Abstract: To provide a vacuum pump that may heat a flow path of gas effectively with small electric power. A vacuum pump provided with an outer sleeve, a stator received in a hollow portion of the outer sleeve, a rotor received rotatably within the hollow portion of the outer sleeve for forming a flow path of gas in cooperation with the stator, a base to which the outer sleeve and the stator are to be fixed and supported, a heating electromagnet for generating heat by current supply and forming a magnetic field, a magnetic member forming a magnetic path of magnetic force by the heating electromagnet, and a heat radiation plate made of aluminum and fixed to the magnetic member.

Abstract: An alignment device comprising a movable table, a plurality of movable support means for movably supporting the movable table, means for reading a recognition mark, and a control means for controlling the drive of the movable support means based on information from the recognition means, wherein each movable support means comprises means having a pair of support blocks each provided to be able to contact/separate with/from the movable table and a pair of piezoelectric actuators each provided with expansible first, second and third piezoelectric elements connected to a support block and extending in each direction, and being capable of walking operation relative to the movable table by the operations of the respective piezoelectric actuators. An alignment accuracy up to a nanometer level can be attained, and the alignment device itself and therefore the entire apparatus incorporating the alignment device can be significantly reduced in thickness and size.

Abstract: A method and an apparatus for mounting: the method for bonding a plurality of objects to each other, comprising the steps of disposing, apart from each other, a first object, a second object and a holding means therefor, and a backup member having a reference positioning surface in this order, adjusting the parallelism of the second object or the holding means therefor relative to the reference positioning surface, adjusting the parallelism of the first object or the holding means therefor relative to the second object or the holding means therefor, bringing the first object into contact with the second object to temporarily bond both objects to each other, bringing the holding means for the second object into contact with the reference positioning surface of the backup member, and pressing both objects against each other for final bonding, whereby, finally, a highly reliable and accurate bonding state can be achieved.

Abstract: In a magnetic bearing apparatus provided at least with a touchdown bearing and a corrugated plate-like damper member inserted into an annular gap between the touchdown bearing and its retainer member, to keep on holding the corrugated plate-like damper member in a predetermined position without fail. A cylindrical retainer member 9 is a thrust bearing retainer member and also a touchdown bearing retainer member. A touchdown bearing 4, i.e., a pair of roller bearings 4a and 4b disposed in upper and lower stages are received in an inner circumferential portion of the cylindrical retainer member 9. An annular gap G is formed between the inner circumferential surface of the cylindrical retainer member 9 and outer races of the pair of roller bearings 4a and 4b. A pair of corrugated strip steel plates 8a and 8b that are the corrugated plate-like damper members are inserted into this annular gap G.

Abstract: A mounting method for bonding a first object having a metal joint part to a second object, comprising the steps of cleaning at least the surface of the metal joint part of the first object by irradiating an energy wave or energy particle beam, and thermally bonding the cleaned metal joint part of the first object to a portion to be bonded of the second object by heating in a special gas atmosphere, and a device thereof. In the mounting, the primary and secondary oxidations of the metal joint part can be efficiently prevented, and thereby highly reliable bonding can be carried out.

Abstract: A chip-mounting device comprises a chip-holding tool and a substrate-holding stage. At least one of the chip-holding tool and the substrate-holding stage is placed on a coarse adjustment table for coarse positioning of a chip or a substrate. Brake means for fixing the positioned coarse adjustment table is provided on the coarse adjustment table. Fine adjustment means for fine positioning of a chip or a substrate is provided on the coarse adjustment table. The chip-mounting device allows alignment with submicorn accuracy to be performed quickly, shortening tact time in chip mounting remarkably.

Abstract: There is provided a vacuum pump which suppresses the propagation of vibrations to an external container without the use of a damper. The vacuum pump has an outer cylindrical portion, a rotor portion and a stator portion accommodated within the outer cylindrical portion to define a transferring portion for a gas sucked from an inlet port, a magnetic bearing for supporting the rotor portion with respect to the stator portion, a motor for rotating the rotor portion with respect to the stator portion, and a base for supporting the outer cylindrical portion and the stator portion. A vibration absorbing member is interposed between the stator portion and the base, which has a natural frequency F=(f1+f3)/2±(f1−f3)/4, provided that f1, f2 and f3 respectively denote a natural frequency of nutation in conical mode, a natural frequency in parallel mode and a natural frequency of procession in the conical mode, when the rotor portion is rotated at a rated speed.

