Patents by Inventor Alan M. Myers

Alan M. Myers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anchored via connection
    Patent number: 5619071
    Abstract: A novel high performance and reliable interconnection structure for preventing via delamination. The interconnection structure of the present invention comprises a via connection which extends into and undercuts an underlying interconnection line to lock the via connection into the interconnection line.
    Type: Grant
    Filed: August 15, 1995
    Date of Patent: April 8, 1997
    Assignee: Intel Corporation
    Inventors: Alan M. Myers, Peter K. Charvat, Thomas A. Letson, Shi-ning Yang, Peng Bai
  • Via hole profile and method of fabrication
    Patent number: 5470790
    Abstract: A novel high performance and reliable interconnection structure for preventing via delamination. The interconnection structure of the present invention comprises a via connection which extends into and undercuts an underlying interconnection line to lock the via connection into the interconnection line.
    Type: Grant
    Filed: October 17, 1994
    Date of Patent: November 28, 1995
    Assignee: Intel Corporation
    Inventors: Alan M. Myers, Peter K. Charvat, Thomas A. Letson, Shi-ning Yang, Peng Bai