Patents by Inventor Aleksey S. Khenkin

Aleksey S. Khenkin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8103027
    Abstract: A MEMS microphone has an SOI wafer, a backplate formed in a portion of the SOI wafer, and a diaphragm adjacent to and movable relative to the backplate. The backplate has at least one trench that substantially circumscribes a central portion of the backplate.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: January 24, 2012
    Assignee: Analog Devices, Inc.
    Inventors: Xin Zhang, Thomas Chen, Sushil Bharatan, Aleksey S. Khenkin
  • Publication number: 20110311080
    Abstract: A MEMS microphone is capable of operating with less-than-one-volt bias voltage. An exemplary MEMS microphone can operate directly from a power rail (i.e., directly from VDD), i.e., without a DC-to-DC step-up voltage converter or other high bias voltage generator. The MEMS microphone has high mechanical and electrical sensitivity due, at least in part, to having high-compliance, i.e. low stiffness, springs and a relatively small gap between its diaphragm and its parallel conductive plate. In some embodiments, a diode-based voltage reference or a bandgap voltage reference supplies the bias voltage.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 22, 2011
    Applicant: ANALOG DEVICES, INC.
    Inventors: Karine Jaar, Aleksey S. Khenkin
  • Publication number: 20100128914
    Abstract: A side-ported MEMS microphone package defines an acoustic path from a side of the package substrate to a microphone die disposed within a chamber defined by the substrate and a lid attached to the substrate. Optionally or alternatively, a circuit board, to which the microphone package is mounted, may define an acoustic path from an edge of the circuit board to a location under the microphone package, adjacent a bottom port on the microphone package. In either case, the acoustic path may be a hollow passage through at least a portion of the substrate or the circuit board. The passage may be defined by holes, channels, notches, etc. defined in each of several layers of a laminated substrate or circuit board, or the passage may be defined by holes drilled, molded or otherwise formed in a solid or laminated substrate or circuit board.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 27, 2010
    Applicant: Analog Devices, Inc.
    Inventor: Aleksey S. Khenkin
  • Publication number: 20090202089
    Abstract: A MEMS microphone has an SOI wafer, a backplate formed in a portion of the SOI wafer, and a diaphragm adjacent to and movable relative to the backplate. The backplate has at least one trench that substantially circumscribes a central portion of the backplate.
    Type: Application
    Filed: March 26, 2009
    Publication date: August 13, 2009
    Applicant: ANALOG DEVICES, INC.
    Inventors: Xin Zhang, Thomas Chen, Sushil Bharatan, Aleksey S. Khenkin
  • Publication number: 20080310664
    Abstract: A piano microphone apparatus configured to position at least one microphone within a sound cavity of a piano may comprise at least one piano interface configured to contact a case of a piano to suspend the microphone within the sound cavity of the piano. The piano microphone apparatus may also comprise at least one protruding member configured to receive a microphone and to adjustably position the microphone relative to at least one of the plurality of strings or soundboard. The length of the piano microphone apparatus may also be adjustable based on at least one dimension of the sound cavity.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 18, 2008
    Applicant: Earthworks, Inc.
    Inventors: Aleksey S. Khenkin, Lawrence E. Blakely, William A. Simoneau
  • Patent number: 6526149
    Abstract: This invention relates to a system and method for reducing non-linear electrical distortion in an electroacoustic device. Specifically, the present invention relates to a system and method for reducing spatially dependent electrical distortion, for example, distortion caused by differences in electrical displacement between a conductive membrane and a counter electrode at different parts of the conductive membrane. The system and method for reducing non-linear electrical distortion has particular application in condenser microphones comprising, for example, a conductive diaphragm receptive to sound, and a backplate electrically coupled thereto to generate an electrical output. In one exemplary embodiment, the present invention provides an electroacoustic system comprising a conductive membrane and a counter electrode electrically coupled to the conductive membrane. A face of the counter electrode facing the conductive membrane is curved.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: February 25, 2003
    Assignee: Earthworks, Inc.
    Inventors: Aleksey S. Khenkin, David E. Blackmer
  • Patent number: 6091829
    Abstract: A microphone housing system is disclosed having a tapered structure enclosed within the housing structure coupled to a rear portion of a microphone element. In the preferred embodiment, the tapered portion has a generally conic shape expanding away from the rear portion of the microphone element. The housing structure surrounding the tapered structure has a plurality of radially disposed opening or slots and fully or partially covered with a sound-resistive material. The housing system provides increased front-to-back signal ratio and increased overall gain and frequency response due to superior rear signal cancellation.
    Type: Grant
    Filed: January 23, 1998
    Date of Patent: July 18, 2000
    Assignee: Earthworks, Inc.
    Inventors: David E. Blackmer, Aleksey S. Khenkin