Abstract: A system for performing a measurement on a component, the system comprising: an integrated circuit (IC) comprising: analog to digital (ADC) converter circuitry; and processing circuitry, wherein the system further comprises: difference circuitry, wherein: the difference circuitry is operable to generate a compensated measurement voltage by subtracting a compensation voltage received from a voltage source external to the integrated circuit from a measurement voltage output by the component in response to a stimulus signal received by the component; the ADC circuitry is configured to convert the compensated measurement voltage into a digital compensated measurement signal; and the measurement circuitry is configured to generate a measurement result based on the digital compensated measurement signal.

Abstract: A method for constructing a solenoid inductor includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform said positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.

Abstract: A method and apparatus for detecting a microphone condition of a microphone, the method comprising: applying an electrical stimulus to a microphone; measuring an electrical response to the electrical stimulus at the microphone; comparing the electrical response to an expected response; and determining the microphone condition based on the comparison.

Abstract: A method for determining and mitigating over-excursion of an internal mass of an under-damped electromechanical transducer may include transforming an electrical playback signal to an estimated displacement signal, based on the estimated displacement signal, determining an estimated over-excursion of the internal mass responsive to the electrical playback signal, and limiting, based on the estimated over-excursion, an electrical driving signal derived from the electrical playback signal and for driving the electromechanical transducer in order to mitigate over-excursion of the internal mass.

Abstract: A method for determining and mitigating over-excursion of an internal mass of an electromechanical transducer may include measuring a sensed signal associated with the electromechanical transducer in response to a driving signal driven to the electromechanical transducer, determining a non-linearity value based on the sensed signal, mapping the non-linearity value to a probability of over-excursion of the internal mass, and applying a gain to a signal path configured to generate the driving signal based on the probability.

Abstract: A method for screening a semiconductor device for production of excessive random telegraph sequence (RTS) noise includes measuring noise of the semiconductor device at a first temperature, changing the temperature of the semiconductor device to a second temperature different from the first temperature, measuring noise of the semiconductor device at the second temperature, extracting a characteristic of the measured noise at the first and second temperatures (e.g., standard deviation, HMM output, frequency domain spectrum of time domain noise measurement), making a comparison of the extracted first and second noise characteristics, and making a determination whether the semiconductor device produces excessive RTS noise based on whether the comparison is above a predetermined threshold. Two different bias conditions of the device may be employed rather than, or in addition to, the two different temperatures.

Abstract: A method and apparatus for detecting a microphone condition of a microphone, the method comprising: applying an electrical stimulus to a microphone; measuring an electrical response to the electrical stimulus at the microphone; comparing the electrical response to an expected response; and determining the microphone condition based on the comparison.

Abstract: A system for evaluating a seal between an earphone of a hearing device and an ear canal that includes a first microphone positioned outside the ear canal, a second microphone positioned inside the ear canal, and a controller. The controller is configured to measure a sound level at one or more test frequencies using the first microphone, measure a sound level at the one or more frequencies using the second microphone, calculate a difference between the sound levels measured using the first and second microphones at each of the one or more test frequencies, and determine a measurement of an ear seal based on the calculated one or more differences.

Abstract: The disclosure relates to integrated circuits and methods of manufacture. A method involves forming a first set of one or more circuit layers on a semiconductor substrate, placing at least one prefabricated layer portion onto the first set of circuit layers to form a component, and forming a second set of one or more circuit layers over the first set of circuit layers and the at least prefabricated layer portion. The prefabricated layer portion may be a magnetic layer portion placed to form a magnetic component such as a magnetic core of an inductor or transformer. The method may also comprise forming the prefabricated layer portion.

Abstract: A method for screening a semiconductor device for production of excessive random telegraph sequence (RTS) noise includes measuring noise of the semiconductor device at a first temperature, changing the temperature of the semiconductor device to a second temperature different from the first temperature, measuring noise of the semiconductor device at the second temperature, extracting a characteristic of the measured noise at the first and second temperatures (e.g., standard deviation, HMM output, frequency domain spectrum of time domain noise measurement), making a comparison of the extracted first and second noise characteristics, and making a determination whether the semiconductor device produces excessive RTS noise based on whether the comparison is above a predetermined threshold. Two different bias conditions of the device may be employed rather than, or in addition to, the two different temperatures.

Abstract: A method and apparatus for detecting a microphone condition of a microphone, the method comprising: applying an electrical stimulus to a microphone; measuring an electrical response to the electrical stimulus at the microphone; comparing the electrical response to an expected response; and determining the microphone condition based on the comparison.

Abstract: A system for evaluating a seal between an earphone of a hearing device and an ear canal that includes a first microphone positioned outside the ear canal, a second microphone positioned inside the ear canal, and a controller. The controller is configured to measure a sound level at one or more test frequencies using the first microphone, measure a sound level at the one or more frequencies using the second microphone, calculate a difference between the sound levels measured using the first and second microphones at each of the one or more test frequencies, and determine a measurement of an ear seal based on the calculated one or more differences.

Abstract: A system for evaluating an ear seal between an earphone of a hearing device and an ear canal includes a first transducer that plays sound in response to an electrical signal that includes a reference frequency component and a test frequency component lower than the reference frequency. A second transducer receives the sound in the ear canal. A controller is configured to: calculate at least one electrical signal level difference between the electrical signal reference and test frequency components, measure acoustical levels of the reference and test frequency components of the sound in the ear canal, calculate an acoustical signal level difference between the measured acoustical levels of the reference and test frequency components, calculate a normalized acoustical difference value by subtracting the electrical signal level difference from the acoustical signal level difference, and determine a measurement of the ear seal based on the normalized acoustical difference value.

Abstract: A system for evaluating an ear seal between an earphone of a hearing device and an ear canal includes a first transducer that plays sound in response to an electrical signal that includes a reference frequency component and a test frequency component lower than the reference frequency. A second transducer receives the sound in the ear canal. A controller is configured to: calculate at least one electrical signal level difference between the electrical signal reference and test frequency components, measure acoustical levels of the reference and test frequency components of the sound in the ear canal, calculate an acoustical signal level difference between the measured acoustical levels of the reference and test frequency components, calculate a normalized acoustical difference value by subtracting the electrical signal level difference from the acoustical signal level difference, and determine a measurement of the ear seal based on the normalized acoustical difference value.

Abstract: A method for constructing a solenoid inductor includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform said positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.

Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.

Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.

Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.