Patents by Inventor Alfred I-Tsung Pan

Alfred I-Tsung Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6707479
    Abstract: Apparatus and methods of printing on an electrically writable medium are disclosed. In one aspect, a printer for printing on an electrically writable medium includes a print head and a biasing system. The print head has multiple solenoid-actuated print wires that are operable to reciprocate toward and away from the medium. The biasing system is coupled to the print head and is operable to apply through print wires extended toward the medium an electric field greater than a threshold electric field needed to reorient switchable display elements in a localized region of the medium.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: March 16, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alfred I-Tsung Pan, Steven Rosenberg
  • Publication number: 20040033312
    Abstract: A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on the open-structure substrate. The coating paste is then sintered to form a porous layer on the surface of the open-structure substrate. Optionally, the porous coating may be further coated with a catalyst for fuel cell applications.
    Type: Application
    Filed: August 15, 2003
    Publication date: February 19, 2004
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20040028973
    Abstract: A metal-coated, wire-reinforced polymer electrolyte membrane that is permeable only to protons and hydrogen is disclosed. The metal-coated, wire-reinforced polymer electrolyte membrane has a surface microsturcture that prevents cracking of the metal coating during hydration. The metal-coated, wire-reinforced polymer electrolyte membrane can be used in liquid-type fuel cells to prevent crossover of fuel, gas and impurities.
    Type: Application
    Filed: August 7, 2002
    Publication date: February 12, 2004
    Inventors: Alfred I-Tsung Pan, Yoocham Jeon
  • Publication number: 20040013930
    Abstract: A fuel cell uses porous metal layers attached on a flex substrate for delivery of liquid fuel to the active catalytic areas on the anodic side. The flex substrate may form an enclosed package such that the liquid fuel can be contained in the enclosed volume and the air can freely exchange with the cathode side of the fuel cell without the need of microchannels and plumbing for mass transporting both fuel and oxygen to the active catalytic area. The porous metal provides a large surface are for the catalytic reaction to occur.
    Type: Application
    Filed: July 10, 2003
    Publication date: January 22, 2004
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030235737
    Abstract: Metal-coated polymer electrolyte membranes that are permeable to protons and hydrogen, and methods of manufacturing thereof are disclosed. The metal-covered polymer electrolyte membranes are capable of maintaining the proton and hydrogen permeability in a humidified environment. The metal-coated polymer electrolyte membranes can be used as proton exchange membranes in liquid-type fuel cells to prevent fuel, gas and impurity crossover.
    Type: Application
    Filed: June 19, 2002
    Publication date: December 25, 2003
    Inventors: Yoocharn Jeon, Alfred I-Tsung Pan
  • Patent number: 6659592
    Abstract: An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: December 9, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hubert Allen Vander Plas, Barry Craig Snyder, Ron Allen Hellekson, Alfred I-Tsung Pan
  • Patent number: 6656526
    Abstract: A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on the open-structure substrate. The coating paste is then sintered to form a porous layer on the surface of the open-structure substrate. Optionally, the porous coating may be further coated with a catalyst for fuel cell applications.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: December 2, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030211371
    Abstract: Fuel delivery system and method for delivering liquid fuel to an electrode in a liquid-type fuel cell are disclosed. The liquid fuel is passively delivered to a reaction surface of an electrode by capillary force through a porous structure. The porous structure has a shape and a capillary force distribution to facilitate fuel flow, and can be part of a fuel cartridge for easy transportation and storage of fuel.
    Type: Application
    Filed: May 9, 2002
    Publication date: November 13, 2003
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030194600
    Abstract: A method of enhancing catalyst reactivity includes (1) depositing a conductive oxide on a suitable substrate, (2) depositing a thin film of catalyst on top of the conductive oxide to form a sandwich structure, and (3) annealing the structure at a, suitable temperature so that the thin film of catalyst forms nano structure hillocks that enhance the catalyst reactivity. An improved fuel cell may use an anode or cathode, or both, formed according to the above method. Such an anode or cathode will include a catalyst nano hillock structure formed on top of a conductive material layer.
    Type: Application
    Filed: April 10, 2002
    Publication date: October 16, 2003
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030186108
    Abstract: An electrolyte for a fuel cell includes an electrolyte body, a plurality of microstructures formed into or extending out of the electrolyte body, and thin film layers formed on the electrolyte body. A microstructure possesses a depth or a height and includes one or more sidewalls and a bottom surface. A sidewall of the microstructure advantageously creates a significant unobstructed diffusion area, wherein protons may travel laterally into or out of the electrolyte body. Therefore, when a proton is generated by the interaction of the fuel with a thin film catalyst layer, the proton may travel laterally only a short distance in order to enter or exit the electrolyte body, thereby improving the performance of the fuel cell.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 2, 2003
    Inventors: Yoocharn Jeon, Alfred I-Tsung Pan
  • Patent number: 6620542
    Abstract: A fuel cell uses porous metal layers attached on a flex substrate for delivery of liquid fuel to the active catalytic areas on the anodic side. The flex substrate may form an enclosed package such that the liquid fuel can be contained in the enclosed volume and the air can freely exchange with the cathode side of the fuel cell without the need of microchannels and plumbing for mass transporting both fuel and oxygen to the active catalytic area. The porous metal provides a large surface are for the catalytic reaction to occur.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: September 16, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Alfred I-Tsung Pan
  • Patent number: 6588095
    Abstract: A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet head device and a flexible tape circuit connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection is electrophoretically plated with a polymer to protect it against corrosive damage by coupling the exposed conductive connection to a first voltage potential and immersing it into an electrophoretic polymer solution in contact with an electrode at a second voltage potential thereby establishing a current between the electrode and the exposed connection such that the exposed connection is coated with a thin film of polymer of uniform thickness.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: July 8, 2003
    Assignee: Hewlett-Packard Development Company, LP.
