Patents by Inventor Aleksey S. Khenkin

Aleksey S. Khenkin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210287841
    Abstract: A method for constructing a solenoid inductor includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform said positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.
    Type: Application
    Filed: February 11, 2021
    Publication date: September 16, 2021
    Inventors: Aleksey S. Khenkin, David Patten, Jun Yan
  • Patent number: 11076226
    Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: July 27, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Fariborz Assaderaghi, Peter Cornelius
  • Patent number: 10911850
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: February 2, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Publication number: 20210006895
    Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 7, 2021
    Inventors: Aleksey S. Khenkin, Fariborz Assaderaghi, Peter Cornelius
  • Patent number: 10812900
    Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: October 20, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Fariborz Assaderaghi, Peter Cornelius
  • Patent number: 10587969
    Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: March 10, 2020
    Assignee: INVENSENSE, INC.
    Inventors: James Salvia, Baris Cagdaser, Aleksey S. Khenkin
  • Patent number: 10343897
    Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: July 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim, Aleksey S. Khenkin
  • Publication number: 20190052944
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 14, 2019
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Patent number: 10142718
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: November 27, 2018
    Assignee: Invensense, Inc.
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Patent number: 10031877
    Abstract: Including control data in a serial audio stream is presented herein. A device can include a clock component that is configured to send, via a clock pin of the device, a bit clock signal directed to a slave device. A frame component can send, via a frame pin of the device, a frame clock signal directed to the slave device. A control component can receive, via a data pin of the device during a first portion of a phase of a period of the frame clock signal, slave data from the slave device on a bit-by-bit basis based on the bit clock signal according to an integrated interchip sound (I2S) based protocol; and send, via the data pin during a second portion of the phase after the first portion, a set of control bits directed to the slave device on the bit-by-bit basis based on the bit clock signal.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: July 24, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Jerad M. Lewis, Kieran P. Harney, Aleksey S. Khenkin
  • Patent number: 10006824
    Abstract: Microelectromechanical systems (MEMS) pressure sensors having a leakage path are described. Provided implementations can comprise a MEMS pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere. A pressure of the ambient atmosphere is determined based on a parameter associated with movement of the membrane.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 26, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Aleksey S. Khenkin, Baris Cagdaser, James Christian Salvia, Fariborz Assaderaghi
  • Patent number: 9924288
    Abstract: Systems and techniques for detecting blockage associated with a microelectromechanical systems (MEMS) microphone of a device are presented. The device includes a MEMS acoustic sensor and a processor. The MEMS acoustic sensor is contained in a cavity within the device. The processor is configured to detect a blockage condition associated with an opening of the cavity that contains the MEMS acoustic sensor.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: March 20, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Baris Cagdaser, Renata Melamud Berger, Omid Oliaei, Aleksey S. Khenkin
  • Patent number: 9860649
    Abstract: A micro electro-mechanical system (MEMS) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupled to the substrate and forming a package. The MEMS microphone also includes a MEMS acoustic sensor disposed in the package and positioned such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor. The MEMS acoustic sensor includes: a back plate positioned over the port at a first location within the package; and a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm and the back plate greater than or equal to about 15 volts.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: January 2, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Renata Berger, Sushil Bharatan, Jeremy Parker, Aleksey S. Khenkin
  • Patent number: 9769562
    Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: September 19, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Vikram Venkatadri, David Bolognia
  • Publication number: 20170251316
    Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.
    Type: Application
    Filed: May 17, 2017
    Publication date: August 31, 2017
    Inventors: James SALVIA, Baris CAGDASER, Aleksey S. KHENKIN
  • Patent number: 9736594
    Abstract: Microelectromechanical systems (MEMS) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in MEMS electret acoustic sensors or microphones. Provided implementations include variations in electret acoustic sensor or microphone configuration and recharging of the electret.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 15, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Mike Daneman
  • Publication number: 20170190571
    Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
    Type: Application
    Filed: March 23, 2017
    Publication date: July 6, 2017
    Inventors: Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim, Aleksey S. Khenkin
  • Patent number: 9661433
    Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: May 23, 2017
    Assignee: INVENSENSE, INC.
    Inventors: James Salvia, Baris Cagdaser, Aleksey S. Khenkin
  • Patent number: 9628929
    Abstract: An acoustic sensor system has an acoustic sensor with a cavity, a cavity leakage, and a cavity pressure. The acoustic sensor system further has a test controller coupled to the acoustic sensor that causes a change in the cavity pressure. A response of the acoustic sensor to the change in the cavity pressure is used to measure the cavity leakage.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: April 18, 2017
    Assignee: INVENSENSE, INC.
    Inventors: James Christian Salvia, Baris Cagdaser, Aleksey S. Khenkin
  • Patent number: 9617144
    Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: April 11, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim, Aleksey S. Khenkin