Abstract: In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelepiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members which are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accommodate insertion of the package between them and yet adjust themselves into desirable broad-area abutments with those surfaces.

Abstract: Heat sinks of the type which are fitted onto electronic solid-state devices to maintain acceptable thermal equilibrium conditions are provided with solderable sheet-metal appendages or studs staked onto their relatively cooler portions by way of punching which deforms and flows the heat-sink material into and through shaped openings so as to create sound mechanical interlocking. The studs are oriented for projection through a printed-circuit board, along with leads from the associated electronic device, for wave-soldering into rigidly-secured relation to the board.

Abstract: In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accomodate insertion of the package between them and yet adjust themselves into abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members.

Abstract: Auxiliary heat-sink attachments which promote dissipation of heat from electronic solid-state devices and the like are secured with such devices and with associated printed-circuit boards by way of accessory fastenings with which they form a sub-assembly wave-solderable in pre-spaced relation to the board.