Abstract: A test system for testing numerous parts simultaneously. A stack of test boards is provided in a test chamber. Each of the test boards has a region of contactors on it. To perform a test, trays are inserted between the boards in the stack and aligned with the regions of contactors. A mechanism is then activated to press the trays towards the boards, thereby making contact between the contactors and devices on the trays. The test system is described in conjunction with a burn-in oven. Processing time is reduced because individual handling of chips is significantly reduced.

Abstract: Convective heat transfer enhancement features are formed in trays for carrying and thermally conditioning semiconductor devices or on integrated circuit chip packages. Upward extending ribs, perpendicular to a fluid flow, are formed in the trays and/or packages for increasing the mixing of the fluid flow near the devices under test, thereby enhancing convective heat transfer to or from the devices. Downward extending ribs are also formed in the trays and/or packages. The upward and downward extending ribs formed in the trays are in a staggered relationship for facilitating the stacking of trays. Alternatively, a surface roughness is applied to the trays and/or packages. The surface roughness applied to the packages is such that sufficient smooth regions remain on the packages for allowing pick-and-place machines to handle the packages.

Abstract: An integral unit for use in testing semiconductor components. The unit is designed to manipulate either packaged semiconductor components or semiconductor wafers and present them to a test head. It provides significant space savings because it replaces the need for separate prober, handler and tester units. The integrated unit includes a positioning mechanism with a tool plate that can be changed to grasp either a semiconductor wafer or a tray of semiconductor components. The tool plate uses a vacuum plate. To hold a tray of semiconductor parts, the vacuum plate has numerous independently operable holes. Each hole is positioned behind one semiconductor component and can be engaged or released separately so that the components can be sorted into separate output bins. To hold a wafer, the tool plate has an extendible tongue member that can be inserted into a stack of semiconductor wafers to pick up one wafer in the stack.

Abstract: A kinematic coupling for a test system with a test head which must be docked with a handling device. The coupling is implemented with a plurality of modules attached to the test head. Each module has one kinematic surface and is designed to mate with another kinematic surface on the handling device. Each module includes a motor which can extend or retract the kinematic surface. These modules allow docking of the test head to the handling device with a final motion perpendicular to the handler. They also allow the tilt angle between the test head and the handler to be adjusted to achieve planarization.

Abstract: A transport tray for semiconductor devices that includes a retention mechanism. The tray is formed with molded plastic inserts positioned in a tray. Each insert includes a contact surface that is designed to have two stable points, one corresponding to a latched state and one corresponding to an unlatched state. The retention mechanism includes elements that allow the contact surface to rotate and translate relative to the surface of a semiconductor component being inserted or removed from the tray. Rotation across the surface, as opposed to sliding, significantly reduces the wear of the retention mechanism.

Abstract: A modular hydrostatic bearing for use in precision machine tools and the like, where a load is supported by bolting it to modular bearing carriages or trucks which ride on parallel bearing rails, where the carriages or trucks are kept from making physical contact with the bearing rails by hydrostatic bearing pockets formed in the carriages, and where the bearing rail has two sides and two or more surfaces per side that form load carrying surfaces that the hydrostatic bearing pockets run against, and where the bearing rail load carrying surfaces have precision smooth continuous curves between them, such that the carriage can be formed with a mating surface containing the hydrostatic bearing pockets and also have smooth continuous surfaces between the hydrostatic bearing pockets, such that the carriage can be fitted over the rail with clearance suitable for hydrostatic bearing operation, but greatly reduced leakage flow because there is no direct leakage flow to the atmosphere from between sets of adjacent load

Abstract: An electrical contact element that solves many problems associated with making electrical connections to integrated circuit chips. The contact element fits in small areas, but in some configurations can provide compliance in multiple directions to provide the required compliance. The contacts are shaped to provide relatively large stroke and also large force for good electrical contact. Contact elements according to the invention are incorporated into contactors for making electrical contact to Ball Grid Arrays for testing. Contact elements according to the invention are also incorporated into Ball Grid Array packages, and used as a mounting point for solder balls. The contact elements make the electrical connection withstand stress associated with differential thermal expansion.

Abstract: A mechanism to control the size of particles flowing through it, even to the nanometer scale, that contains a beam or plate effectively anchored at the bottom of each of a plurality of adjacent chambers, and, wherein the top of the beam or plate and the bottom of the chambers are polished to a degree finer than the particle size to be excluded, and with the polished surfaces normally brought into intimate contact to close off the chambers; an extension to the beam or plate acting as a force source to the beam or plate, such that when the extension is deflected a known large amount, the resulting deflection in the neighborhood of the anchoring point is very small, enabling the extension to create a transmission effect with the bending of the extension down, making the beam or plate act like a cantilever and opening the system for flushing; while bending the beam up, puts the beam in three point bending, and guides the substances from one chamber to another, with appropriate exit seal.

Abstract: An I.S. machine has a plurality of individual sections arranged in side by side relation. Each section has a blank station for forming a parison from a gob of molten glass, and a blow station for forming a parison into a bottle. An invert and neck ring holder mechanism is located between these stations for transferring a parison between from one station to the other. Each station has a mold opening and closing mechanism which has a pair of opposed mold support mechanisms supported for linear displacement between a retracted position and an advanced position. Each mold support mechanism is supported by a first shaft on one side of the center of the mold opening and closing mechanism, proximate the invert and neck ring holder mechanism, extending perpendicularly to the engagement plane, and by a second shaft on the other side of the center of the mold opening and closing mechanism, remote from the invert and neck ring holder mechanism, extending perpendicularly to the engagement plane.

