Abstract: Including control data in a serial audio stream is presented herein. A device can include a clock component that is configured to send, via a clock pin of the device, a bit clock signal directed to a slave device. A frame component can send, via a frame pin of the device, a frame clock signal directed to the slave device. A control component can receive, via a data pin of the device during a first portion of a phase of a period of the frame clock signal, slave data from the slave device on a bit-by-bit basis based on the bit clock signal according to an integrated interchip sound (I2S) based protocol; and send, via the data pin during a second portion of the phase after the first portion, a set of control bits directed to the slave device on the bit-by-bit basis based on the bit clock signal.

Abstract: A MEMS acoustic sensor includes a transducer with a frequency response with a gain peak, and a peak reduction circuit with a frequency response and coupled to the transducer. The frequency response of the peak reduction circuit causes attenuation of the gain peak.

Abstract: Systems and methods are disclosed for heart rate measurement using a plurality of acoustic sensors in a wearable device.

Abstract: A MEMS device includes a MEM-CMOS module having a CMOS chip and a MEMS chip. The MEMS chip includes a port exposed to the environment. The MEMS device further includes a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB.

Abstract: A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.

Abstract: Microelectromechanical systems (MEMS) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in MEMS electret acoustic sensors or microphones. Provided implementations include variations in electret acoustic sensor or microphone configuration and recharging of the electret.

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract: A micro electro-mechanical system (MEMS) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupled to the substrate and forming a package. The MEMS microphone also includes a MEMS acoustic sensor disposed in the package and positioned such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor. The MEMS acoustic sensor includes: a back plate positioned over the port at a first location within the package; and a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm and the back plate greater than or equal to about 15 volts.

Abstract: Systems and techniques for detecting blockage associated with a microelectromechanical systems (MEMS) microphone of a device are presented. The device includes a MEMS acoustic sensor and a processor. The MEMS acoustic sensor is contained in a cavity within the device. The processor is configured to detect a blockage condition associated with an opening of the cavity that contains the MEMS acoustic sensor.

Abstract: Microelectromechanical systems (MEMS) pressure sensors having a leakage path are described. Provided implementations can comprise a MEMS pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere. A pressure of the ambient atmosphere is determined based on a parameter associated with movement of the membrane.

Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

Abstract: Sound based navigation using a portable communications device is presented herein. A portable communications device can include a speaker for generating a sound, and microphone(s) for receiving a reflection of the sound—the reflection including an acoustic wave that has been reflected from an object. Further, the portable communications device can include a timing component configured to determine a time of propagation of the acoustic wave from the speaker to the microphone(s), and a distance component configured to determine a distance of the object from the portable communications device based on the time of propagation of the acoustic wave. Furthermore, the portable communications device can include a mapping component configured to: determine a geographic location of the portable communications device, and create, based on the geographic location and the distance of the object from the portable communications device, a map, indoor map, etc. of objects, structures, etc. comprising the object.

Abstract: A microelectromechanical systems (MEMS) device optimized for flip-chip assembly and method of attaching the same are presented herein. A device can include a substrate, an acoustic seal, and a MEMS device mechanically attached to the substrate utilizing bond pad(s) that electrically couple the MEMS device to the substrate and/or an application-specific integrated circuit (ASIC). A portion of the MEMS device includes an acoustic area, an acoustic seal area that surrounds the acoustic area and includes the acoustic seal, and electrical interconnect area(s) that are located outside of the acoustic seal area and include the bond pad(s). The acoustic seal can be compressed between the acoustic seal area and the substrate and/or the ASIC, and include a thixotropic adhesive material. Mechanical support(s) that define a gap between the MEMS device and the substrate and/or the ASIC can be attached to the acoustic seal area and/or the substrate.

Abstract: A microelectromechanical systems (MEMS) device optimized for flip-chip assembly and method of attaching the same are presented herein. A device can include a substrate, an acoustic seal, and a MEMS device mechanically attached to the substrate utilizing bond pad(s) that electrically couple the MEMS device to the substrate and/or an application-specific integrated circuit (ASIC). A portion of the MEMS device includes an acoustic area, an acoustic seal area that surrounds the acoustic area and includes the acoustic seal, and electrical interconnect area(s) that are located outside of the acoustic seal area and include the bond pad(s). The acoustic seal can be compressed between the acoustic seal area and the substrate and/or the ASIC, and include a thixotropic adhesive material. Mechanical support(s) that define a gap between the MEMS device and the substrate and/or the ASIC can be attached to the acoustic seal area and/or the substrate.

Abstract: Membrane, coil, and magnet configurations for MEMS microphones are provided to minimize or eliminate power consumption by the MEMS microphones. In a microphone, a membrane can be associated with or connected to a coil, wherein the coil can be situated around a permanent magnet. The membrane can be suspended by a set of springs. In one arrangement, the coil can be embedded in the membrane and the magnet can be situated underneath the membrane and coil structure within the microphone. In another arrangement, the magnet can comprise a set of magnet sections, and a membrane and coil structure, wherein the membrane and coil structure can have the coil portion embedded with the membrane portion, and the membrane and coil structure can be situated in proximity to the base of the magnet, and in between respective poles of respective magnet sections, within the microphone.

Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.

Abstract: A top port microelectromechanical systems (MEMS) microphone is presented herein. A device can include a substrate and a MEMS acoustic sensor mechanically attached to the substrate utilizing anchors. Spaces between the anchors can connect a first back volume corresponding to a bottom portion of the MEMS acoustic sensor with a second back volume to form a combined back volume. An acoustic seal can be placed on the MEMS acoustic sensor, and an enclosure placed on the acoustic seal and secured to the substrate. The acoustic seal can isolate a first portion of the enclosure corresponding to a front volume from a second portion of the enclosure corresponding to the combined back volume. The first portion of the enclosure can include an opening adapted to receive acoustic waves into the front volume, and the front volume can be acoustically coupled to a top portion of the MEMS acoustic sensor.

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

Abstract: A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic sensor. In a third aspect, the method comprises using a feedthrough cancellation system to measure a capacitance of the acoustic sensor. In the fourth aspect, the circuit comprises a mechanism for driving an electrical signal into a signal path of the acoustic sensor to cancel an electrical feedthrough signal provided to the signal path, wherein any of the electrical signal and the electrical feedthrough signal are within or above an audio range.