Patents by Inventor Alexander M. Derrickson

Alexander M. Derrickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11152496
    Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including: a semiconductor base on a first portion of a raised region of an insulative layer; a first inner emitter/collector (E/C) material on a second portion of the raised region of the insulative layer, wherein the inner E/C material is directly horizontally between the semiconductor base and a sidewall of the raised region; and a first outer E/C material on a first non-raised region of the insulative layer, wherein an upper portion of the first outer E/C material is adjacent the first inner E/C material.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: October 19, 2021
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Jagar Singh, Alexander L. Martin, Alexander M. Derrickson
  • Publication number: 20210242335
    Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including: a semiconductor base on a first portion of a raised region of an insulative layer; a first inner emitter/collector (E/C) material on a second portion of the raised region of the insulative layer, wherein the inner E/C material is directly horizontally between the semiconductor base and a sidewall of the raised region; and a first outer E/C material on a first non-raised region of the insulative layer, wherein an upper portion of the first outer E/C material is adjacent the first inner E/C material.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 5, 2021
    Inventors: Jagar Singh, Alexander L. Martin, Alexander M. Derrickson