Patents by Inventor An-Cheng Chen

An-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984489
    Abstract: A semiconductor structure includes a first device and a second device. The first device includes: a first gate structure formed over an active region and a first air spacer disposed adjacent to the first gate structure. The second device includes: a second gate structure formed over an isolation structure and a second air spacer disposed adjacent to the second gate structure. The first air spacer and the second air spacer have different sizes.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Hsiu Liu, Feng-Cheng Yang, Tsung-Lin Lee, Wei-Yang Lee, Yen-Ming Chen, Yen-Ting Chen
  • Patent number: 11984488
    Abstract: Methods and devices that include a multigate device having a channel layer disposed between a source feature and a drain feature, a metal gate that surrounds the channel layer, and a first air gap spacer interposing the metal gate and the source feature and a second air gap spacer interposing the metal gate and the drain feature. A backside contact extends to the source feature. A power line metallization layer is connected to the backside contact.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Guan-Lin Chen, Kuo-Cheng Chiang, Shi Ning Ju, Chih-Hao Wang, Kuan-Lun Cheng
  • Patent number: 11984465
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Patent number: 11980864
    Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
  • Publication number: 20240150906
    Abstract: An electrolytic cell includes a cation exchange membrane, a cathode compartment, and an anode compartment. The cathode compartment includes a gas diffusion electrode and a flow channel element, in which the flow channel element is between the cation exchange membrane and the gas diffusion electrode, and has a plurality of flow channels arranged in parallel with each other. The anode compartment includes an anode mesh, in which the cation exchange membrane is between the anode mesh and the flow channel element. A distance between the anode mesh and the gas diffusion electrode is substantially equal to the sum of a first thickness of the cation exchange membrane and a second thickness of the flow channel element. The novel electrolytic cell can combine with a chloralkali electrolytic cell to deal with gaseous CO2 and produce products, e.g., synthesis gas, for other purposes.
    Type: Application
    Filed: May 9, 2023
    Publication date: May 9, 2024
    Inventors: Hao-Ming CHEN, Tai-Lung CHEN, Wan-Tun HUNG, Yu-Cheng CHEN, Kuo-Ming HUANG, Fu-Da YEN, Che-Jui LIAO
  • Publication number: 20240151304
    Abstract: For a manual gearshift control of conventional vehicle transmission, a vehicle gearshift automatic control device including a first actuator module, a second actuator module and an electronic control unit, is provided in an add-on manner to retrofit the vehicle transmission with both automatic and manual gearshift functions. In an automatic gearshift mode, the electronic control unit executes the vehicle gearshift automatic control method and receives an automatic gearshift command to drive the first actuator module to push a shift lever to implement a lateral shift selection, or to drive the second actuator module to spin a park lever to implement a longitudinal gearshift. For vehicle security, whenever a vehicle gearshift automatic control device failure or a manual gearshift intervention is detected in the automatic gearshift mode, the electronic control unit shuts off the automatic gearshift mode and switches to a manual gearshift mode to perform the manual gearshift function.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 9, 2024
    Inventors: Shao-Yu Lee, Zeng-Lung Huang, Bing-Ren Chen, Jia-Cheng Ke
  • Publication number: 20240152193
    Abstract: The invention provides a power supply including at least one power output port, at least one status alert component, and at least one output port status monitoring module. The status alert component generates at least one visual prompt based on an alert signal. The output port status monitoring module includes at least one temperature sensor adjacent to the power output port, a microcontroller connected to the temperature sensor and sensing an output current from the power output port, and a reset signal generator connected to the microcontroller. The microcontroller comprises at least one port status alert condition that takes a temperature and the output current of the power output port as decision factors. The microcontroller outputs the alert signal to the status alert component when the port status alert condition is met and maintains the status until a reset signal provided by the reset signal generator is received.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: Wei-Chen WU, Wen-Hau HU, Hung-Wei YANG, Cheng-Yung LO, Yu-Hao SU, Jian-Zhi HUANG
  • Publication number: 20240148129
    Abstract: A mobile device attachment adapted for a mobile device and a container for food or liquid is provided. The mobile device attachment includes a magnetic connecting member and a connecting member. The magnetic connecting member is selectively magnetically connected to the mobile device and adapted to extend in an escaping direction. The connecting member is disposed between the container and the magnetic connecting member. The mobile device has an image capturing range. When the magnetic connecting member extends in the escaping direction, the container, the magnetic connecting member and the connecting member are located outside the image capturing range. Besides, a container including the mobile device attachment is also provided.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: CHING-FU WANG, CHING-YU WANG, CHE-WEI HSU, JUI-CHEN LU, CHENG-CHE HO
  • Publication number: 20240151346
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.
