Abstract: A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected to the lower encapsulated semiconductor device. The upper encapsulated semiconductor device is disposed over the lower encapsulated semiconductor device and includes a sensor die having a pad and a sensing region, an upper encapsulating material at least laterally encapsulating the sensor die, and an upper conductive via extending through the upper encapsulating material and connected to the lower redistribution structure. The upper redistribution structure is disposed over the upper encapsulated semiconductor device. The upper redistribution structure covers the pad of the sensor die and has an opening located on the sensing region of the sensor die.

Abstract: A coil assembly includes coil units connected to a coil base. Each coil unit includes top, intermediate and bottom coil modules, each of which has spaced-apart first and second interaction sides, and two non-interaction sides connected to the first and second interaction sides to form an accommodating space. The first interaction sides of the intermediate and bottom coil modules are juxtaposed with each other in the accommodating space of the top coil module. The second interaction sides of the top and intermediate coil modules are juxtaposed with each other in the accommodating space of the bottom coil module. An ironless motor includes a magnetic rail assembly and the aforesaid coil assembly.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A mechanical device includes a worm and two swing units disposed in a housing. Each swing unit has a pivot member and a swing member meshing with the worm. The swing member has an arcuate cam slot that has a first end and a second end. A rail is fixed to the housing above the swing units and the worm. Two sliders are connected to the swing units. Each slider has a slide block engaging the rail, an extension arm, and a protrusion protruding from the extension arm and inserted into the arcuate cam slot to slide between the first and second ends of the arcuate cam slot when the worm drives the swing member to swing.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A sliding table assembly includes a sliding seat unit slidably mounted to a base unit. Two auxiliary sliding seats are slidably mounted to the base unit and disposed on two sides of the sliding seat unit. A connection member is connected between the auxiliary sliding seats. Two roller sets are respectively mounted to the auxiliary sliding seats. Each roller set has rollers to roll on the base unit. A driving screw rod is coupled to the sliding seat unit and embraced by the auxiliary seats. When the sliding unit is moved by the driving screw rod, it pushes the auxiliary sliding seats to slide together therewith.

Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: The present invention relates to methods for treating patients having cancer or a premalignant or neoplastic condition. It is based, at least in part, on the discovery that a genome editing technique that specifically targets a fusion gene can induce cell death in a cancer cell other than a prostate cancer cell, e.g., a hepatocellular cancer cell, having the fusion gene. The present invention provides methods for treating cancer patients that include performing a genome editing technique targeting a fusion gene present within one or more cells of a subject to produce an anti-cancer effect.

Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.

Abstract: Provided is a projection device, including a casing, a light source module, an optical engine module, a projection lens, and a fan. The casing includes a right cover plate and a baffle opposite to each other, and a lower cover plate adjacent to the right cover plate. The baffle divides the casing into first and second areas. The right and lower cover plates respectively have first and second air outlets adjacent to each other and located in the second area. The light source module, the optical engine module, located on a light transmission path of the light source module, the projection lens, connected to the optical engine module, and the fan, adjacent to the baffle, are disposed in the first area of the casing. The projection device is placed in a first or second state, and hot airflow therein flows out from the first or second air outlet.

Abstract: A sliding table includes a sliding seat having a seat body made from a first material and disposed between two main rigid rails parallel with each other. The seat body has two opposite rail recesses opening toward the main rigid rails, and two inner cyclic track holes disposed between the rail recesses. Two seat body rigid rails made from a second material harder than the first material are fixed in the rail recesses to confront the main rigid rails. Two roller belt modules are arranged in two cyclic track members overmolded to the seat body. When the seat body moves along the main rigid rails, each roller belt module circulates along one of the cyclic track members.

Abstract: An electronic chassis includes a motherboard sled configured to engage in or out of the electronic chassis. The motherboard sled includes a housing and a mechanical actuator for engaging the motherboard sled into or out of an electronic chassis. The mechanical actuator includes at least one lever rotatably coupled to a hinge to form a first fulcrum adjacent to a vertical edge of a front surface of the housing. The mechanical actuator also includes a guiding arm adjacent to the hinge and mechanically connected to the at least one lever to form a second fulcrum. The guiding arm rotates between a secured position adjacent to the front surface and an unsecured position away from the front surface.

Abstract: A slide rail device includes a track member, and a slider unit that includes a slider being slidable along the track member and having a recess which is cooperatively defined by two inner side faces and an inner connecting face connected between the inner side faces, and two block boards fixedly fastened to the inner connecting face. The slide rail device further includes a linear motor unit that includes a rotor connected to the inner connecting face and cooperating with the inner connecting face, the inner side faces and the block boards to define a filling space, and a heat dissipating member that fills the filling space, and that is seamlessly connected between the rotor and the slider unit.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.