Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device. The semiconductor device structure includes a second conductive shielding layer under the first device. The first device is between the first conductive shielding layer and the second conductive shielding layer, and the second conductive shielding layer has a plurality of second openings.

Abstract: The present disclosure provides a semiconductor structure includes a sensing element configured to receive a signal from a sensing target, a molding surrounding the sensing element, a through via in the molding, a front side redistribution layer disposed at a front side of the sensing element and electrically connected thereto, and a back side redistribution layer disposed at a back side of the sensing element, the front side redistribution layer and the back side redistribution layer are electrically connected by the through via. The present disclosure also provides a method for manufacturing the semiconductor structure described herein.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device. The semiconductor device structure includes a second conductive shielding layer under the first device. The first device is between the first conductive shielding layer and the second conductive shielding layer, and the second conductive shielding layer has a plurality of second openings.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first device. The semiconductor device structure includes a conductive element over the first device. The semiconductor device structure includes a first conductive shielding layer between the first device and the conductive element. The first conductive shielding layer has openings, and a maximum width of the opening is less than a wavelength of an energy generated by the first device.

Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Abstract: The present invention relates to an electrical contact. In particular, it relates to an electrical contact capable of establishing an electrical contact with a soft material. More particular, the electrical contact comprises (a) a non-Newtonian liquid metal alloy, the non-Newtonian liquid metal alloy is formed in a polymer insulator, wherein the contact surface of the electrical contact that contacts the soft material is a smooth flat non-patterned surface, the surface comprising the non-Newtonian liquid metal alloy sandwiched between the polymer insulator. The microfluidic device comprising the electrical contact and a method for forming the electrical contact are also disclosed.

Abstract: A system includes a broadcast overlay network including a ring topology. The ring topology includes a first network ring and a second network ring that is coupled to the first network ring via at least one cross-connect element. The ring topology is adapted to carry broadcast traffic from a network. The system also includes a digital subscriber line access multiplexer (DSLAM) having a line interface and a network interface. The network interface is in communication with the broadcast overlay network via the second network ring. The DSLAM is adapted to receive a request for a particular video channel from a customer premise via the line interface and to deliver the particular video channel from the network interface to the line interface.

Abstract: A computer readable medium stores a program in an ingress capable network device of a network for routing signals through the network. The computer readable includes a receiving code segment for receiving an original signal, which has an embedded destination service address. The computer readable medium also includes a querying code segment for querying a database server to obtain an internal routing address corresponding to the embedded destination service address, and a routing code segment for routing at least a portion of the original signal through the network to an egress capable network device according to the internal routing address. The routed portion of the original signal includes at least the embedded destination service address, which enables the egress capable network device to restore the embedded destination service address and to forward the routed portion of the original signal from the network.

Abstract: A hand-held hair dryer and holder assembly including a hand-held hair-dryer a holder, and a cord hanger connected to the holder. The holder is adapted for mounting to a supporting surface. The holder provides a location for storing the hand-held hair dryer when the hand-held hair dryer is not in operation. An electrical cord extends from the hand-held hair dryer. The cord is utilized to electrically connect the hand-held hair dryer to a power supply. The cord hanging member is adapted to support a portion of the cord when the hand-held hair dryer is not in operation. The cord hanging member being removably or integrally connected to the holder.

Abstract: A hand-held hair dryer including a handle, a body connected to the handle portion, a barrel connected to the body portion and having an inner member defining a first air passageway, an outer member slidably coupled to the inner member and defining a second air passageway that is substantially parallel to the first air passageway, a shutter coupled to the inner member and movable in response to sliding of the outer member with respect to the inner member to selectively direct air through the first air passageway and the second air passageway.

Abstract: A hand-held hair dryer including a handle, a body connected to the handle portion, a barrel connected to the body portion and having an inner member defining a first air passageway, an outer member slidably coupled to the inner member and defining a second air passageway that is substantially parallel to the first air passageway, a shutter coupled to the inner member and movable in response to sliding of the outer member with respect to the inner member to selectively direct air through the first air passageway and the second air passageway.

Abstract: A diffuser for a hair dryer having an air discharge nozzle, the diffuser comprising a body having a side wall defining a first opening adapted to communicate with the nozzle and a second opening. The body defines an air passage communicable between the first and second openings for conducting therebetween an air flow. Also included is a grill overlying the second opening and defining a plurality of discharge openings, and a plurality of generally hollow fingers extending from the grill outwardly of the air passage. The fingers define respective finger discharge openings and respective finger discharge passage portions communicable between the air passage and the finger discharge openings. In addition there is included a valve for selectively and adjustably controlling the flow of air from the air passage through the discharge openings and the finger discharge openings.