    Type: Application
    Filed: June 9, 2023
    Publication date: May 9, 2024
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Publication number: 20240151948
    Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Inventors: Cheng-Chen LIN, Hsin-Hsuan HUANG, Shu-Yun YANG
  • Publication number: 20240154016
    Abstract: A device includes a first nanostructure; a second nanostructure over the first nanostructure; a first high-k gate dielectric disposed around the first nanostructure; a second high-k gate dielectric being disposed around the second nanostructure; and a gate electrode over the first high-k gate dielectric and the second high-k gate dielectric. A portion of the gate electrode between the first nanostructure and the second nanostructure comprises a first portion of a p-type work function metal filling an area between the first high-k gate dielectric and the second high-k gate dielectric.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Inventors: Hsin-Yi Lee, Ji-Cheng Chen, Cheng-Lung Hung, Chi On Chui
  • Publication number: 20240152253
    Abstract: The present disclosure generally relates to managing user interface sharing. A computer system receives a representation of a first user interface template that specifies an arrangement of user interface elements. The computer system receiving a request to use the first user interface template for a respective computer system that includes a plurality of installed applications. The computer system initiates a process for creating a user interface for the respective computer system using the first user interface template. The process includes, in accordance with a determination that a first application is not available on the respective computer system, displaying an alert indicating that the first application needs to be installed on the respective computer system. The process includes, in accordance with a determination that the first application is available on the respective computer system, forgoing displaying the alert.
    Type: Application
    Filed: December 11, 2023
    Publication date: May 9, 2024
    Inventors: Aurelio GUZMAN, Giovanni M. AGNOLI, Matthew BIDDULPH, Edward CHAO, Kevin Will CHEN, Jamie CHENG, Kevin M. LYNCH, Yiqiang NIE, Grant PAUL, Cezar Mihai RADU
  • Publication number: 20240153824
    Abstract: A method includes forming a stack of channel layers and sacrificial layers over a substrate, patterning the stack to form a fin-shape structure, and recessing a portion of the fin-shape structure to form a recess. A top surface of the substrate under the recess is covered at least by a bottommost sacrificial layer of the stack. The method also includes forming inner spacers on terminal ends of the sacrificial layers that are above the bottommost sacrificial layer, depositing an undoped layer in the recess, and forming a doped epitaxial feature over the undoped layer. The undoped layer covers terminal ends of a bottommost channel layer of the stack. The doped epitaxial feature covers terminal ends of the channel layers that are above the bottommost channel layer.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Ting-Yeh CHEN, Wei-Yang LEE, Po-Cheng WANG, De-Fang CHEN, Chao-Cheng CHEN
  • Publication number: 20240152172
    Abstract: An overshoot-free fast start-up bandgap reference circuit (100), a chip, and an electronic device. The bandgap reference circuit (100) comprises a bias current generating unit (101) and a reference core unit (102), wherein an output end of the bias current generating unit (101) is connected to an input end of the reference core unit (102), the bias current generating unit (101) generates a bias current (IBIAS) unrelated to the voltage of a power supply and having a zero temperature coefficient, the bias current (IBIAS) is an input signal of the reference core unit (102), and the reference core unit (102) generates a pre-charging current on the basis of the input bias current (IBIAS) and implements overshoot-free fast start-up by means of employing pre-charging.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: VANCHIP (TIANJIN) TECHNOLOGY CO., LTD.
    Inventors: Cheng CHEN, Chunling LI, Yongshou WANG, Chenyang GAO
  • Publication number: 20240153895
    Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.
    Type: Application
    Filed: April 19, 2023
    Publication date: May 9, 2024
    Inventors: Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU, Shun-Kuan LIN, Ping-tzu CHEN
  • Publication number: 20240155185
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 9, 2024
    Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
  • Publication number: 20240153979
    Abstract: A method of manufacturing an image sensor structure includes forming an isolation structure in a substrate to divide the substrate into a first region and a second region, forming a first light sensing region in the first region and a second light sensing region in the second region, forming a first gate structure over the first light sensing region and a second gate structure over the second light sensing region, forming gate spacers on sidewalls of the first and second gate structures, and depositing a blocking layer on sidewalls of the gate spacers. The blocking layer has an opening positioned between the first and second gate structures. A source/drain structure is formed directly under the opening in the blocking layer. The method also includes forming an interlayer dielectric layer over the first and second gate structures and the blocking layer.
    Type: Application
    Filed: April 13, 2023
    Publication date: May 9, 2024
    Inventors: Wei Long CHEN, Wen-I HSU, Feng-Chi HUNG, Jen-Cheng LIU, Dun-Nian YAUNG
  • Publication number: 20240153840
    Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 9, 2024
    Inventors: Shin-Puu JENG, Po-Yao LIN, Feng-Cheng HSU, Shuo-Mao CHEN, Chin-Hua WANG
  • Publication number: 20240154469
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Publication number: 20240154022
    Abstract: A method for manufacturing a semiconductor device includes forming a first fin structure and a second fin structure, wherein an isolation region is located between the fin structures, and wherein a space is located between the fin structures and above the isolation region; depositing a blocking layer over the first fin structure, the isolation region, and the second fin structure, wherein an upper portion of the blocking layer is located above the first fin structure and the second fin structure, and wherein a lower portion of the blocking layer fills the space located between the first fin structure and the second fin structure; removing the upper portion of the blocking layer; and while the lower portion of the blocking layer remains over the isolation region, performing an etch process to recess the first fin structure and the second fin structure.
    Type: Application
    Filed: February 7, 2023
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chieh Ho, Po-Cheng Wang, De-Fang Chen, Chao-Cheng Chen