Abstract: Embodiments of this disclosure include methods of chucking and de-chucking a substrate. A method of chucking a substrate to a surface of an electrostatic chuck includes applying a first voltage to a chucking electrode in the ESC during a chucking time interval, supplying an inert gas at a first pressure to a backside of the substrate during the chucking time interval, applying a second voltage to the chucking electrode in the ESC after the chucking time interval, the second voltage being higher than the first voltage, and supplying the inert gas at a second pressure to the backside of the substrate after the chucking time interval, the second pressure being higher than the first pressure of the inert gas.

Abstract: The disclosure relates to a substrate support assembly for reducing the evacuation time when using argon gas. In one embodiment, a substrate support assembly includes a porous plug within the substrate support assembly. The porous plug includes a first cylindrical section with a first volume and axial length, a second cylindrical section with a second volume and axial length. The first cylindrical section has a larger volume than the second cylindrical section. The first cylindrical section and second cylindrical section have a volume ratio between about 2 and about 12. The first cylindrical section axial length and second cylindrical section axial length have a length ratio between about 2 and about 10.

Abstract: The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.

Abstract: A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.

Abstract: Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.

Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.

Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.

Abstract: Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 M?.

Abstract: One method includes temporarily sealing and isolating a portion of a wellbore with a reusable sealing and isolation element, performing a fracturing process in the portion of the wellbore that is isolated, and after the fracturing process is complete, unsealing or de-isolating the portion of the wellbore by temporarily changing a configuration of the reusable sealing and isolation element. Use of the reusable sealing and isolation element may reduce, or eliminate, the need for remediation operations, such as the removal of sealing plugs.

Abstract: A method and apparatus for determining the temperature of a substrate within a processing chamber are described herein. The methods and apparatus described herein utilize an etalon assembly and a heterodyning effect to determine a first temperature of a substrate. The first temperature of the substrate is determined without physically contacting the substrate. A separate temperature sensor also measures a second temperature of the substrate and/or the substrate support at a similar location. The first temperature and the second temperature are utilized to calibrate one of the temperature sensors disposed within the substrate support, a model of the processes performed within the processing chamber, or to adjust a process parameter of the process performed within the processing chamber.

Abstract: The present disclosure generally relates to substrate processing methods, such as etching methods with noble gases at low temperatures. In an aspect, the method includes exposing a substrate, a first layer comprising a gas, and a fluorine-containing layer to energy to form a passivation layer while maintaining the substrate at conditions encompassing a triple point temperature of the gas, the substrate positioned in a processing region of a processing chamber. The method further includes etching the substrate with ions.

Abstract: The present invention relates to a system for monitoring a non-static clinical scenario, preferably a surgical field, such that different elements of interest can be located throughout the entire clinical event; in particular, a high-precision monitoring and distinction of critical biological tissues, such as nerves or blood vessels, is sought.

Abstract: A network bridge for a lighting system is disclosed. For one example, a lighting system includes an inter-integrated circuit (I2C) cable, a light emitting diode (LED) driver, and wireless module coupled to the LED driver by way of the I2C cable. The LED driver is configured to control one or more LED light sources. The wireless module includes an antenna configured to receive a message according to any number of a plurality of wireless communication protocols. The wireless module is configured to process the message into an I2C data frame and to deliver the I2C data frame to the LED driver via the I2C cable, and the LED driver is configured to control a lighting application or one or more LED light sources based on an I2C data frame. The message can be a wireless communication protocol message such as a ZigBee message, Bluetooth message or WiFi message.

Abstract: A method for etching silicon at cryogenic temperatures is provided. The method includes forming an inert layer from condensation of a noble gas at cryogenic temperatures on exposed surfaces such as the sidewalls of a feature to passivate the sidewalls prior to the etching process. The method further includes flowing a fluorine-containing precursor gas into the chamber to form a fluorine-containing layer on the inert layer. The method further includes exposing the fluorine-containing layer and the inert layer to an energy source to form a passivation layer on the exposed portions of the substrate and exposing the substrate to ions to etch the substrate.

Abstract: A network bridge for a lighting system is disclosed. For one example, a lighting system includes an inter-integrated circuit (I2C) cable, a light emitting diode (LED) driver, and wireless module coupled to the LED driver by way of the I2C cable. The LED driver is configured to control one or more LED light sources. The wireless module includes an antenna configured to receive a message according to any number of a plurality of wireless communication protocols. The wireless module is configured to process the message into an I2C data frame and to deliver the I2C data frame to the LED driver via the I2C cable, and the LED driver is configured to control a lighting application or one or more LED light sources based on an I2C data frame. The message can be a wireless communication protocol message such as a ZigBee message, Bluetooth message or WiFi message.

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

Abstract: In one example, an apparatus includes a body, a propulsion system configured to move the body in a forward direction and in a reverse direction, and a reusable sealing and isolation element connected to the body and configured to be deployed so as to selectively seal and isolate sections or stages in a wellbore when the apparatus is disposed in the wellbore. The reusable sealing element may be selectively employed to isolate, and de-isolate, a portion of the wellbore, such as in connection with a perforation process for example.

Abstract: The present disclosure concerns an adjustable mammal leg brace comprising: an elongated brace support having a lower portion and a longitudinal direction; a hoof-supporting base engaged with the lower portion of the elongated brace support and extending rearwardly therefrom; and at least one leg-abutting block comprising a leg-receiving surface and being engaged with the elongated brace support above the hoof-supporting base, the at least one leg-abutting block being at least one of pivotably mounted to and translatable along the elongated brace support. It also concerns a brace-receiving stand to receive and support a horse leg brace, comprising: a supporting base having a ground-contacting surface; and a brace-receiving portion pivotably mounted to the supporting base and having a brace-receiving surface. It also concerns a mammal leg brace assembly comprising such an adjustable mammal leg brace and a brace receiving stand, and a kit for forming the same.

Abstract: Systems, methods, and computer-readable media for protecting distributed data are provided. The data is distributed according to a time-based shard distribution scheme that splits data into multiple pieces to prevent an attacker who successfully breaches a terminal device from reassembling the pieces.