Patents by Inventor Alfons Dehe
Alfons Dehe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11275059Abstract: An apparatus for in-situ calibration of a photoacoustic sensor is provided. The apparatus includes a calibration unit that includes at least one processor configured to calculate calibration information. A light emitter of the photoacoustic sensor is configured to emit an electromagnetic spectrum and the photoacoustic sensor is configured to provide at least two measurement signals based on at least two electromagnetic spectra. The calibration unit is configured to compare the at least two measurement signals to obtain the calibration information and apply the calibration information to the photoacoustic sensor to perform the in-situ calibration.Type: GrantFiled: December 2, 2019Date of Patent: March 15, 2022Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Juergen Woellenstein
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Patent number: 11267698Abstract: A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.Type: GrantFiled: October 11, 2018Date of Patent: March 8, 2022Assignee: INFINEON TECHNOLOGIES AGInventors: Horst Theuss, Alfons Dehe
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Publication number: 20220057320Abstract: The invention relates to a modulatable infrared emitter comprising an aperture structure, a structured micro-heating element, and an actuator, wherein the aperture structure and the structured micro-heating element are movable relative to each other in parallel planes by means of the actuator to modulate the intensity of emitted infrared radiation. The invention further relates to methods of manufacturing the infrared emitter, a method of modulating emission of infrared radiation using the infrared emitter, and preferred uses of the infrared emitter. In further aspects the invention relates to a system comprising the infrared emitter and a control device for regulating the actuator.Type: ApplicationFiled: September 13, 2019Publication date: February 24, 2022Inventors: Alfons Dehé, Achim Bittner, Daniel Biesinger
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Publication number: 20220042852Abstract: The invention relates to a modulatable infrared emitter comprising a MEMS heating element and an actuator, wherein the actuator triggers shape and/or structure changes of the MEMS heating element. Said change in shape and/or structure of the MEMS heating element may vary the ratio of the emitting area to the total area, thereby producing a change in intensity of the emitted infrared beam. The invention further relates to a manufacturing method for the infrared emitter, a method for modulated emission of infrared radiation using the infrared emitter, and preferred uses of the infrared emitter. In further preferred aspects the invention relates to a system comprising the infrared emitter and a control device for regulating the actuator.Type: ApplicationFiled: September 13, 2019Publication date: February 10, 2022Inventors: Alfons Dehé, Achim Bittner, Daniel Biesinger
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Patent number: 11237090Abstract: A sensor element includes a membrane structure suspended on a frame structure, wherein the membrane structure includes a membrane element and an actuator. The membrane structure is deflectable in a first stable deflection state and in a second stable deflection state and is operable in a resonance mode in at least one of the first and the second stable deflection states. The actuator is configured to deflect the membrane structure in a first actuation state into one of the first and the second stable deflection states, and to operate the membrane structure in a second actuation state in a resonance mode having an associated resonance frequency.Type: GrantFiled: March 3, 2020Date of Patent: February 1, 2022Assignee: INFINEON TECHNOLOGIES AGInventors: Michael Schneider, Alfons Dehe, Manuel Dorfmeister, Christoph Glacer, Ulrich Krumbein, Ulrich Schmid, David Tumpold
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Patent number: 11211298Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.Type: GrantFiled: October 16, 2019Date of Patent: December 28, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
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Patent number: 11161735Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.Type: GrantFiled: April 16, 2020Date of Patent: November 2, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Johann Strasser, Alfons Dehe, Gerhard Metzger-Brueckl, Juergen Wagner, Arnaud Walther
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Publication number: 20210323813Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 ?m into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.Type: ApplicationFiled: June 24, 2021Publication date: October 21, 2021Inventors: Gunar Lorenz, Alfons Dehe, Marc Fueldner, Bernd Goller, Ulrich Krumbein, Andreas Wiesbauer
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Publication number: 20210285866Abstract: A gas sensor includes a multi-wafer stack of a plurality of layers and a measurement chamber. The plurality of layers includes a first layer comprising a sensor element that has a microelectromechanical system (MEMS) membrane; and a second layer comprising an emitter element configured to emit electromagnetic radiation. The measurement chamber is interposed between the first layer and the second layer. The measurement chamber is configured to receive a measurement gas and further receive the electromagnetic radiation emitted by the emitter element as the electromagnetic radiation travels along a radiation path from a first end of the measurement chamber to a second end of the measurement chamber that is opposite to the first end.Type: ApplicationFiled: June 2, 2021Publication date: September 16, 2021Applicants: Infineon Technologies AG, Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.Inventors: Stefan KOLB, Alfons DEHE, Jochen HUBER, Franz JOST, Horst THEUSS, Wilhelm WIEDMEIER, Juergen WOELLENSTEIN
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Patent number: 11117798Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 ?m into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.Type: GrantFiled: February 7, 2019Date of Patent: September 14, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Gunar Lorenz, Alfons Dehe, Marc Fueldner, Bernd Goller, Ulrich Krumbein, Andreas Wiesbauer
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Patent number: 11115755Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.Type: GrantFiled: January 31, 2020Date of Patent: September 7, 2021Assignee: Infineon Technologies AGInventors: Alfons Dehe, Stefan Barzen, Marc Fueldner
