Patents by Inventor An-Chi CHENG

An-Chi CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916957
    Abstract: A technique to stop lateral movement of ransomware between endpoints in a VLAN is disclosed. A security appliance is set as the default gateway for intra-LAN communication by overwriting the DHCP responses. Message traffic from compromised endpoints is detected. Attributes of ransomware may be detected in the message traffic, as well as attempts to circumvent the security appliance. Compromised devices may be quarantined. Additionally, the DHCP address assignment may be policed to ensure accuracy and correctness to provide an additional layer of security.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: February 27, 2024
    Assignee: AIRGAP NETWORKS INC.
    Inventors: Raymond Wing Chon Cheh, Chia Chi Cheng, Satish M. Mohan, Ritesh R. Agrawal, Vinay Adavi
  • Patent number: 11916124
    Abstract: A device includes a first nanostructure; a second nanostructure over the first nanostructure; a first high-k gate dielectric disposed around the first nanostructure; a second high-k gate dielectric being disposed around the second nanostructure; and a gate electrode over the first high-k gate dielectric and the second high-k gate dielectric. A portion of the gate electrode between the first nanostructure and the second nanostructure comprises a first portion of a p-type work function metal filling an area between the first high-k gate dielectric and the second high-k gate dielectric.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Yi Lee, Ji-Cheng Chen, Cheng-Lung Hung, Chi On Chui
  • Publication number: 20240063052
    Abstract: A manufacturing method of a gate structure includes the following steps. A semiconductor substrate is provided. An isolation structure is formed in the semiconductor substrate and surrounds an active region in the semiconductor substrate. A gate pattern is formed on the active region and the isolation structure. The gate pattern includes a first gate structure and a first capping layer disposed on the first gate structure. A part of the first capping layer located above an interface between the active region and the isolation structure is removed for exposing a part of the first gate structure located above the interface between the active region and the isolation structure. A removing process is performed for reducing a thickness of the part of the first gate structure located above the interface between the active region and the isolation structure.
    Type: Application
    Filed: September 20, 2022
    Publication date: February 22, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Tzu-Feng Weng, Chao-Sheng Cheng, Chi-Cheng Huang
  • Patent number: 11906596
    Abstract: A device estimates the health of a battery by first collecting measurements of the battery over multiple charging and discharging cycles. Scores are assigned to the measurements according to scoring rules stored in a memory of the device. The device calculates battery based on an average of the measurements, where each measurement has an assigned score greater than a threshold.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: February 20, 2024
    Assignee: MediaTek Inc.
    Inventors: Chi Cheng Liao, Jia-You Chuang, Jui-Chi Wu
  • Patent number: 11908885
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation element over the magnetic element. The i magnetic element is wider than the isolation element. The semiconductor device structure further includes a conductive line over the isolation element.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: February 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Yu Ku, Chi-Cheng Chen, Hon-Lin Huang, Wei-Li Huang, Chun-Yi Wu, Chen-Shien Chen
  • Patent number: 11910525
    Abstract: Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: February 20, 2024
    Assignee: C3 Nano, Inc.
    Inventors: Xiaofeng Chen, Byunghwan Kang, Jackie Chen, Yadong Cao, Vicki Luo, Arthur Yung-Chi Cheng, Andrew Hyeongjoo Moon, Xiqiang Yang, Ajay Virkar
  • Patent number: 11901188
    Abstract: Exemplary methods of patterning a device layer are described, including operations of patterning a protector layer and forming a first opening in a first patterning layer to expose a first portion of the protector layer and a first portion of the hard mask layer, which are then are exposed to a first etch to form a first opening in the first portion of the hard mask layer. A second opening is formed in a second patterning layer to expose a second portion of the protector layer and a second portion of the hard mask layer. The second portion of the protector layer and the second portion of the hard mask layer are exposed to an etch to form a second opening in the second portion of the hard mask layer. Exposed portions of the device layer are then etched through the first opening and the second opening.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Cheng Hung, Chun-Kuang Chen, De-Fang Chen, Wei-Liang Lin, Yu-Tien Shen
  • Patent number: 11896639
    Abstract: The invention relates to methods of evaluating the quality of a batch of an herbal composition, the method comprising subjecting a test batch of the herbal composition to one or more biological analysis methods and comparing the results derived from the test batch to the results of a known batch of herbal composition which has a known in vivo effect.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: February 13, 2024
    Assignee: YALE UNIVERSITY
    Inventor: Yung-Chi Cheng
  • Publication number: 20240043711
    Abstract: Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 8, 2024
    Inventors: Ying-Syi Li, Xiqiang Yang, Yu Kambe, Xiaofeng Chen, Hua Gu, Steven Michael Lam, Melanie Maniko Inouye, Arthur Yung-Chi Cheng, Alex Da Zhang Tan, Christopher S. Scully, Ajay Virkar
  • Publication number: 20240039312
    Abstract: A wireless charging assembly configured to support and charge an electronic device. The wireless charging assembly includes a wireless charging host and a fan device. The wireless charging host includes a housing and a wireless charging assembly. The housing includes a supporting surface and an accommodation space. The supporting surface faces away from the accommodation space. The supporting surface is configured to support the electronic device. The wireless charging assembly is disposed in the accommodation space and configured to charge the electronic device. The fan device includes a casing and a fan. The fan is disposed in the casing. The casing is disposed on a side of the housing. The fan is configured to blow an airflow to the supporting surface.
