Abstract: A bonding apparatus comprising a cleaning chamber; cleaning means for irradiating energy waves to bonding surfaces in the cleaning chamber under a reduced pressure condition; bonding means for bonding metal bonding portions of objects to be bonded in an atmospheric air which have been taken out from the cleaning chamber; and carrying means for, with respect to at least one member of the objects to be bonded, carrying a foregoing object and an ensuing object substantially simultaneously in at least the carrying-in direction to the cleaning chamber and the carrying-out direction from the cleaning chamber. At the time of taking out the objects after cleaning into an atmospheric air and bonding them to each other, the carrying in, carrying out and delivery of objects to be bonded especially around the cleaning chamber can be performed smoothly within a short period of time, and mass production of desired bonded products can be realized at high throughput.

Abstract: A console box of the present invention has a box main body, a pair of sidewalls, and an armrest. The box main body is located between the sidewalls, and the armrest is located above the box main body. Each sidewall has a guide groove extending in the moving direction of the vehicle. The armrest has a pair of engaging pins. Each engaging pin is engaged with and slides along one of the guide grooves. Thus, the armrest smoothly slides along the moving direction of the vehicle.

Abstract: A chip mounting device of the present invention includes: an adhesive application unit 11; a temporary crimp unit 12; and a main crimp unit 13. In the unit 11, a camera 21 is used for detecting base material marks for each section region on a film base material 1 and substrate marks for each substrate pattern in the section region. The detected results are transferred to the unit 12. In the unit 12, a camera 45 is used for detecting base material marks, and the position of each substrate pattern is recognized on the basis of on the detection results and the positional data of each substrate pattern transmitted from the unit 11, thereby crimping chips temporarily. This enables the chips to be mounted with high precision even when the film base material 1 is expanded and contracted. In the unit 12, there is no detection of substrate marks, which minimizes a decrease in processing efficiency.

Abstract: A mounting method and a mounting device, the mounting method comprising the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned therearound until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing, whereby, since the part to be bonded and its vicinity can be locally and efficiently enclosed separably from surroundings, and the local chamber capable of properly varying the shape of the enclosed space can be formed interlockingly with the bonding operation while maintaining the enclosed state even at the time of bonding, a specified mounting can be easily performed by a small device.

Abstract: Positioning recognition marks (A, B, C, D) are read by movable recognition means (5) for positioning objects (2, 4) to be bonded to each other. An alignment method includes a step of reading the recognition marks (A, B, C, D) during movement of the recognition means (5) before its complete stop, and a step of identifying absolute positions of the recognition marks (A, B, C, D) by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition means (5). A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition means (5), and significantly reduce the alignment time and mounting tact.

Abstract: An air conditioner that comprises an exhaust heat recovery unit 3 for recovering exhaust heat in a heat transfer medium, a heat transfer medium passage 5a in which the heat transfer medium outputted from the exhaust heat recovery unit 3 flows, an auxiliary heating device 7, which is provided in the heat transfer medium passage 5a, for heating the heat transfer medium, an absorption chiller 9, to which the heat transfer medium passage 5a is connected, to be driven by heat of the heat transfer medium, a refrigerant passage 11a, through which a refrigerant outputted from the absorption chiller 9 flows, an indoor unit 13 to which the refrigerant is supplied through the refrigerant passage 11a, a heat transfer medium temperature detecting means 15 for detecting the temperature of the heat transfer medium flowing through the heat transfer medium passage 5a, a refrigerant temperature detecting means 17 for detecting the temperature of the refrigerant flowing through the refrigerant passage 11a, and a control portion

Abstract: A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract: A console box of the present invention has a box main body, a pair of sidewalls, and an armrest. The box main body is located between the sidewalls, and the armrest is located above the box main body. Each sidewall has a guide groove extending in the moving direction of the vehicle. The armrest has a pair of engaging pins. Each engaging pin is engaged with and slides along one of the guide grooves. Thus, the armrest smoothly slides along the moving direction of the vehicle.

Abstract: A console box of the present invention has a box main body, a pair of sidewalls, and an armrest. The box main body is located between the sidewalls, and the armrest is located above the box main body. Each sidewall has a guide groove extending in the moving direction of the vehicle. The armrest has a pair of engaging pins. Each engaging pin is engaged with and slides along one of the guide grooves. Thus, the armrest smoothly slides along the moving direction of the vehicle.

Abstract: A method of mounting a chip in which an underfill agent having specific viscosity behavior and a trigger temperature is applied to at least one of a substrate and the chip, bumps are press-contacted to electrodes, the underfill agent is spread around the press-contacted bumps and the electrodes between the chip and the substrate, the bumps are melted by heating while the bumps are embedded in the underfill agent to bond the molten bumps and the electrodes, and in melt-bonding the bumps, a time to wet-spread the molten bumps is kept before the underfill agent is cured. Highly reliable excellent bonding between the bumps and the electrodes can be achieved by thoroughly wet-spreading the molten bumps while secondary oxidation in the underfill agent does not occur, and the time required until the underfill agent is cured to a specified state, and further resultantly, the time required until the press of the chip is stopped can be shortened.

