Abstract: A three-dimensional interconnect system is disclosed. The interconnect system electrically connects electrical devices that are disposed on different physical planes. The interconnect system includes a plurality of contiguously interconnected electrically conductive droplets such as solder ball droplets produced by a print-on-demand solder jet system. An interconnect is formed by repeatedly ejecting the conductive droplets along a predetermined path between components to be connected. Each ejected droplet is disposed adjacent to another ejected droplet to form a contiguously linked chain of droplets that bridge a physical gap between the components. A non-conductive coating can be deposited on the interconnect to protect the interconnect from damage and to encase the interconnect. The electrical resistance of the interconnect can be reduced by reflowing the droplets that form the interconnect, whereby the coating that encses the interconnect is operative to maintain the shape of the interconnect after reflow.

Abstract: A fuel cell uses porous metal layers attached on a flex substrate for delivery of liquid fuel to the active catalytic areas on the anodic side. The flex substrate may form an enclosed package such that the liquid fuel can be contained in the enclosed volume and the air can freely exchange with the cathode side of the fuel cell without the need of microchannels and plumbing for mass transporting both fuel and oxygen to the active catalytic area. The porous metal provides a large surface are for the catalytic reaction to occur.

Abstract: A method, and structure formed thereof, for processing an exposed conductive connection between an thermal inkjet head device and a flexible tape circuit connectable to control signals for driving the inkjet device. According to the method of processing, the exposed conductive connection is electrophoretically plated with a polymer to protect it against corrosive damage by coupling the exposed conductive connection to a first voltage potential and immersing it into an electrophoretic polymer solution in contact with an electrode at a second voltage potential thereby establishing a current between the electrode and the exposed connection such that the exposed connection is coated with a thin film of polymer of uniform thickness.

Abstract: A method and apparatus for assembling an inkjet printhead is disclosed. The apparatus comprises one or more microheater resistors and a material, which can be reflowed by use of the heat generated by the microheater, disposed proximate to the heater resistor. The microheater resistor comprises a heater resistor with an input port and an output port. A first electrical conductor, coupled to the input port of the heater resistor, receives a first voltage and a second electrical conductor, coupled to the output port of the heater resistor, receives a second voltage. A curing effect in the adhesive is produced by heat generated in the heater resistor when electrical current flows through the resistor in response to an application of a first voltage to the first electrical conductor and a second voltage to the second electrical conductor.

Abstract: A self-aligned interconnect significantly reduces manufacturing costs and provides important advantages in a number of specific applications begins with a single crystal substrate. The substrate is machined to accept microelectronic chips at various locations (openings) along the substrate. Corresponding chips are constructed to precisely fit the openings in the crystal substrate. To ensure precision fit, both the substrate and the chip are etched along the same crystal plane. As a result, the chips can be placed in the openings in the substrate with perfect or nearly perfect alignment in the x and y directions without expensive alignment tools. In effect, the chips and the substrate are self aligned.

Abstract: A carrier frame having an aperture and a nozzle plate disposed on the carrier frame and positioned over the aperture is described. The nozzle plate has at least one nozzle formed between opposing surfaces of the nozzle plate. The carrier frame and the nozzle plate are made from materials having dissimilar thermal expansion coefficients such that the carrier frame has a thermal expansion coefficient that is less than the thermal expansion coefficient of the nozzle plate. The nozzle plate is staked to the carrier frame and then baked so that the nozzle plate shrinks during the baking process thereby becoming taught and under a state of tensile stress. The nozzle is formed in the nozzle plate after the baking process by laser ablation, for example. The nozzle thus formed has a true bore due to the taught nozzle plate and the opposed surfaces of the nozzle plate being parallel to each other.

Abstract: Precision alignment of one or more parts on a common carrier is described. A self-aligned common carrier includes a carrier substrate having one or more pockets formed in the substrate. Each pocket includes a side profile formed in the pocket. A chip having an identical side profile that complements the side profile in the pocket is mounted to the carrier substrate by inserting the chip into the pocket. The complementary side profiles result in near perfect self-alignment between the chip and at least two orthogonal planes of the carrier substrate. The chip and the carrier substrate can be made from a single crystal semiconductor material and the side profiles can be formed by anisotropic etch process that selectively etches the chip and the substrate along a predetermined crystalline plane. The chip and the carrier substrate can be single crystal silicon having a (100) crystalline orientation and the side profiles can be formed by selectively etching the silicon along a (111) crystalline plane.

Abstract: A component for a printhead of an inkjet printer includes a flexible substrate and oxide island heat barriers. The oxide islands allow the flexible substrate to be bent without cracking the oxide islands, a problem which otherwise occurs when the heat barrier is a continuous oxide layer. Thin film resistors are supported on the oxide islands and front conductors are connected to back conductors by vias. The flexible substrate can be folded to form monolithic assemblies or the flexible substrate can be bent around a pen body. Discrete heat-spread layers of titanium are provided between the oxide islands and a chromium adhesion layer on the substrate.

Abstract: A metal jet, metal deposition system has metal jets disposed in an oxygen-free chamber. The metal jets eject droplets of a wetting metal onto conductors on an electrical substrate followed by solder metal. Banks of metal jets can be used to print conductors onto the electrical substrate.

Abstract: The present invention is a method of treating foam for improving wettability. The method includes treating foam with reactive species which interact to produce reaction products. The reaction products are then removed from foam. Finally, after removing reaction products the foam is treated with reactive species which interact to produce additional reaction products.

Abstract: A valve device is incorporated within a printhead of an ink-jet pen for regulation of ink flow and pressure within the printhead. The valve device includes a valve member comprising a resiliently deformable flap positioned in an ink channel, adjacent a firing chamber. The flap is deflectable into and out of a position to regulate ink flow and pressure both to and from the ink firing chambers.

Abstract: A solder drop ejector is disclosed where a current through liquid solder in a channel flows in a direction opposite to the direction of current through a fixed conductor insulated from the channel. The magnetic fields generated repulse the solder toward an orifice to eject a droplet of solder. The dielectric layer separating the fixed conductor and the solder is formed of a film. The film may be made extremely thin, such as 0.1 microns, so that the necessary repulsion force generated by the oppositely flowing currents may be achieved with relatively low driving currents of 10-200 amperes. The thin dielectric film is not molded and is not required to provide mechanical support to a channel wall. Hence, the manufacturing of the resulting solder jet printhead is simplified and its reliability is improved.

Abstract: A substrate for the print head of an ink jet printer includes a plastic base, a metallization layer overlying the plastic base, and a dielectric structure overlying the metallization layer. A thin film resistor is deposited over the substrate, as required. Preferred materials include polyimide plastic for the base, chromium for the metallization layer, and a bilayer construction of silicon dioxide overlying titanium for the dielectric structure.

Abstract: A monolithic thermal ink jet printhead is presented. This monolithic structure makes page-width array thermal ink jet printheads possible. The monolithic structure can be manufactured by standard integrated circuit and printed circuit processing techniques. A nickel-plating process constructs a nozzle on top of resistors, thereby eliminating adhesion and alignment problems. A rigid substrate supports a flexible cantilever beam upon which the resistors are constructed. The cantilever beam, together with the ink itself, buffers the impact of cavitation forces during bubble collapsing and results in a better resistor reliablility. The monolithic printhead allows a smoother ink supply since the ink is fed directly from the backside to the resistor through an opening in the rigid substrate. The orifice structure is constructed by a self-aligned, two-step plating process which results in compound bore shape nozzles.