Patents by Inventor Alberto Pagani

Alberto Pagani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200321457
    Abstract: Embodiments are directed to electrically confined ballistic devices, circuits, and networks. One such device includes a heterostructure that has a first semiconductor layer, a second semiconductor layer, and a two-dimensional electrode gas (2DEG) layer between the first and second semiconductor layers. The device further includes an input electrode electrically coupled to the 2DEG layer and an output electrode electrically coupled to the 2DEG layer. A first confinement electrode is positioned on the heterostructure. The first confinement electrode, in use, generates first space charge regions which at least partially define a boundary of the ballistic device within the 2DEG layer between the input electrode and the output electrode in response to a first voltage.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 8, 2020
    Inventors: Alessandro Paolo BRAMANTI, Alberto PAGANI
  • Publication number: 20200321456
    Abstract: Embodiments are directed to two-dimensional electron gas (2DEG)-confined 2DEG devices and methods. One such device includes a substrate and a heterostructure on the substrate. The heterostructure includes a first semiconductor layer, a second semiconductor layer, and a 2DEG layer between the first and second semiconductor layers. The device further includes a 2DEG device having a conduction channel in the 2DEG layer. An isolation electrode overlies the heterostructure and at least partially surrounds a periphery of the 2DEG device. The isolation electrode, in use, interrupts the 2DEG layer in response to an applied voltage.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 8, 2020
    Inventors: Alessandro Paolo BRAMANTI, Alberto PAGANI
  • Patent number: 10794783
    Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: October 6, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Alberto Pagani, Federico Giovanni Ziglioli, Bruno Murari
  • Patent number: 10788389
    Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: September 29, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Alberto Pagani
  • Patent number: 10775426
    Abstract: A testing system for carrying out electrical testing of at least one first through via forms an insulated via structure extending only part way through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the insulated via structure. The first electrical test circuit enables detection of at least one electrical parameter of the insulated via structure.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: September 15, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10746787
    Abstract: A testing architecture for integrated circuits on a wafer includes at least one first circuit of a structure test element group (TEG) realized in a scribe line providing separation between first and second integrated circuits. At least one pad is shared by a second circuit inside at least one of the first and second integrated circuits and the first circuit. Switching circuitry is coupled to the at least one pad and to the first and second circuits.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 18, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10746788
    Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: August 18, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10715216
    Abstract: A smart button for use in a network formed on a garment includes a housing and an antenna carried within the housing to communicate with elements of the network. A functional element is carried within the housing. An electronic circuit is carried within the housing and coupled to the antenna and the at least one functional element. The housing is formed by a stem carrying a head, and the antenna is housed within the head.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: July 14, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10677816
    Abstract: A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: June 9, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10641821
    Abstract: An integrated circuit is fabricated on a semiconductor material die and adapted to be at least partly tested wirelessly. Circuitry for setting a selected radio communication frequency to be used for the wireless test of the integrated circuit is integrated on the semiconductor material die.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: May 5, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Publication number: 20200112270
    Abstract: A harvesting and scavenging circuit includes an inverse electrowetting harvesting and scavenging circuit including a moveable mass with a moveable electrode that is moveable in three-dimensions relative to a second electrode having a first insulating layer covering a surface of the second electrode. A conductive fluid positioned between the first insulating layer and the moveable electrode. A magnetic energy harvesting and scavenging circuit includes at least one permanent magnetic segment on the movable mass and at least one energy harvesting and scavenging coil positioned proximate the moveable mass. Energy harvesting and scavenging circuitry is electrically coupled to the moveable electrode and the second electrode and is coupled to the at least one energy harvesting and scavenging coil. The energy harvesting and scavenging circuitry provides electrical energy generated through reverse electrowetting and magnetic energy stored in the at least one energy harvesting and scavenging coil.
    Type: Application
    Filed: October 4, 2018
    Publication date: April 9, 2020
    Inventors: Sara Loi, Alberto Pagani
  • Patent number: 10598578
    Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: March 24, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Alberto Pagani, Bruno Murari, Federico Giovanni Ziglioli
  • Patent number: 10557753
    Abstract: A spectrometer includes a substrate; a plurality of light detectors in the substrate; and a plurality of light filters over the plurality of light detectors, each of the plurality of light filters transmitting a different wavelength or reflecting a different wavelength, each of the light filters aligned with a corresponding one of the plurality of light detectors.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: February 11, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Sara Loi, Alberto Pagani, Guido Chiaretti
  • Patent number: 10527512
    Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: January 7, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Alberto Pagani, Bruno Murari, Marco Ferrera, Domenico Giusti, Daniele Caltabiano
  • Patent number: 10497655
    Abstract: A packaged semiconductor device includes an insulating material forming a side surface of the packaged semiconductor device. An integrated-circuit chip is embedded in the insulating material and includes a communication circuit. A wiring system is embedded in the insulating material and electrically couples the integrated-circuit chip with a plurality of package contact elements. A first communication pad is formed in the side surface and is operatively coupled to the communication circuit to enable signal exchange through the first communication pad.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: December 3, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Alberto Pagani
  • Patent number: 10457545
    Abstract: A magnetic energy harvesting and scavenging circuit includes a first substrate having first and second surfaces and at least one energy harvesting and scavenging coil formed adjacent the first surface. An electromechanical systems device includes a moveable mass extending over the first surface and is displaced relative to the first substrate in three dimensions responsive to an external force applied to the moveable mass. The movable mass includes a magnet support layer and a number of permanent magnet segments attached to the magnet support layer. The permanent magnet segments are magnetically coupled to the at least one energy harvesting and scavenging coil. Energy harvesting and scavenging circuitry is electrically coupled to the at least one energy harvesting and scavenging coil and generates electrical energy due to magnetic flux variation through the at least one energy harvesting and scavenging coil responsive to movement of the moveable mass.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: October 29, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Alberto Pagani
  • Patent number: 10453833
    Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 22, 2019
    Assignee: STMicroelectonics S.r.l.
    Inventor: Alberto Pagani
  • Publication number: 20190312136
    Abstract: A device includes a particle propagation channel, a particle deflector, a particle source, and a particle sink. The particle deflector facilitates ballistic transport of particles from a particle inflow portion through a particle flow deflection portion to a particle outflow portion. The particle deflector is arranged at the particle flow deflection portion and is activatable to deflect particles in the flow deflection portion and is configured to selectively prevent the particles from reaching the particle outflow portion. The particle source and particle sink are configured to cause a current path of the particles through the device.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 10, 2019
    Inventors: Alessandro Paolo BRAMANTI, Alberto PAGANI
  • Publication number: 20190301930
    Abstract: A spectrometer includes a substrate; a plurality of light detectors in the substrate; and a plurality of light filters over the plurality of light detectors, each of the plurality of light filters transmitting a different wavelength or reflecting a different wavelength, each of the light filters aligned with a corresponding one of the plurality of light detectors.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Inventors: Sara Loi, Alberto Pagani, Guido Chiaretti
  • Publication number: 20190292045
    Abstract: A method for making an integrated micro-electromechanical device includes forming a first body of semiconductor material having a first face and a second face opposite the first face. The first body includes a buried cavity forming a diaphragm delimited between the buried cavity and the first face. The diaphragm is monolithic with the first body. The method further includes forming at least one first magnetic via extending between the second face and the buried cavity of the first body, forming a first magnetic region extending over the first face of the first body, and forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 26, 2019
    Inventors: Alberto Pagani, Alessandro Motta