Abstract: Disclosed herein are transparent articles and methods and systems for processing transparent articles. Systems for processing transparent articles, e.g. cutting glass, may include at least one initial laser and at least one polarizing beam splitter, where the polarizing beam splitter is configured to split an initial laser beam into a plurality of laser beams, and wherein the plurality of laser beams are useful for processing transparent articles. Methods for processing transparent articles comprise creating at least one flaw in the transparent articles with a plurality of laser beams.

Abstract: Methods of making a glass-based article including a surface feature thereon. Methods include arranging a glass-based substrate relative to a laser. Methods also include irradiating the glass-based substrate with laser beam with a light wavelength from about 2500 nm to about 3000 nm to grow a surface feature thereon.

Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: A glass container including a body having a delamination factor less than or equal to 10 and at least one marking is described. The body has an inner surface, an outer surface, and a wall thickness extending between the outer surface and the inner surface. The marking is located within the wall thickness. In particular, the marking is a portion of the body having a refractive index that differs from a refractive index of an unmarked portion of the body. Methods of forming the marking within the body are also described.

Abstract: A laser-welded, sealed electronic device housing and related systems and methods are provided. The sealed housing includes a first substrate having a first surface and a second substrate having a second surface facing the first surface. The sealed housing includes a recess formed in the first substrate. The recess faces the second surface such that the second surface and the recess define a chamber. A laser weld bonds the first surface to the second surface, and the laser weld surrounds the chamber. A functional film is supported by at least one of the first surface and the second surface, and the functional film extends from the chamber and across the laser weld. In exemplary arrangements the device is an OLED device and the functional film form conductive leads in communication with the OLED.

Abstract: A glass container including a body having a delamination factor less than or equal to 10 and at least one marking is described. The body has an inner surface, an outer surface, and a wall thickness extending between the outer surface and the inner surface. The marking is located within the wall thickness. In particular, the marking is a portion of the body having a refractive index that differs from a refractive index of an unmarked portion of the body. Methods of forming the marking within the body are also described.

Abstract: A method of forming a strengthened glass article is provided. The method includes providing a strengthened glass article. The strengthened glass article is in the form of a container including a sidewall having an exterior surface and an interior surface that encloses an interior volume. The sidewall has an exterior strengthened surface layer that includes the exterior surface, an interior strengthened surface layer that includes the interior surface and a central layer between the exterior strengthened surface layer and the interior strengthened surface layer that is under a tensile stress. A laser-induced intended line of separation is formed in the central layer at a predetermined depth between the exterior strengthened surface layer and the interior strengthened surface layer by irradiating the sidewall with a laser without separating the glass article.

Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: The optical-electrical interconnection device comprises a glass support member with front-end and back-end portions that define a plane and an aperture. A cantilever member extends from the back-end portion into the aperture. The cantilever member supports an interconnection optical waveguide. The cantilever member comprises a bend region that causes a front-end section of the cantilever member to extend out of the plane. The front-end section is flexible, which allows for the interconnection optical waveguide to be aligned and optically coupled to a device waveguide of an optical-electrical device. A photonic assembly is formed using the optical-electrical interconnection device and at least one optical-electrical device. Methods of forming optical and electrical interconnections using the optical-electrical interconnection device are also disclosed.

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Abstract: A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 ?m, and the inorganic particle layer has an average thickness of less than or equal to 5 ?m.

Abstract: A glass article having a glass bump formed integrally thereon by laser-irradiation methods. The glass bump includes a lower region connected to an upper region by an inflection region. The lower region projects from a surface of the glass article and is defined by concavely rounded sides with a radius of curvature R1. The upper region includes a transition portion and a top portion. The transition portion is defined by convexly rounded sides with a radius of curvature R2. The transition portion connects to the lower portion via the inflection region. The upper portion connects to the transition portion and is defined by a convexly rounded top surface with a radius of curvature R3, which is greater than radius of curvature R2.

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((?tensile stress location)/(?interface laser weld))<<1 or <1 and ?interface laser weld>10 MPa or >1 MPa where ?tensile stress location is the stress present in the first substrate and ?interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Abstract: A glass article having a dimpled glass bump formed integrally thereon by laser-irradiation methods. The glass bump includes a lower region connected to an upper region by an inflection region. The lower region projects from a surface of the glass article and is defined by concavely rounded sides with a radius of curvature R1. The upper region includes a transition portion and a top surface. The transition portion is defined by convexly rounded sides with a radius of curvature R2. The transition portion connects to the lower portion via the inflection region. The upper portion connects to the transition portion and is defined by a concavely rounded top portion between convexly rounded top portions.

Abstract: Assemblies, optical connectors, and methods for forming fiber arrays using laser bonded optical fibers are disclosed. In one embodiment, a method of forming a fiber array includes placing an optical fiber on a surface of a substrate, directing a laser beam into the optical fiber disposed on the surface of the substrate, melting, using the laser beam, a material of the substrate to create a first laser bond zone between the optical fiber and the surface of the substrate, applying an adhesive to the optical fiber and the substrate to create an adhesive bond zone between the optical fiber and the surface of the substrate, and cutting the optical fiber and the substrate to create a first section of the fiber array and a second section of the fiber array.

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Abstract: Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.

Abstract: Assemblies, optical connectors, and methods for forming fiber arrays using laser bonded optical fibers are disclosed. In one embodiment, a method of forming a fiber array includes placing an optical fiber on a surface of a substrate, directing a laser beam into the optical fiber disposed on the surface of the substrate, melting, using the laser beam, a material of the substrate to create a first laser bond zone between the optical fiber and the surface of the substrate, applying an adhesive to the optical fiber and the substrate to create an adhesive bond zone between the optical fiber and the surface of the substrate, and cutting the optical fiber and the substrate to create a first section of the fiber array and a second section of the fiber array.

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

Abstract: A method for forming features in transparent dielectric materials is described. The method includes laser micromachining of a transparent dielectric material. The transparent dielectric material is in contact with a liquid containing a fluorinated compound. Features formed by the method have low surface roughness and highly uniform linear dimensions.