Abstract: Systems, methods, and computer-readable media for protecting distributed data are provided. The data is distributed according to a time-based shard distribution scheme that splits data into multiple pieces to prevent an attacker who successfully breaches a terminal device from reassembling the pieces.

Abstract: Systems, methods, and computer-readable media for protecting distributed data are provided. The data is distributed according to a time-based shard distribution scheme that splits data into multiple pieces to prevent an attacker who successfully breaches a terminal device from reassembling the pieces.

Abstract: A method for etching silicon at cryogenic temperatures is provided. The method includes forming an inert layer from condensation of a noble gas at cryogenic temperatures on exposed surfaces such as the sidewalls of a feature to passivate the sidewalls prior to the etching process. The method further includes flowing a fluorine-containing precursor gas into the chamber to form a fluorine-containing layer on the inert layer. The method further includes exposing the fluorine-containing layer and the inert layer to an energy source to form a passivation layer on the exposed portions of the substrate and exposing the substrate to ions to etch the substrate.

Abstract: Systems, methods, and computer-readable media for protecting cryptographic keys are provided. Each cryptographic key is divided into multiple shares for storage at remote locations and for storage on a local device.

Abstract: An electrical connector for a substrate support assembly is disclosed herein. The electrical connector includes a first interface body, and a second interface body coupled to the first interface body and to a third interface body. The second interface body is circumscribed by the third interface body. The first interface body and the second interface body each comprise a plurality of electrical terminals disposed in sockets formed in the respective first and second interface bodies, each electrical terminal disposed in sockets of the first interface body coupled to a respective one of the electrical terminals disposed in sockets of the second interface body to form a plurality of isolated conductive electrical unions, wherein the second interface body includes a plurality of protruding sidewalls that extend into the first interface body between each of the electrical terminals of the first interface body.

Abstract: A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate, and a connector coupled to the ground plate that houses a portion of the fluid conduit. The connector includes a biasing assembly and a fastener disposed in a pocket formed in the ground plate.

Abstract: A network bridge for a lighting system is disclosed. For one example, a lighting system includes an inter-integrated circuit (I2C) cable, a light emitting diode (LED) driver, and wireless module coupled to the LED driver by way of the I2C cable. The LED driver is configured to control one or more LED light sources. The wireless module includes an antenna configured to receive a message according to any number of a plurality of wireless communication protocols. The wireless module is configured to process the message into an I2C data frame and to deliver the I2C data frame to the LED driver via the I2C cable, and the LED driver is configured to control a lighting application or one or more LED light sources based on an I2C data frame. The message can be a wireless communication protocol message such as a ZigBee message, Bluetooth message or WiFi message.

Abstract: A network bridge for a lighting system is disclosed. For one example, a lighting system includes an inter-integrated circuit (I2C) cable, a light emitting diode (LED) driver, and wireless module coupled to the LED driver by way of the I2C cable. The LED driver is configured to control one or more LED light sources. The wireless module includes an antenna configured to receive a message according to any number of a plurality of wireless communication protocols. The wireless module is configured to process the message into an I2C data frame and to deliver the I2C data frame to the LED driver via the I2C cable, and the LED driver is configured to control a lighting application or one or more LED light sources based on an I2C data frame. The message can be a wireless communication protocol message such as a ZigBee message, Bluetooth message or WiFi message.

Abstract: Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 M?.

Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.

Abstract: Systems, methods, and computer-readable media for protecting distributed data are provided. The data is distributed according to a time-based shard distribution scheme that splits data into multiple pieces to prevent an attacker who successfully breaches a terminal device from reassembling the pieces.

Abstract: A method for etching silicon at cryogenic temperatures is provided. The method includes forming an inert layer from condensation of a noble gas at cryogenic temperatures on exposed surfaces such as the sidewalls of a feature to passivate the sidewalls prior to the etching process. The method further includes flowing a fluorine-containing precursor gas into the chamber to form a fluorine-containing layer on the inert layer. The method further includes exposing the fluorine-containing layer and the inert layer to an energy source to form a passivation layer on the exposed portions of the substrate and exposing the substrate to ions to etch the substrate.

Abstract: An electrochemical sensor comprising first and second electrodes. The first electrode has a molecular imprinted polymer (MIP) immobilised thereon and the MIP comprises a redox label and is imprinted with an analyte. The disclosure also provides methods of producing such sensors, methods of detecting and determining the concentration of analytes and the use of the electrochemical sensors for the detection of analytes.

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

Abstract: Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.

Abstract: Embodiments include processing equipment. A processing system having an optical temperature measurement subsystem is described. In an example, the optical temperature measurement subsystem includes a light source to direct an excitation light into a process chamber, and a photosensitive array to detect a response light received from the process chamber. The detected light can be monitored to determine a temperature of a substrate mounted within the process chamber. Other embodiments are also described and claimed.

Abstract: A driver for a lighting device includes: a lighting driver configured to drive LED(s) of the lighting device in a first mode of operation when a primary power source is available and provided to the lighting driver and to control power output and/or final output current utilizing a backup or other secondary power source during an emergency mode of operation. In example embodiments and implementations, the lighting driver includes a single instance of a LED driver (e.g., only one LED driver circuit) configured to drive LED(s) of the lighting device during both modes of operation.

Abstract: LED driver apparatus and methods may include a sensing circuit for adjusting an output based on either a pulse width modulation dimming control or an analog dimming control. An LED driver apparatus and methods may also include a sensor for a parameter such as temperature and for recording such parameter, for example as a function of time. A setting unit for an LED driver apparatus can be used to sense and/or adjust settings in the LED apparatus even when the LED apparatus is not independently powered.

Abstract: Embodiments include processing equipment. A processing system having an optical temperature measurement subsystem is described. In an example, the optical temperature measurement subsystem includes a light source to direct an excitation light into a process chamber, and a photosensitive array to detect a response light received from the process chamber. The detected light can be monitored to determine a temperature of a substrate mounted within the process chamber. Other embodiments are also described and claimed.