    Publication number: 20170095901
    Abstract: The polishing apparatus has: a polishing pad that has a polishing surface to polish a semiconductor wafer; a polishing table to which a back surface of the polishing pad on an opposite side of the polishing surface can be attached; a top ring that is opposed to the polishing surface, and can hold the semiconductor wafer; and an eddy current sensor that is arranged in the polishing table, and detects an end point of polishing. The polishing table has on an attachment surface a projection member projecting from the attachment surface to which the polishing pad is attached. The back surface of the polishing pad has a concave portion in a portion opposed to the projection member, and at least a part of the eddy current sensor is arranged inside the projection member.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 6, 2017
    Inventor: Akira NAKAMURA
  • EDDY CURRENT SENSOR
    Publication number: 20170057051
    Abstract: An eddy current sensor 1-50 arranged in the vicinity of a substrate includes a core part 1-60 and a coil part 1-61. The core part 1-60 includes a common part 1-65, and four cantilever parts 1-66 to 69 connected to the common part 1-65. Ends of a first cantilever part 1-66 and a second cantilever part 1-67 are close and adjacent to each other. Ends of a third cantilever part 1-69 and a fourth cantilever part 1-68 are close and adjacent to each other. At the common part 1-65, an excitation coil is arranged. A first detection coil 1-631 is arranged at the first cantilever part 1-66 and a second detection coil 1-632 is arranged at the second cantilever part 1-67. A first dummy coil 1-642 is arranged at the third cantilever part 1-69, and a second dummy coil 1-641 is arranged at the fourth cantilever part 1-68.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 2, 2017
    Inventor: Akira NAKAMURA
  • METHOD OF CONTROLLING A SWITCH CIRCUIT, STORAGE STATUS ADJUSTING CIRCUIT, STORAGE STATUS ADJUSTING DEVICE AND STORAGE BATTERY PACK
    Publication number: 20170063109
    Abstract: The method is disclosed of controlling a switch circuit which includes a first switching unit configured to switch between energy accumulation and energy release in a coil, and second switching units configured to connect or disconnect a plurality of corresponding storage batteries with the coil. The method comprises a first step of performing an operation to switch on the first switching unit and to switch off the second switching units; and a second step of performing an operation to switch off the first switching unit and to switch on only one of the second switching units.
    Type: Application
    Filed: February 25, 2015
    Publication date: March 2, 2017
    Applicant: RICOH COMPANY, LTD.
    Inventors: Masami TAKAI, Akira NAKAMURA
  • Film thickness signal processing apparatus, polishing apparatus, film thickness signal processing method, and polishing method
    Patent number: 9555517
    Abstract: The present invention improves the accuracy of film thickness detection. A film thickness signal processing apparatus 230 is provided with a receiving unit 232 for receiving film thickness data output from an eddy-current sensor 210 for detecting the film thickness of a polishing object 102 along a surface to be polished thereof; an identifying unit 236 for identifying the effective range of the film thickness data on the basis of the film thickness data received by the receiving unit 232; and a correcting unit 238 for correcting the film thickness data within the effective range identified by the identifying unit 236.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: January 31, 2017
    Assignee: Ebara Corporation
    Inventors: Taro Takahashi, Hidetaka Nakao, Akira Nakamura