Abstract: A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.

Abstract: In one embodiment, a fluid ejector structure includes: a chamber; a bridge spanning at least part of the chamber; a channel through which fluid may enter the chamber; a fluid ejector element on the bridge; and an outlet through which fluid may be ejected from the chamber at the urging of the fluid ejector element. The outlet is disposed opposite the fluid ejector element across a depth of the chamber and the chamber, ejector element and outlet are configured with respect to one another such that substantially all of the fluid in the chamber is ejected through the outlet upon actuation of the ejector element.

Abstract: A printhead (10) for use in an inkjet printing process includes a substrate (12) having at least one ink feed opening (14) defined therein, an ink chamber (16) in operative and fluid communication with the ink feed opening(s) (14), and a nozzle plate (18) disposed on a portion (P1) of the substrate (12). The nozzle plate (18) has a plurality of orifices (20) defined therein. The printhead (10) further includes a firing resistor (22) disposed on another portion (P2) of the substrate (12) and proximate to the ink feed opening(s) (14) and a barrier structure (24) disposed on the other portion (P2) of the substrate (12) and positioned adjacent to the firing resistor (22).

Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

Abstract: An inkjet printhead (100) and a method (200) of supplying viscous ink employ a central ink feed channel (130). The inkjet printhead (100) includes a bridge beam (110) that supports an ejector element (106), a pair of lateral ink feed channels (120) adjacent to the bridge beam (110), and a central ink feed channel (130) through the ejector element (106) and bridge beam (110). The pair of lateral ink feed channels (120) and the central ink feed channel (130) connect between an ink reservoir (140) below the bridge beam (110) and the bubble expansion chamber (104). The method (200) includes providing (210) a central ink feed channel in a bridge beam of a printhead and flowing (220) viscous ink from an ink reservoir through a combination of the provided central ink feed channel and a pair of lateral ink feed channels.

Abstract: A fluid ejection device includes a thin film heater resistor portion having a heater resistor, and a two-layer structure disposed over the heater resistor. The two-layer structure includes a top layer and a bottom layer, with the top layer having a hardness that is at least 1.5 times greater than the hardness of the bottom layer.

Abstract: An inkjet printhead (100) and a method (200) of supplying viscous ink employ a central ink feed channel (130). The inkjet printhead (100) includes a bridge beam (110) that supports an ejector element (106), a pair of lateral ink feed channels (120) adjacent to the bridge beam (110), and a central ink feed channel (130) through the ejector element (106) and bridge beam (110). The pair of lateral ink feed channels (120) and the central ink feed channel (130) connect between an ink reservoir (140) below the bridge beam (110) and the bubble expansion chamber (104). The method (200) includes providing (210) a central ink feed channel in a bridge beam of a printhead and flowing (220) viscous ink from an ink reservoir through a combination of the provided central ink feed channel and a pair of lateral ink feed channels.

Abstract: A printhead (10) for use in an inkjet printing process includes a substrate (12) having at least one ink feed opening (14) defined therein, an ink chamber (16) in operative and fluid communication with the ink feed opening(s) (14), and a nozzle plate (18) disposed on a portion (P1) of the substrate (12). The nozzle plate (18) has a plurality of orifices (20) defined therein. The printhead (10) further includes a firing resistor (22) disposed on another portion (P2) of the substrate (12) and proximate to the ink feed opening(s) (14) and a barrier structure (24) disposed on the other portion (P2) of the substrate (12) and positioned adjacent to the firing resistor (22).

Abstract: Contact printing can be used to form electrically active micro-features on a substrate. An ink formulation containing an oxide precursor is used to form the micro-features, which are heat cured to form oxides. Various precursors are illustrated which can be used to form conducting, insulating, and semiconductor micro-features.

Abstract: A thermal inkjet printhead and a method of cooling convectively cool the printhead with ink passing through a feed transition chamber. The thermal inkjet printhead includes a bridge beam and feed channels adjacent to the bridge beam. The printhead further includes a feed transition chamber between inputs to the feed channels and an ink reservoir. The ink flows through the feed transition chamber between the ink reservoir and the feed channels to convectively cool. The method of cooling includes providing the feed transition chamber and flowing ink through the feed transition chamber from the ink reservoir to the feed channels. The flowing ink establishes a temperature gradient between walls of the feed transition chamber and the ink. The temperature gradient facilitates convective cooling of the printhead.