    Type: Application
    Filed: February 22, 2023
    Publication date: February 1, 2024
    Inventors: Chi-Cheng HSIAO, Ying-Chao Peng
  • Publication number: 20240039307
    Abstract: A wireless charging device is configured to charge two electronic devices. The wireless charging device includes a casing, a wireless charging module and a fan. The casing has an interior space, an air inlet, an air outlet and a support surface. The air inlet and the air outlet are in fluid communication with the interior space. The support surface faces away from the interior space, the support surface has two placement regions, the air inlet is located between the two placement regions, and the two placement regions are configured for the two electronic devices to be placed thereon. The wireless charging module is disposed in the interior space and corresponds to the two placement regions. The fan is disposed in the interior space and configured to suck air into the interior space through the air inlet and blow air out of the interior space through the air outlet.
    Type: Application
    Filed: February 21, 2023
    Publication date: February 1, 2024
    Inventor: Chi-Cheng HSIAO
  • Publication number: 20240039329
    Abstract: A wireless charging device includes a casing, a support pad, a wireless charging module and a fan. The casing has an interior space, an air inlet, an air outlet and a support surface. The air inlet and the air outlet are in fluid communication with the interior space, the support surface faces away from the interior space, and the support surface has a placement region. The support pad is disposed at the placement region. The support pad has a plurality of protrusions to support the electronic device, and the protrusions form a plurality of channels towards the air inlet. The wireless charging module is disposed in the interior space and corresponds to the placement region. The fan is disposed in the interior space and configured to suck air into the interior space through the air inlet and blow air out of the interior space through the air outlet.
    Type: Application
    Filed: February 22, 2023
    Publication date: February 1, 2024
    Inventor: Chi-Cheng HSIAO
  • Publication number: 20240039306
    Abstract: A wireless charging device includes a casing, a wireless charging module and a fan. The casing has an interior space, at least one air inlet, an air outlet and a support surface. The air inlet and the air outlet are in fluid communication with the interior space, the support surface faces away from the interior space. The support surface has at least one placement region, the placement region is located at one side of the air inlet, and the placement region is configured for the electronic device to be placed thereon. The wireless charging module is disposed in the interior space and corresponds to the at least one placement region. The fan is disposed in the interior space and configured to suck air into the interior space through the at least one air inlet and blow air out of the interior space through the air outlet.
    Type: Application
    Filed: February 20, 2023
    Publication date: February 1, 2024
    Inventors: Chi-Cheng HSIAO, Raijin Li
  • Patent number: 11870273
    Abstract: A wireless charging device includes a casing, a circuit board and at least one wireless charging module. The casing includes a bottom plate and a plurality of mounting pillars protruding from the bottom plate. The circuit board includes a substrate and at least one support assembly, and the substrate is stacked on the plurality of mounting pillars. The support assembly includes a plurality of support pillars protruding from the substrate. The wireless charging module includes a mounting frame and a charging coil. The mounting frame has a plurality of first assembling parts. The plurality of first assembling parts are respectively mounted on the plurality of support pillars. The charging coil is disposed on the mounting frame. Projections of the plurality of mounting pillars on the bottom plate at least partially overlap projections of the plurality of support pillars on the bottom plate.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: January 9, 2024
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Chi-Cheng Hsiao
  • Patent number: 11865890
    Abstract: A rocking arm structure includes an arm body, a first wheel assembly connected to the arm body, a second wheel assembly connected to the arm body, and a shaft assembly disposed between the first wheel assembly and the second wheel assembly. The arm body can rotate relative to the main body around the shaft assembly, and drive the first wheel assembly and the second wheel assembly to revolve in a same direction around the shaft assembly. The first wheel assembly and the second wheel assembly are both steering wheel assemblies or both directional wheel assemblies.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: January 9, 2024
    Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Sheng-Li Yen, Chih-Cheng Lee, Chen-Ting Kao, Yu-Cheng Zhang, Chiung-Hsiang Wu, Chang-Ju Hsieh, Chen Chao, Yu-Sheng Chang, Chi-Cheng Wen
  • Patent number: 11861089