Abstract: A composite-type electromagnet for a radial magnetic bearing has four composite-type electromagnet parts. Each part has four electromagnet cores formed of a magnetic material. The cores each have two protruding poles. A control coil is wound around each of the protruding poles and a biasing permanent magnet is disposed between each of the cores. The electromagnet cores and the biasing permanent magnets are in direct contact such that only a minute gap exists at a junction therebetween. A viscous material, adhesive material, or a magnetic fluid such as grease, having therein a material having high permeability and high saturation magnetic flux density is disposed in the minute gap so as to minimize magnetic flux leakage at the junction.

Abstract: When a vacuum pump is installed over a vacuum system in a turned-over posture via a damper, a tension is applied upward to the vacuum pump by an elastic body one end of which is fixed to a fixed portion such as a ceiling, by which contraction caused by the weight of the vacuum pump and the atmospheric pressure applied when the interior of the damper becomes a vacuum is relaxed. Thereby, the decrease in vibration damping capacity of the damper caused by the compression of a rubber of the damper can be reduced. Also, when the vacuum pump is installed at the side of the vacuum system in a horizontal posture via the damper, a tension is applied upward to the vacuum pump by the elastic body one end of which is fixed to the fixed portion such as a ceiling to keep the horizontal posture of the vacuum pump. Thereby, the damper is prevented from being deflected by the weight of the vacuum pump, and thus high vibration absorbing capacity of the damper can be maintained.

Abstract: A mounting device (1) including a plurality of heads (3), each holding a chip (2), arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads (3) with calibration marks, first recognition means (10) fixed in a chip mounting position (A), and second recognition means (16) fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads (3) In mounting operation, the first recognition means (10) recognizes the positions of a substrate (4) and the calibration marks of the heads (3), whereas the second recognition means (16) recognizes the positions of chips (2) attracted on the heads (3). The heads are moved vertically to adjust plane to be recognized. The chip (2) and the substrate (4) are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract: Provided is a connecting structure for a vacuum pump, which can block propagation of electrical noise, generated by a main body of the vacuum pump. Between both ends of a connection piping for connecting the vacuum pump to a vacuum chamber of an apparatus to be connected with and evacuated by the vacuum pump, there is interposedly provided an electrical insulating portion formed of an insulating material so as to provide electrical insulation therebetween. The electrical insulation portion may be provided to a connection piping member such as a damper (or a valve depending on the connection arrangement) for absorbing mechanical vibrations.

Abstract: In bonding bumps formed on a chip to electrodes formed on a substrate in a purge gas atmosphere, purge gas is supplied locally at least around the bumps, with the substrate and the chip separated from each other. According to the method and apparatus for chip mounting, the concentration of purge gas can be increased locally around the bumps where the isolation from the air is required, so that the bumps are protected effectively from secondary oxidation.

Abstract: A method and a device for chip mounting; the method comprising the steps of forming an elastic or plastic bump (22) on a chip (2), providing an adhesive (24) to a substrate (20) beforehand, moving the chip (2) near the substrate (20) to press the bump (22) against an electrode (23) on the substrate (20), expanding the adhesive (24) between the chip (2) and the substrate (20), controlling the height of a head when the bump (22) is pressed against the electrode (23), and allowing non-uniform pressing condition between the bump (22) and the electrode (23) to be absorbed by the elastic or plastic deformation of the bump (22), whereby a variation in dimensions of the substrate can be absorbed properly, the height of the head can be controlled quickly, and a bonding time can be shortened remarkably and, when a bonding process is divided into a preliminary bonding process and a main bonding process, a preliminary bonding process time can be shortened remarkably, and an actual tact time in an entire chip bonding proc

Abstract: Vibrations generated by a vacuum pump are prevented from propagating to external equipment such as an electron microscope. A casing (a separate casing portion and a casing main body) that houses a stator, stator blades, a rotor portion, and rotor blades as an exhaust function portion is connected to an inlet port portion in which an inlet port for sucking in a gas from the outside is formed, through an elastic member. An suction space between the casing and the inlet port portion is sealed by a bellows cylinder sealing means, and motion regulating members and motion regulating members and which regulate the amount of separation between the inlet port portion and the casing, and change shape due to relative motion between the two, are formed between the inlet port portion and the casing.