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Patent number: 11092538Abstract: A gas sensor includes a multi-wafer stack of a plurality of layers and a measurement chamber. The plurality of layers includes a first layer comprising a sensor element that has a microelectromechanical system (MEMS) membrane; and a second layer comprising an emitter element configured to emit electromagnetic radiation. The measurement chamber is interposed between the first layer and the second layer. The measurement chamber is configured to receive a measurement gas and further receive the electromagnetic radiation emitted by the emitter element as the electromagnetic radiation travels along a radiation path from a first end of the measurement chamber to a second end of the measurement chamber that is opposite to the first end.Type: GrantFiled: July 31, 2020Date of Patent: August 17, 2021Inventors: Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Horst Theuss, Wilhelm Wiedmeier, Juergen Woellenstein
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Patent number: 11067542Abstract: Photoacoustic gas sensor having a light pulse emitter, a microphone in a reference gas housing having a reference gas, and a sample gas housing to be filled with a gas to be analyzed. A wall separates the sample gas housing from the reference gas housing, and has a transparent region that is transparent to light within a frequency range of emitted light pulses. Remaining inner walls of the sample gas housing have a reflecting surface that reflect light pulses emitted by the emitter so that a portion of the light pulses not absorbed by the gas to be analyzed pass through the transparent region into the reference gas volume. The microphone generates a sensor signal indicating information on an acoustic wave caused by the light pulses interacting with the reference gas after crossing the gas to be analyzed.Type: GrantFiled: November 18, 2019Date of Patent: July 20, 2021Assignee: Infineon Technologies AGInventors: Alfons Dehe, Stefan Kolb, Horst Theuss
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Patent number: 11053117Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the couType: GrantFiled: March 17, 2020Date of Patent: July 6, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Marc Fueldner, Stefan Barzen, Alfons Dehe, Gunar Lorenz
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Patent number: 10926999Abstract: In accordance with an embodiment, a microelectromechanical transducer includes a displaceable membrane having an undulated section comprising at least one undulation trough and at least one undulation peak and a plurality of piezoelectric unit cells. At least one piezoelectric unit cell is provided in each case in at least one undulation trough and at least one undulation peak, where each piezoelectric unit cell has a piezoelectric layer and at least one electrode in electrical contact with the piezoelectric layer. The membrane may be formed as a planar component having a substantially larger extent in a first and a second spatial direction, which are orthogonal to one another, than in a third spatial direction, which is orthogonal to the first and the second spatial direction and defines an axial direction of the membrane.Type: GrantFiled: August 14, 2019Date of Patent: February 23, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Christian Bretthauer, Alfons Dehe, Alfred Sigi
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Patent number: 10927002Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.Type: GrantFiled: May 3, 2019Date of Patent: February 23, 2021Assignee: INFINEON TECHNOLOGIES AGInventor: Alfons Dehe
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Publication number: 20210040942Abstract: A MEMS pump includes a basis structure, a membrane structure opposing the basis structure and being deflectable parallel to a surface normal of the basis structure and includes a pump chamber between the basis structure and the membrane structure wherein a volume of the pump chamber is based on a position of the membrane structure with respect to the basis structure. The MEMS pump includes a passage for letting a fluid pass into the pump chamber or exit the pump chamber, wherein the passage is arranged in-plane with respect to the pump chamber. The MEMS pump includes a valve structure coupled to the passage for connecting, in a first state, the passage to a first outer volume and for connecting, in a second state, the passage to a second outer volume.Type: ApplicationFiled: July 7, 2020Publication date: February 11, 2021Inventors: Martin Seidl, Alfons Dehe, Daniel Fruechtl, Wolfgang Klein, Ulrich Krumbein, Johann Strasser, Matthias Vobl
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Patent number: 10913656Abstract: A method for sealing an access opening to a cavity comprises the following steps: providing a layer arrangement having a first layer structure and a cavity arranged adjacent to the first layer structure, wherein the first layer structure has an access opening to the cavity, performing a CVD layer deposition for forming a first covering layer having a layer thickness on the first layer structure having the access opening, and performing an HDP layer deposition with a first and second substep for forming a second covering layer on the first covering layer, wherein the first substep comprises depositing a liner material layer on the first covering layer, wherein the second substep comprises partly backsputtering the liner material layer and furthermore the first covering layer in the region of the access opening, and wherein the first and second substeps are carried out alternately and repeatedly a number of times.Type: GrantFiled: October 16, 2018Date of Patent: February 9, 2021Assignee: Infineon Technologies AGInventors: Gerhard Metzger-Brueckl, Alfons Dehe, Uwe Hoeckele, Johann Strasser, Arnaud Walther
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Patent number: 10880629Abstract: A device for detecting acoustic waves may include a housing having a housing wall with an inner surface, and an acoustic wave sensor provided at least partially inside the housing and configured to detect acoustic waves. The inner surface of the housing wall is made in at least half of its entire area of a thermally insulating material.Type: GrantFiled: December 14, 2018Date of Patent: December 29, 2020Assignee: Infineon Technologies AGInventors: Alfons Dehe, David Tumpold, Gueclue Onaran
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Publication number: 20200355602Abstract: A gas sensor includes a multi-wafer stack of a plurality of layers and a measurement chamber. The plurality of layers includes a first layer comprising a sensor element that has a microelectromechanical system (MEMS) membrane; and a second layer comprising an emitter element configured to emit electromagnetic radiation. The measurement chamber is interposed between the first layer and the second layer. The measurement chamber is configured to receive a measurement gas and further receive the electromagnetic radiation emitted by the emitter element as the electromagnetic radiation travels along a radiation path from a first end of the measurement chamber to a second end of the measurement chamber that is opposite to the first end.Type: ApplicationFiled: July 31, 2020Publication date: November 12, 2020Applicants: Infineon Technologies AG, Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.Inventors: Stefan KOLB, Alfons DEHE, Jochen HUBER, Franz JOST, Horst THEUSS, Wilhelm WIEDMEIER, Juergen WOELLENSTEIN