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030064258
    Abstract: A method of enhancing performance of liquid-type fuel cells by adding additives to the liquid fuel. For example, hemoglobin, surfactants, oxygen scavengers, and chelating agents, may be added to the fuel to resolve problems such as CO poisoning of catalyst, wettability of electrodes, and electrode poisoning, and therefore enhance the performance of the fuel cell. The additives may be added individually based on needs, or mixed in a desired ratio for a given type of fuel cell. The additives may be used on a regular basis to improve fuel efficiency and prolong the life span of the fuel cells. The additives may also be pre-packed for field use when high quality fuel is not available.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 3, 2003
    Inventors: Alfred I-Tsung Pan, Eric G. Hanson
  • Patent number: 6536875
    Abstract: An actuator apparatus, process of forming thereof, and method of actuation are described in which a flexible member having opposing surface electrodes positioned between two substrates having opposing surface electrodes is caused to move by charging and discharging the opposing flexible member electrodes during first and second operative cycles.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: March 25, 2003
    Assignee: Hewlett-Packard Development Company
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030054149
    Abstract: A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on the open-structure substrate. The coating paste is then sintered to form a porous layer on the surface of the open-structure substrate. Optionally, the porous coating may be further coated with a catalyst for fuel cell applications.
    Type: Application
    Filed: September 20, 2001
    Publication date: March 20, 2003
    Inventor: Alfred I-Tsung Pan
  • Patent number: 6533391
    Abstract: A system for precision self-alignment of multiple modules on an alignment substrate is disclosed. An alignment substrate includes a plurality of self-alignment features having a first profile formed in along a mounting surface thereof. A plurality of module substrates are mounted on the alignment substrate. Each module substrate includes an alignment key having a second profile formed along a base surface of the module substrate. The second profile of the alignment key complements the first profile of the self-alignment features. The module substrates are mounted on the alignment substrate by inserting their respective alignment keys into the self-alignment features so the alignment keys and the self-alignment features are connected in mating engagement with each other. As a result, the module substrates are positioned in near perfect self-alignment with each other with substantially no skew.
    Type: Grant
    Filed: October 24, 2000
    Date of Patent: March 18, 2003
    Assignee: Hewlett-Packard Development Company, LLP
    Inventor: Alfred I-Tsung Pan
  • Patent number: 6530649
    Abstract: A carrier includes a substrate formed to accept microelectronic chips at various pockets in the substrate. The microelectronic chips are hermetically sealed within the substrate by a deposition process using localized energy supplied at gaps between the chips and the pockets. During the heating process, seal material is deposited in the gaps to form the hermetic seals.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: March 11, 2003
    Assignee: Hewlett-Packard Company
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030035025
    Abstract: A carrier includes a substrate formed to accept microelectronic chips at various pockets in the substrate. The microelectronic chips are hermetically sealed within the substrate by a deposition process using localized energy supplied at gaps between the chips and the pockets. During the heating process, seal material is deposited in the gaps to form the hermetic seals.
    Type: Application
    Filed: August 16, 2001
    Publication date: February 20, 2003
    Inventor: Alfred I-Tsung Pan
  • Publication number: 20030035027
    Abstract: An apparatus incorporating multiple electrical interconnects extending through a substrate (e.g., a silicon wafer), and a method of forming the same. The electrical interconnects convey electrical signals through the substrate to structures mounted on the front side of the substrate. A conductive layer can be used to selectively distribute the electrical signals to the structures. Accordingly, it is not necessary to route electrical signals to the front side of the substrate in order to convey the signals to the structures. A structure can be coupled to multiple electrical interconnects in order to convey electrical signals along redundant paths through the substrate to the structure, improving reliability should one of the electrical interconnects fail.
    Type: Application
    Filed: August 16, 2001
    Publication date: February 20, 2003
    Inventors: Hubert Allen Vander Plas, Barry Craig Snyder, Ron Allen Hellekson, Alfred I-Tsung Pan
  • Publication number: 20030007035
    Abstract: A passivation layer for a thermal ink jet printhead is provided. The material of the passivation layer can be a Co-based alloy with 25-30 wt % Cr or an Fe-based alloy with ≦10 wt. % Co, ≦20 wt. % Cr, ≦10 wt. % Mn. The passivation layer is amorphous and the surface is substantially atomically smooth or has a controlled surface roughness. The passivation layer displays resistance to cavitation and chemical corrosion and is conformally disposed over a resistor by sputtering or other physical vapor deposition techniques.
    Type: Application
    Filed: June 6, 2001
    Publication date: January 9, 2003
    Inventor: Alfred I-Tsung Pan