Abstract: A manipulator for a test head connected to automatic test equipment through a heavy, inflexible cable. The manipulator includes a telescoping column assembly to which is mounted a vertical member. A cradle holding the test head is mounted to the vertical member. The cable is clamped at the vertical member to reduce the amount of force exerted by the cable on the test head. The cradle includes movable members to allow fine positioning of the test head, while maintaining the test head isolated from cable force. Course motion of the test head may be made by moving portions of the manipulator on the opposite side of the cable clamp from the test head. Precise positioning of the test head relative to a handling device is accomplished through a positioning mechanism at the interface between the test head and the handling device. To allow the positioning mechanism to operate, the manipulator has compliance which allows the test head to be forced into position by the positioning mechanism.

Abstract: A novel flexible laminated beam contractor interface package for applications between chips and the like and test equipment therefor, containing a flexible core beam contractor laminated within outer ground shield beam coverings and provided with an exposed contact tip for connecting with test equipment externally to the package; and with contacts adapted flexibly to engage the chip terminals when the chip is temporarily applied to the package for testing; the laminated beam contactor preferably being shaped as bent flexible cantilever or curved beams.

Abstract: A ball grid array package for integrated circuit chips that is designed to facilitate testing. The balls are planarized with high precision to make electrical contact more accurate for testing. Contact, even on fine pitched arrays, can be readily made. A machine for planarizing the solder balls is disclosed. Also, a contact array, as well as a method of making the contact array are disclosed.

Abstract: A novel system for kinematically positioning planar surfaces such as printed circuit board components and elements of material, where one element has precisely formed and positioned (e.g., punched) slots that fit loosely over three corresponding posts, such that when a bias force, such as gravity from a tilted plane or a combing action, or expanding bladder on the posts, is applied, the surfaces are referenced to one side of the slots to in effect form a planar kinematic coupling so the relative planar position and orientation is defined with great accuracy and repeatability; such also allowing an entire factory system to be built where each piece of precision manufacturing equipment can use this planar kinematic coupling to achieve great accuracy in the manufacture of printed circuit boards or the like to allow for the use of ever smaller electronics components.

Abstract: The invention is concerned with the formation of modular units from individual plate-like elements and other elements with special interlocking joints at their ends that allow them to form cubes that can be grouped together to form storage "cubbies" and modular structural systems and toy construction sets and the like, wherein, in one embodiment, the plates are formed with one end having studs on a 45 degree angled surface, and the other end having receptacles or openings such as sockets on a 45 degree angled surface for interlocking with a second mating plate like the first, but in which the studs and sockets are interchanged, allowing a cube to be formed by two of each type of plate, with the use of studs and sockets on the surfaces allowing two or more such cubes to stick together; and wherein, in another embodiment, the cube is made from four identical plates, as by an extrusion process, where one end of a plate contains double male features, such as barb arrows, and the other end contains double correspo

Abstract: A mold opening and closing mechanism for an I.S. machine having a plurality of individual sections. A pair of opposed mold holding mechanisms is supported on top of the section frame for linear displacement between a separated retracted position whereat each mold support mechanism is located at a start position and an advanced position whereat molds held by the mold support mechanisms will forcefully engage. A mold holding mechanism is secured to the free ends of a pair of round shafts which are slidably supported within horizontally separated bearings in a housing supported on the section frame and extending vertically upwardly.

Abstract: A mold carrier assembly for use with a support housing having a pair of parallel, spaced, horizontally extending bores and located on the top wall of a section frame of an I.S. machine. The quick change mold carrier assembly has a mold support mechanism including an insert for supporting at least one mold half which is mounted on a carrier. First and second parallel round shafts are secured at one end to the carrier with the round shafts extending horizontally in parallel relationship and each of the round shafts have a free end remote from the carrier for slidable insertion into the bores of the housing.

Abstract: An I.S. machine comprises a plurality of individual sections arranged in side by side relation. Each section has a section frame having a top wall having a front and a back and opposed sides on which is mounted a blank station including a mold opening and closing mechanism for forming a parison from a gob of molten glass, a blow station including a mold opening and closing mechanism for forming a parison into a bottle, and an invert and neck ring holder mechanism supported which is located between the mold opening and closing mechanisms for transferring a parison therebetween. The machine also has a baffle mechanism includinga blowhead carrier, a motor having an output, a transmission for transmitting the output of the motor to the blowhead carrier to displace the carrier, a housing for housing the transmission. The housing is secured on the top wall proximate the front thereof.

Abstract: A system and technique for holding down and restraining a roll-off container in place as it is winched into its final position on the bed of a truck or other transport device, wherein, as the roll-off container is winched into position on the truck, a protuberance on the side of the bottom rail of the roll-off container slides into a mating interlocking cradle attached to the truck. The sliding mate can be of a cantilevered spear into a socket, or more generically, a sliding open-ended mate such as a dovetail. In the event of a crash or sudden stop, the roll-off container will thus be retained by the interlocking connection.

Abstract: An expandable gripper for semiconductor processing equipment that allows the pitch between semiconductor chips to be adjusted. To adjust the pitch, several pick and place mechanisms are mounted around a shaft using nuts. The threads of the nuts have variable leads, causing each to travel a different amount as the shaft rotates. All of the threads engage the shaft because a compliant layer is attached to the shaft.

Abstract: A bar of soap or soap dispensing container "bar", whereby teeth or ridges are formed into the product such that as it is rubbed on the body, the contact pressure causes the teeth to lightly bend the skin at a number of points creating a series of waves in the skin which move along the surface of the skin as the soap is moved, thereby creating a traveling wave which acts to help remove dirt and dead skin particles and create a pleasant massaging effect, wherein the teeth forms are shaped to provide transverse and lateral strength in the product so it will not easily break, and so that it can be stacked for more dense shipping and better handling.