Abstract: A method for mounting a chip (1) by bonding a bump (2) formed on the chip (1) to an electrode (6) formed on a substrate (5) and providing an underfill agent (7) between the chip (1) and the substrate (5), comprising the steps of applying the underfill agent (7) onto at least one of the substrate (5) and the chip (1), moving the chip (1) to the substrate (5) to bring the bump (2) into contact with the electrode (6) and to expand the underfill agent (7), in a space between the chip (1) and the substrate (5), to around the bump (2) and the electrode (6) in contact with each other, and heating the bump (2) or electrode (6) in the state that the bump (2) is buried in the underfill agent (7) to melt the bump (2) or electrode (6) so as to weld the bump (2) to the electrode (6), whereby the secondary oxidation of the bump (2) to be heated for melting can be prevented without purging by nitrogen gas and the like, and both a mounting device and mounting process can be simplified.

Abstract: The present invention relates to a chip bonding apparatus for bonding a chip to a substrate, with a support structure for preventing a deviation or error in parallelism of a head 1 holding the chip. A first support mechanism 4 supports a pressure cylinder 3 for pressing the head 1 toward a substrate 2. A second support mechanism 5 is provided separately from and independently of the first support mechanism 4 for supporting a reactive force acting on the pressure cylinder 3 when the head 1 is pressed toward the substrate 2. The second support mechanism 5 is in contact with the pressure cylinder 3 through a spherical point of contact 12.

Abstract: A propylene polymer composition of high melt tension, which is especially favorable for foam moldings of uniform thickness, and its foam moldings of uniform thickness are obtained by melt-kneading a polymer mixture of a specific ethylene polymer (A) and a specific olefin multi-stage polymer (B) to satisfy the following formula:

Abstract: To provide a protective device for a turbo molecular pump and a method of protecting a turbo molecular pump that may cope with abnormal phenomenon according to a kind thereof when the abnormal phenomenon occurs. A kind of abnormal phenomenon is inferred from a change rate in rpm of a rotor when the abnormal phenomenon such as an injection of atmospheric air into an intake port is generated in the turbo molecular pump or the like and a magnitude of the damage imparted to the turbo molecular pump by the abnormal phenomenon is inferred from the rpm of the rotor upon the generation of the abnormal phenomenon. Furthermore, a value weighted to the magnitude of the damage is caused to correspond to and the value is accumulated whenever the abnormal phenomenon occurs in the turbo molecular pump. When the accumulated value reaches a certain value, the protective function is effected so that the turbo molecular pump is stopped to disable its re-operation or to display an alarm to the operator or the like.

Abstract: A turbo molecular pump has a rotor having rotor blades arranged in multiple stages. Each of the rotor blades has a proximal end fixed to the rotor and a distal end. Stator blades are arranged in multiple stages. Each stator blade has a proximal end and a distal end. The rotor blades and the stator blades are alternately arranged in spaced-apart relation in an axial direction so that a spatial clearance between the proximal end of each of the rotor blades and the distal end of an adjacent stator blade is smaller than a spatial clearance between the distal end of each of the rotor blades and the proximal end of the adjacent stator blade. Each of the rotor blades comprises a cantilever member having upper and lower surfaces.

Abstract: A data modifying apparatus having: a memory that stores modification data for modifying data; a detecting unit for detecting each data group from performance data, the data group being unable to be reproduced at the same time from the viewpoint of music; and a modifying unit for modifying the data group detected by the detecting unit to divide the data group into a plurality of sub-data groups capable of being reproduced at the same time from the viewpoint of music, by using the modification data.