Abstract: Provided is a connecting structure for a vacuum pump, which can block propagation of electrical noise, generated by a main body of the vacuum pump. Between both ends of a connection piping for connecting the vacuum pump to a vacuum chamber of an apparatus to be connected with and evacuated by the vacuum pump, there is interposedly provided an electrical insulating portion formed of an insulating material so as to provide electrical insulation therebetween. The electrical insulation portion may be provided to a connection piping member such as a damper (or a valve depending on the connection arrangement) for absorbing mechanical vibrations.

Abstract: A method of accurately calibrating a movement control system of mark recognition means in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

Abstract: A method accurately calibrating a movement control system of mark recognition in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

Abstract: A noise absorbing structure for effectively absorbing noise in a wide frequency range includes a first noise absorbing portion that is hollow and includes one or more first holes. The structure further includes a second noise absorbing portion that is hollow and includes one or more second holes. The total area of the one or more first holes differs from the total area of the one or more second holes.

Abstract: Special-type tone generators are capable of tone generation corresponding to rendition-style designating data, while ordinary-type tone generators are incapable of such tone generation corresponding to rendition-style designating data. When performance data for the ordinary-type tone generator are acquired in a case where the special-type tone generator can be used, presence of a predetermined rendition style is detected on the basis of various control data included in the performance data, the control data in a portion of the performance data, corresponding to the predetermined rendition style, is converted into simple data that does not represent the predetermined rendition style, and also rendition-style designating data specifying the predetermined rendition style is added. In this way, the acquired performance data are reformed into performance data for the special-type tone generator.

Abstract: An ultra-low carbon steel slab having a carbon content of about 0.01 mass percent or less is produced by casting at a casting speed of more than about 2.0 m/min using a mold provided with a casting space having a short side length D of about 150 to about 240 mm and an immersion nozzle provided with discharge spouts each having a lateral width d, the ratio D/d being in the range of from about 1.5 to about 3.0. Accordingly, a ultra-low carbon steel slab can be obtained having superior surface quality without performing slab conditioning such as scarfing.

Abstract: Vibrations generated by a vacuum pump are prevented from propagating to external equipment such as an electron microscope. A casing (a separate casing portion and a casing main body) that houses a stator, stator blades, a rotor portion, and rotor blades as an exhaust function portion is connected to an inlet port portion in which an inlet port for sucking in a gas from the outside is formed, through an elastic member. An suction space between the casing and the inlet port portion is sealed by a bellows cylinder sealing means, and motion regulating members and motion regulating members and which regulate the amount of separation between the inlet port portion and the casing, and change shape due to relative motion between the two, are formed between the inlet port portion and the casing.

Abstract: A hybridoma producing a monoclonal antibody recognizing the C-terminus of human brain natriuretic peptide (hBNP) was cultivated in a medium or the abdominal cavity of a mouse to recover the monoclonal antibody from the medium or ascites accumulated in the abdominal cavity. An immunoassay for hBNP was established using the monoclonal antibody. The immunoassay for hBNP of the invention is so sensitive that the minimum detection limit is 1 pg/ml and can therefore determine the hBNP level in blood plasma directly, without the extraction of hBNP from blood plasma. It is useful for diagnosing diseases such as hypertension and the like, and states of the heart, kidney, and the like by using the increase/decrease of the hBNP level as an index.

Abstract: An alignment device comprising a movable table, a plurality of movable support means for movably supporting the movable table, means for reading a recognition mark, and a control means for controlling the drive of the movable support means based on information from the recognition means, wherein each movable support means comprises means having a pair of support blocks each provided to be able to contact/separate with/from the movable table and a pair of piezoelectric actuators each provided with expansible first, second and third piezoelectric elements connected to a support block and extending in each direction, and being capable of walking operation relative to the movable table by the operations of the respective piezoelectric actuators. An alignment accuracy up to a nanometer level can be attained, and the alignment device itself and therefore the entire apparatus incorporating the alignment device can be significantly reduced in thickness and size.

Abstract: A ceramic holder 2 is mounted on the lower end of a connecting block 30 of metal mounted on the lower end of a tool main body 1 of metal, such ceramic holder 2, a ceramic heater 4 and a ceramic presser 5 being sintered. In addition) the coefficient of linear expansion of the ceramic holder 2 is approximately equal to those of the ceramic heater 4 and ceramic presser 5; furthermore, the thermal conductivities of the ceramic holder 2 and ceramic presser 5 are greater as the pressure side of the ceramic presser 5 as seen from the ceramic heater 4 is approached and are smaller as the attaching surface side of the ceramic holder 2 is approached.