Abstract: A visual inspection method of a curved object executed by a visual inspection system. The visual inspection system includes a robotic arm, a camera mounted at a tail end of the robotic arm, a fixing unit mounted under the camera, and a control unit electrically connected to the robotic arm and the camera. Specific steps of the visual inspection method of the curved object are described hereinafter. Fix a curved object which is to be inspected by the fixing unit. Capture the object which is to be inspected with a plurality of groups of preset parameters by the camera. Use the control unit to calculate a better shooting parameter. Use the better shooting parameter by the camera to proceed with visual inspections of the curved objects which are to be inspected in batches.

Abstract: Disclosed is a memory cell including a first transistor having a first terminal coupled to a bit line; a second transistor having a first terminal coupled to a bit line bar; a weight storage circuit coupled between a gate terminal of the first transistor and a gate terminal of the second transistor, storing a weight value, and determining to turn on the first transistor or the second transistor according to the weight value; and a driving circuit coupled to a second terminal of the first transistor, a second terminal of the second transistor, and at least one word line, receiving at least one threshold voltage and at least one input data from the word line, and determining whether to generate an operation current on a path of the turned-on first transistor or the turned-on second transistor according to the threshold voltage and the input data.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: Provided is a projection device, including a casing, a light source module, an optical engine module, a projection lens, and a fan. The casing includes a right cover plate and a baffle opposite to each other, and a lower cover plate adjacent to the right cover plate. The baffle divides the casing into first and second areas. The right and lower cover plates respectively have first and second air outlets adjacent to each other and located in the second area. The light source module, the optical engine module, located on a light transmission path of the light source module, the projection lens, connected to the optical engine module, and the fan, adjacent to the baffle, are disposed in the first area of the casing. The projection device is placed in a first or second state, and hot airflow therein flows out from the first or second air outlet.

Abstract: A polymer and a light-emitting device employing the same are provided. The polymer includes a first repeat unit with a structure represented by Formula (I): wherein the definitions of R1, R2, A1, A2, A3, and Z1 and n are as defined in the specification. At least one of A1, A2, and A3 is not hydrogen.

Abstract: A method for automatically measuring a handover performance in a multi-cell environment includes: by a base station device, transmitting a radio frequency (RF) signal; rotating by one full rotation; receiving a first measurement dataset from a user equipment (UE); obtaining a first trigger value and a second trigger value based on the first measurement dataset, and calculating a third trigger value based on the second trigger value and a preset third event offset value; transmitting a plurality of RF signals; rotating by a preset angle with a preset angular velocity; receiving a second measurement dataset from the UE; transmitting a command to the UE to perform a handover process; and measuring a plurality of results associated with the handover process. The results include a handover time during which the handover process is implemented and completed, and a success rate of the handover process.

Abstract: A sliding table device includes a base unit, a sliding unit and a cover plate. The sliding unit includes two rails, two sliding blocks disposed respectively and slidably on the rails and each having an oil inlet, and a sliding seat mounted co-movably on the sliding blocks. The sliding seat includes a main portion having a flow passage and an insertion hole that interconnects the flow passage and external environment, two fixed portions mounted respectively to the sliding blocks and each having a connecting passage that communicates with the flow passage, and two guiding portions formed respectively on the fixed portions and each having a guiding passage that communicates with the corresponding connecting passage and the corresponding oil inlet. The cover plate covers a portion of the main portion, and the insertion hole is not covered by the cover plate.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A video processing circuit includes an input buffer, an online adaptation circuit, and an artificial intelligence (AI) super-resolution (SR) circuit. The input buffer receives input low-resolution (LR) frames and high-resolution (HR) frames from a video source over a network. The online adaptation circuit forms training pairs, and calculates an update to representative features that characterize the input LR frames using the training pairs. Each training pair formed by one of the input LR frames and one of the HR frames. The AI SR circuit receives the input LR frames from the input buffer and the representative features from the online adaptation circuit. Concurrently with calculating the update to the representative features, the AI SR circuit generates SR frames for display from the input LR frames based on the representative features. Each SR frame has a higher resolution than a corresponding one of the input LR frames.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: A motor for an electric cylinder includes a motor body, an encoder, a rotor coupling portion and an encoder fixing portion. The motor body includes a rotor having a shaft hole through which a rotating shaft extends. The encoder is installed on the motor body and includes a fixing ring fixed on the rotating shaft, a magnet holder combined with the fixing ring, an encoder magnet mounted on the magnet holder, and a magnetic sensor opposite to the encoder magnet. The magnet holder is rotatable relative to the fixing ring to adjust the magnetic pole position of the encoder magnet relative to the magnetic sensor. The rotor coupling portion is arranged on the rotor and fixed to the rotating shaft at a first corresponding position. The encoder fixing portion is arranged on the fixing ring and fixed with the rotating shaft at a second corresponding position.

Abstract: A sliding table includes a sliding seat having a seat body made from a first material and disposed between two main rigid rails parallel with each other. The seat body has two opposite rail recesses opening toward the main rigid rails, and two inner cyclic track holes disposed between the rail recesses. Two seat body rigid rails made from a second material harder than the first material are fixed in the rail recesses to confront the main rigid rails. Two roller belt modules are arranged in two cyclic track members overmolded to the seat body. When the seat body moves along the main rigid rails, each roller belt module circulates along one of the cyclic track members.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A mechanical device includes a worm and two swing units disposed in a housing. Each swing unit has a pivot member and a swing member meshing with the worm. The swing member has an arcuate cam slot that has a first end and a second end. A rail is fixed to the housing above the swing units and the worm. Two sliders are connected to the swing units. Each slider has a slide block engaging the rail, an extension arm, and a protrusion protruding from the extension arm and inserted into the arcuate cam slot to slide between the first and second ends of the arcuate cam slot when the worm drives the swing member to swing.

Abstract: A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected to the lower encapsulated semiconductor device. The upper encapsulated semiconductor device is disposed over the lower encapsulated semiconductor device and includes a sensor die having a pad and a sensing region, an upper encapsulating material at least laterally encapsulating the sensor die, and an upper conductive via extending through the upper encapsulating material and connected to the lower redistribution structure. The upper redistribution structure is disposed over the upper encapsulated semiconductor device. The upper redistribution structure covers the pad of the sensor die and has an opening located on the sensing region of the sensor die.