    Abstract: A driving circuit configured to drive a touch display panel is provided. The driving circuit includes a signal generating circuit and a sensor driving circuit. The signal generating circuit is configurable to be coupled to gate lines of the touch display panel via a gate control circuit. The signal generating circuit modulates a plurality of voltage signals on a first driving signal and a second driving signal, and provides the modulated first driving signal and the modulated second driving signal to the gate control circuit to drive the gate lines during a sensing period. The sensor driving circuit is configurable to be coupled to sensor pads of the touch display panel. The sensor driving circuit modulates the voltage signals on a third driving signal, and drives the sensor pads with the modulated third driving signal during the sensing period. A method for driving a touch display panel is also provided.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: January 2, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Sheng-Wen Hsiao, Liang-Chi Cheng
  • Publication number: 20230416552
    Abstract: Room temperature processing has successfully resulted in highly conductive coatings formed from silver nanowires with a cellulose binder. The conductive coatings can be formed with silver salts to fuse the silver nanowires into a unitary fused metal nanostructured network. Even without added silver salts, low sheet resistance values can be obtained. Room temperature processing can be effective over a range of transmittance values from highly transparent to modestly transparent to translucent to opaque. The ability to form the transparent coatings opens the processing to a wide range of substrates that are not processible with higher process temperatures.
    Type: Application
    Filed: June 21, 2023
    Publication date: December 28, 2023
    Inventors: Xiqiang Yang, Arthur Yung-Chi Cheng, Michael Fang, Pei-Kang Liu, Ajay Virkar
  • Publication number: 20230411995
    Abstract: A wireless charging device includes a casing, a wireless charging module, and an air-flow generator. The casing includes a housing part and a carrier plate disposed in the housing part to divide internal space of the housing part into a first accommodation space and a second accommodation space. The casing has an air inlet, an air outlet, and an opening. The carrier plate has a through hole. The air inlet, the air outlet, the opening, and the through hole are in fluid communication with the first accommodation space and the second accommodation space. The wireless charging module is located in the first accommodation space for charging a mobile device supported by the carrier plate. The air-flow generator is located in the first accommodation space for creating an airflow flowing through the air inlet, the second accommodation space, the through hole, the first accommodation space, and the air outlet.
    Type: Application
    Filed: September 8, 2022
    Publication date: December 21, 2023
    Inventors: Chi-Cheng Hsiao, Ming-Hung Shih, Juin Yi Wu, Kai-Wen Lu
  • Patent number: 11847077
    Abstract: A serial peripheral interface (SPI) integrated circuit (IC) and an operation method thereof are provided. A SPI architecture includes a master IC and a slave IC. When the SPI IC is a master IC, the SPI IC generates first command information for a slave IC, generates first debugging information corresponding to the first command information, and sends the first command information and the first debugging information to the slave IC through a SPI channel. When the SPI IC is the slave IC, the SPI IC receives second command information and second debugging information sent by the master IC through the SPI channel and checks the second command information by using the second debugging information. When the SPI IC is a target slave circuit selected by the master IC, the SPI IC executes the second command information under a condition that the second command information is checked and is correct.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: December 19, 2023
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Shan-Chieh Wen, Ming-Huai Weng, Guei-Lan Lin, Che-Hao Chiang, Chi-Cheng Lin
  • Patent number: 11847083
    Abstract: The disclosure provides a daisy-chain serial peripheral interface (SPI) integrated circuit (IC) and an operation method thereof. The daisy-chain SPI IC includes a first MISO interface circuit, a second MISO interface circuit, a first data enable (DE) interface circuit, and a second DE interface circuit. When the daisy-chain SPI IC is a target slave circuit selected by a master IC for reading target data, the first DE interface circuit outputs a DE signal to the master IC, and the first MISO interface circuit sends back the target data to the master IC based on the timing of the DE signal. When the daisy-chain SPI IC is not the target slave circuit, the signal received by the second DE interface circuit is transmitted to the first DE interface circuit, and the data received by the second MISO interface circuit is transmitted to the first MISO interface circuit.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: December 19, 2023
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Shan-Chieh Wen, Ming-Huai Weng, Guei-Lan Lin, Che-Hao Chiang, Chi-Cheng Lin