Abstract: In one embodiment, a fluid ejector structure includes: a chamber; a bridge spanning at least part of the chamber; a channel through which fluid may enter the chamber; a fluid ejector element on the bridge; and an outlet through which fluid may be ejected from the chamber at the urging of the fluid ejector element. The outlet is disposed opposite the fluid ejector element across a depth of the chamber and the chamber, ejector element and outlet are configured with respect to one another such that substantially all of the fluid in the chamber is ejected through the outlet upon actuation of the ejector element.

Abstract: A method of fabricating a bridge beam of an inkjet printhead employs a cavity formed under the bridge beam and an etch-stop layer that limits a back-surface recess formation. The method includes forming a cavity that connects between a bottom of a pair of trenches in and extending from a front surface of a substrate and depositing an etch-stop layer at a bottom of the cavity. The method further includes forming a recess in a back surface of the substrate, the recess exposing the etch-stop layer and the etch-stop layer limiting a depth of the formed recess. The method further includes removing the exposed etch-stop layer to connect the cavity and the recess, the bridge beam being a portion of the substrate above the formed cavity and between the trenches.

Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.

Abstract: A self-aligning nanowire includes a nanowire portion and an aligning member attached to the nanowire portion. The aligning member interacts with another aligning member on an adjacent self-aligning nanowire to align the nanowires together. A method of aligning nanowires includes providing a plurality of the self-aligning nanowires, suspending the plurality in a carrier solution, and depositing the suspended plurality on a substrate. An ink formulation includes the plurality of suspended self-aligning nanowires in the carrier solution. A method of producing the self-aligning nanowire includes providing and associating the nanowire portion and the aligning member such that the nanowire produced is self-aligning with another nanowire.

Abstract: A method of forming a three-dimensional object comprises ejecting drops of liquefied material into a vat using an ejector; scanning the ejector in first and second mutually opposed directions to induce the drops of liquefied material from the ejector to deposit and solidify in a predetermined sequence to sequentially form layers of the three-dimensional object; supplying a viscous liquid into the vat to a level which is essentially level with the top of a most recently formed layer of the three-dimensional object; and raising the level of the viscous liquid in accordance with the formation of new layers.

Abstract: A fabrication process, including forming one or more layers on at least a sidewall of a topographical feature of a substantially planar substrate, the sidewall being substantially orthogonal to the substrate; and planarizing respective portions of the one or more layers to form a planar surface substantially parallel to the substrate, wherein the planar surface includes respective co-planar surfaces of the one or more layers, at least one of the surfaces having a dimension determined by a thickness of the corresponding layer.

Abstract: A fuel cell uses porous metal layers attached on a flex substrate for delivery of liquid fuel to the active catalytic areas on the anodic side. The flex substrate may form an enclosed package such that the liquid fuel can be contained in the enclosed volume and the air can freely exchange with the cathode side of the fuel cell without the need of microchannels and plumbing for mass transporting both fuel and oxygen to the active catalytic area. The porous metal provides a large surface are for the catalytic reaction to occur.

Abstract: Image development methods, hard imaging devices, and image members are described. According to one embodiment, an image development method includes providing an image member comprising a surface having different portions of different electrical conductivities, wherein one of the portions defines an imaging pattern of an image, providing a development agent comprising a plurality of electrically charged image particles and a plurality of electrically charged charge directors over the image member, providing an electrical field proximate the image member having the development agent over the image member, and using the electrically charged charge directors and the electric field, directing the electrically charged image particles to the one of the portions of the surface of the image member to develop the image.

Abstract: A metal-coated, wire-reinforced polymer electrolyte membrane that is permeable only to protons and hydrogen is disclosed. The metal-coated, wire-reinforced polymer electrolyte membrane has a surface microsturcture that prevents cracking of the metal coating during hydration. The metal-coated, wire-reinforced polymer electrolyte membrane can be used in liquid-type fuel cells to prevent crossover of fuel, gas and impurities.

Abstract: An ink formulation of a circuit element includes a first powder having a first melting temperature, a second powder having a second melting temperature that is higher than the first melting temperature, and a polymer binder. A method of fabricating a circuit element on a substrate employs the ink formulation and includes depositing the ink formulation on a substrate, curing the polymer binder, and melting the first powder at the first melting temperature to yield a solid solution that forms the circuit element.